公开(公告)号：US20130336306A1

公开(公告)日：2013-12-19

申请号：US14000185

申请日：2012-02-09

Applicant: Ill Soo Sohn ,  Sung Hyun Choi ,  Seung Min Yoo ,  Hye Won Lee ,  Mun Hwan Choi ,  Yong Ho Seok ,  Ok Hwan Lee

Inventor： Ill Soo Sohn ,  Sung Hyun Choi ,  Seung Min Yoo ,  Hye Won Lee ,  Mun Hwan Choi ,  Yong Ho Seok ,  Ok Hwan Lee

IPC: H04W72/12 ,  H04B7/04

CPC classification number: H04W72/1263 ,  H04B7/0452 ,  H04B7/0877 ,  H04L1/06 ,  H04W84/12

Abstract: A method of communication based on a receive chain control, performed by a receiver, in a wireless local area network is provided. The method includes: receiving a frame from a transmitter, the frame indicating a multi receive chain operation, activating at least one receive chain, each receive chain processing a received signal transmitted through each spatial stream, and receiving at least one data field from the transmitter through the at least one activated receive chain.

Abstract translation: 提供了一种基于由无线局域网中的接收机执行的接收链控制的通信方法。 该方法包括：从发射机接收帧，指示多接收链操作的帧，激活至少一个接收链，每个接收链处理通过每个空间流发送的接收信号，以及从发射机接收至少一个数据场 通过至少一个激活的接收链。

公开(公告)号：US20130058005A1

公开(公告)日：2013-03-07

申请号：US13599034

申请日：2012-08-30

Applicant: Young Joo OH ,  Jung Rag YOON ,  Kyung Min LEE ,  Young Min YOO

Inventor： Young Joo OH ,  Jung Rag YOON ,  Kyung Min LEE ,  Young Min YOO

IPC: H01G4/008 ,  H01G4/005 ,  H01G4/12

CPC classification number: H01G4/005 ,  H01G4/008 ,  H01G4/12 ,  Y02T10/7022

Abstract: Provided is a package type multi-layer thin film capacitor for large capacitance, including: a ceramic sintered body formed with slots on one side and another side thereof, respectively; a plurality of first internal electrode layers formed within the ceramic sintered body; a plurality of second internal electrode layers formed within the ceramic sintered body to be positioned between the plurality of first internal electrode layers; a pair of first main connection electrode members inserted into the slots to be connected to the first internal electrode layers or the second internal electrode layers, respectively; a pair of first main lead members inserted into the slots and to be connected to the first main connection electrode members, respectively; and a sealing member sealing the ceramic sintered body to partially expose each of the pair of first main lead members.

Abstract translation: 提供一种用于大容量的封装型多层薄膜电容器，其包括：分别在一侧和另一侧形成有狭槽的陶瓷烧结体; 形成在陶瓷烧结体内的多个第一内部电极层; 多个第二内部电极层，形成在陶瓷烧结体内，位于多个第一内部电极层之间; 一对第一主连接电极部件分别插入到与第一内部电极层或第二内部电极层连接的槽中; 一对第一主引线部件分别插入到所述槽中并与所述第一主连接电极部件连接; 以及密封构件，其密封所述陶瓷烧结体以部分地暴露所述一对第一主引导构件中的每一个。

公开(公告)号：US20120329078A1

公开(公告)日：2012-12-27

申请号：US13546966

申请日：2012-07-11

Applicant: SANG YUP LEE ,  NAE CHOON YOO ,  SO YOUNG YOO ,  HYUN CHEOL CHUNG ,  KI CHANG KEUM ,  WON MIN YOO ,  KI JUN JEONG

Inventor： SANG YUP LEE ,  NAE CHOON YOO ,  SO YOUNG YOO ,  HYUN CHEOL CHUNG ,  KI CHANG KEUM ,  WON MIN YOO ,  KI JUN JEONG

IPC: G01N33/574

CPC classification number: C07K16/243 ,  C12Q1/6886 ,  C12Q2600/156

Abstract: Disclosed are a method, a composition, a microarray, an antibody and a kit for diagnosis and prognosis of cancer, based on detection of deletion of the exon 3 region of G-CSF gene or levels of a mutated G-CSF protein having a deletion of an amino acid sequence corresponding to the exon 3 region, wherein the deletion of the exon 3 region of the G-CSF gene is used as a cancer biomarker.

