公开(公告)号：US20050168104A1

公开(公告)日：2005-08-04

申请号：US11009688

申请日：2004-12-10

Applicant: Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

Inventor： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

IPC: H03H3/02 ,  H03H9/17 ,  H03H9/56 ,  H03H9/58 ,  H01L41/08

CPC classification number: H03H9/587 ,  H03H9/564

Abstract: Acoustic resonator device (1) includes an active element (6) and a support provided with a membrane (5). The active element (6) is provided with at least one piezoelectric layer (10) and is surmounted by a multilayer stack (12). The multilayer stack (12) is provided with at least three layers, including at least one layer (15) of high acoustic impedance and at least one layer (13) of low acoustic impedance. An integrated circuit including at least one such acoustic resonator device is also disclosed.

Abstract translation: 声谐振器装置（1）包括有源元件（6）和具有膜（5）的支撑件。 有源元件（6）设置有至少一个压电层（10），并被多层叠层（12）所覆盖。 多层堆叠（12）设置有至少三层，包括至少一层高声阻抗层（15）和至少一层低声阻抗层（13）。 还公开了包括至少一个这样的声谐振器装置的集成电路。

公开(公告)号：US5741067A

公开(公告)日：1998-04-21

申请号：US620532

申请日：1996-03-25

Applicant: Michel Gschwind ,  Pascal Ancey

Inventor： Michel Gschwind ,  Pascal Ancey

IPC: G01N27/12 ,  G01N25/68 ,  G01N27/00 ,  G01N25/12

CPC classification number: G01N25/68

Abstract: A method of predicting the formation of water condensation on a surface in contact with humid air includes the steps of placing on the surface an element that adopts initially a temperature approximately equal to a temperature of the surface. The element is thermally cycled. Each cycle includes a cooling phase and a heating phase. The cooling phase includes first and second steps. Electric current is supplied to a cooling mechanism in the first step of the cooling phase to decrease the temperature of the element to below the temperature of the surface. An electric current is supplied to the cooling mechanism in the second step of the cooling phase to further decrease the temperature of the element. The current of the first step is greater than the current of the second step, such that the temperature of the element decreases more rapidly in the first step than in the second step. The formation of water condensation on the surface is predicted based upon the formation of water condensation on the element.

Abstract translation: 预测与潮湿空气接触的表面上的水冷凝形成的方法包括以下步骤：在表面上放置初始温度大约等于表面温度的元件。 元件热循环。 每个循环包括冷却阶段和加热阶段。 冷却阶段包括第一和第二步骤。 在冷却阶段的第一步骤中，向冷却机构供给电流，将元件的温度降低至表面温度以下。 在冷却阶段的第二步骤中，向冷却机构供给电流，进一步降低元件的温度。 第一步骤的电流大于第二步骤的电流，使得元件的温度在第一步骤中比在第二步骤中更快地降低。 基于在元件上形成水凝结来预测表面上的水凝结的形成。

公开(公告)号：US20120313874A1

公开(公告)日：2012-12-13

申请号：US13490347

申请日：2012-06-06

Applicant: Cedrick Chappaz ,  Pascal Ancey ,  Yves Gilot ,  Serge Laffont ,  Olivier Girard

Inventor： Cedrick Chappaz ,  Pascal Ancey ,  Yves Gilot ,  Serge Laffont ,  Olivier Girard

IPC: G06F3/041 ,  H01L41/22 ,  H05K3/42 ,  G08B6/00 ,  H05K3/30

CPC classification number: G06F3/041 ,  G06F3/016 ,  G08B6/00 ,  H01L41/0805 ,  H01L41/318 ,  Y10T29/42 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The disclosure relates to a method of manufacturing vibratory elements, comprising forming on a substrate a multilayer structure by an integrated circuit manufacturing method, the multilayer structure comprising an element susceptible of vibrating when it is subjected to an electrical signal, and electrodes for transmitting an electrical signal to the vibratory element, the vibratory element comprising a mechanical coupling face that is able to transmit to control element vibrations perceptible by a user.

Abstract translation: 本发明涉及一种制造振动元件的方法，包括通过集成电路制造方法在基板上形成多层结构，所述多层结构包括当受到电信号时易于振动的元件，以及用于传输电气的电极 信号到振动元件，振动元件包括机械耦合面，其能够传递到用户可感知的控制元件振动。

公开(公告)号：US08159109B2

公开(公告)日：2012-04-17

申请号：US12850126

申请日：2010-08-04

Applicant: Nicolas Abelé ,  Pascal Ancey ,  Alexandre Talbot ,  Karim Segueni ,  Guillaume Bouche ,  Thomas Skotnicki ,  Stéphane Monfray ,  Fabrice Casset

Inventor： Nicolas Abelé ,  Pascal Ancey ,  Alexandre Talbot ,  Karim Segueni ,  Guillaume Bouche ,  Thomas Skotnicki ,  Stéphane Monfray ,  Fabrice Casset

IPC: H01L21/00

CPC classification number: H03H9/2405 ,  H03H3/0072 ,  H03H2009/02496

Abstract: A microresonator comprising a single-crystal silicon resonant element and at least one activation electrode placed close to the resonant element, in which the resonant element is placed in an opening of a semiconductor layer covering a substrate, the activation electrode being formed in the semiconductor layer and being level at the opening.

Abstract translation: 一种微谐振器，包括单晶硅谐振元件和靠近谐振元件放置的至少一个激活电极，其中谐振元件放置在覆盖衬底的半导体层的开口中，激活电极形成在半导体层中 并在开幕式的水平。

公开(公告)号：US20120074527A1

公开(公告)日：2012-03-29

申请号：US13230035

申请日：2011-09-12

Applicant: Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laúrent-Lüc Chapelon ,  Yacine Felk ,  Pascal Ancey

Inventor： Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laúrent-Lüc Chapelon ,  Yacine Felk ,  Pascal Ancey

IPC: H01L29/06 ,  H01L21/283

CPC classification number: B81C1/00246 ,  B81B2201/014 ,  B81B2201/0235 ,  B81B2201/0271 ,  B81B2203/0353 