Abstract translation: 公开了基于检测到G-CSF基因的外显子3区的缺失或具有缺失的突变的G-CSF蛋白的水平的方法，组合物，微阵列，抗体和用于癌症诊断和预后的试剂盒 的对应于外显子3区域的氨基酸序列，其中G-CSF基因的外显子3区域的缺失被用作癌症生物标志物。

公开(公告)号：US08324363B2

公开(公告)日：2012-12-04

申请号：US11058976

申请日：2005-02-16

Applicant: Sang Yup Lee ,  Nae Choon Yoo ,  So Young Yoo ,  Hyun Cheol Chung ,  Ki Chang Keum ,  Won Min Yoo ,  Ki Jun Jeong

Inventor： Sang Yup Lee ,  Nae Choon Yoo ,  So Young Yoo ,  Hyun Cheol Chung ,  Ki Chang Keum ,  Won Min Yoo ,  Ki Jun Jeong

IPC: C07H21/04 ,  C12Q1/68 ,  C07K14/535

CPC classification number: C07K16/243 ,  C12Q1/6886 ,  C12Q2600/156

Abstract: Disclosed are a method, a composition, a microarray, an antibody and a kit for diagnosis and prognosis of cancer, based on detection of deletion of the exon 3 region of G-CSF gene or levels of a mutated G-CSF protein having a deletion of an amino acid sequence corresponding to the exon 3 region, wherein the deletion of the exon 3 region of the G-CSF gene is used as a cancer biomarker.

Abstract translation: 公开了基于检测到G-CSF基因的外显子3区的缺失或具有缺失的突变的G-CSF蛋白的水平的方法，组合物，微阵列，抗体和用于癌症诊断和预后的试剂盒 的对应于外显子3区域的氨基酸序列，其中G-CSF基因的外显子3区域的缺失被用作癌症生物标志物。

公开(公告)号：US08294276B1

公开(公告)日：2012-10-23

申请号：US12788845

申请日：2010-05-27

Applicant: Sang Won Kim ,  Boo Yang Jung ,  Sung Kyu Kim ,  Min Yoo ,  Seung Jae Lee

Inventor： Sang Won Kim ,  Boo Yang Jung ,  Sung Kyu Kim ,  Min Yoo ,  Seung Jae Lee

IPC: H01L23/12

CPC classification number: H01L23/5389 ,  H01L21/561 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2924/00

Abstract: A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.

Abstract translation: 提供了一种半导体器件及其制造方法。 在一个示例性实施例中，多个半导体管芯安装在具有预先形成的导电图案的层压构件，例如铜包覆层压件上，然后执行封装，形成导电通孔，形成阻焊剂和锯切的操作，由此 以简化的方式制造芯片尺寸封装。 在层叠构件上还形成有基准图案，从而将半导体模具精确地定位在层叠构件的预定位置。

公开(公告)号：US08076242B2

公开(公告)日：2011-12-13

申请号：US12433629

申请日：2009-04-30

Applicant: Jong Su Kim ,  Hyung Sang Park ,  Yong Min Yoo ,  Hak Yong Kwon ,  Tae Ho Yoon

Inventor： Jong Su Kim ,  Hyung Sang Park ,  Yong Min Yoo ,  Hak Yong Kwon ,  Tae Ho Yoon

IPC: H01L21/44

CPC classification number: H01L21/02592 ,  H01L21/02532 ,  H01L21/0262

Abstract: A method for forming an amorphous silicon thin film is disclosed. In some embodiments, a method includes loading a substrate into a reaction chamber; and conducting a plurality of deposition cycles on the substrate. Each of at least two of the cycles includes: supplying a silicon precursor to the reaction chamber during a first time period; applying radio frequency power to the reaction chamber at least partly during the first time period; stopping supplying of the silicon precursor and applying of the radio frequency power during a second time period between the first time period and an immediately subsequent deposition cycle; and supplying hydrogen plasma to the reaction chamber during a third time period between the second time period and the immediately subsequent deposition cycle. The method allows formation of an amorphous silicon film having an excellent step-coverage and a low roughness at a relatively low deposition temperature.

Abstract translation: 公开了一种形成非晶硅薄膜的方法。 在一些实施例中，一种方法包括将基底装载到反应室中; 以及在所述衬底上进行多个沉积循环。 至少两个循环中的每一个包括：在第一时间段内将硅前体供应到反应室; 至少部分地在第一时间段内向反应室施加射频功率; 在第一时间段和紧随其后的沉积循环之间的第二时间段期间，停止供应硅前体和施加射频功率; 以及在第二时间段和紧随其后的沉积循环之间的第三时间段期间向反应室供应氢等离子体。 该方法允许在相对低的沉积温度下形成具有优异的阶梯覆盖和低粗糙度的非晶硅膜。

公开(公告)号：US08067475B2

公开(公告)日：2011-11-29

申请号：US11149272

申请日：2005-06-10

Applicant: Jang Soon Kim ,  Woo Ha Kim ,  Jae Gwan Lee ,  Suk Ky Chang ,  Wook Kim ,  Geun Hee Lee ,  Byoung Soo Lee ,  Byeong Gyu Cho ,  Seung Min Yoo

Inventor： Jang Soon Kim ,  Woo Ha Kim ,  Jae Gwan Lee ,  Suk Ky Chang ,  Wook Kim ,  Geun Hee Lee ,  Byoung Soo Lee ,  Byeong Gyu Cho ,  Seung Min Yoo

IPC: C09J133/08 ,  C09J7/00

CPC classification number: C09J133/08 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38 ,  C09J7/385 ,  C09J2205/102 ,  C09J2205/11 ,  Y10T428/1405 ,  Y10T428/1462 ,  Y10T428/249953 ,  Y10T428/249971 ,  Y10T428/249972 ,  Y10T428/249978 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/2852 ,  Y10T428/2857

Abstract: Disclosed herein are an adhesive sheet comprising a cured acrylic polymer, hollow polymeric microspheres dispersed and ruptured in the cured acrylic polymer, and hollow parts formed by rupturing the hollow polymeric microspheres dispersed in the cured acrylic polymer, and a preparation method thereof.

Abstract translation: 本文公开了一种粘合片，其包含固化的丙烯酸类聚合物，在固化的丙烯酸类聚合物中分散和破裂的中空聚合物微球，以及通过破坏分散在固化的丙烯酸类聚合物中的中空聚合物微球形成的中空部分及其制备方法。

公开(公告)号：US08017157B2

公开(公告)日：2011-09-13

申请号：US11638056

申请日：2006-12-12

Applicant: Won Min Yoo ,  Kyung Hee Chang ,  Nae Choon Yoo ,  Ki Chang Keum ,  Sang Yup Lee ,  Gene Lee

Inventor： Won Min Yoo ,  Kyung Hee Chang ,  Nae Choon Yoo ,  Ki Chang Keum ,  Sang Yup Lee ,  Gene Lee

IPC: A61K35/16

CPC classification number: A61K35/16

Abstract: The present invention relates to a pharmaceutical composition for the treatment of wounds containing blood plasma or serum and a method for treating wounds effectively by applying said composition to the wound site to normalize the tissue-environment around the site.

Abstract translation: 本发明涉及用于治疗含有血浆或血清的伤口的药物组合物和通过将所述组合物施用于伤口部位来有效地治疗伤口的方法，以使得围绕该部位周围的组织环境归一化。

公开(公告)号：US08004078B1

公开(公告)日：2011-08-23

申请号：US12405854

申请日：2009-03-17

Applicant: Jae Kyu Song ,  Bong Chan Kim ,  Min Yoo

Inventor： Jae Kyu Song ,  Bong Chan Kim ,  Min Yoo

IPC: H01L23/48 ,  G02B6/12

CPC classification number: H01L24/29 ,  C08K3/14 ,  C08K3/38 ,  C09J7/38 ,  C09J2205/102 ,  C09J2467/00 ,  C09J2475/00 ,  H01L23/293 ,  H01L23/295 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is an adhesive composition for a semiconductor device. For example, the adhesive composition comprises a binder resin and a silicon carbide filler. The silicon carbide filler has relatively high thermal conductivity and a relatively low coefficient of thermal expansion (CTE). Accordingly, the adhesive composition containing the silicon carbide filler exhibits improved heat dissipation performance and electrical performance due to high thermal conductivity and shows inhibition of delamination or cracking of semiconductor devices due to low CTE. The silicon carbide has high thermal conductivity, but is electrically non-conductive. Therefore, an electrically conductive adhesive can be obtained by additional incorporation of a silver (Ag) filler into the binder resin.

Abstract translation: 本发明提供一种半导体装置用粘合剂组合物。 例如，粘合剂组合物包含粘合剂树脂和碳化硅填料。 碳化硅填料具有较高的热导率和较低的热膨胀系数（CTE）。 因此，含有碳化硅填料的粘合剂组合物由于高导热性而具有改善的散热性能和电性能，并且由于低CTE而显示出对半导体器件的分层或破裂的抑制。 碳化硅具有高导热性，但是是非导电的。 因此，通过向粘合剂树脂中另外并入银（Ag）填料可以获得导电粘合剂。

公开(公告)号：US20110193810A1

公开(公告)日：2011-08-11

申请号：US13023174

申请日：2011-02-08

Applicant: Min-jung PARK ,  Joon-hwan Kim ,  Soung-min Yoo ,  Yeon-hee Roh

Inventor： Min-jung PARK ,  Joon-hwan Kim ,  Soung-min Yoo ,  Yeon-hee Roh

IPC: G06F3/041

CPC classification number: G06F3/04886

Abstract: A touch type display apparatus is provided that includes a memory for storing at least one application, a processor for dividing a screen based on a number of users and for controlling display of an application executed for each divided screen, and a touch screen unit controlled by the processor for displaying data based on the application executed for each divided screen.

Abstract translation: 提供了一种触摸型显示装置，其包括用于存储至少一个应用的存储器，用于基于用户数分割屏幕并且用于控制针对每个划分的屏幕执行的应用的显示的处理器，以及由 用于基于针对每个划分的屏幕执行的应用来显示数据的处理器。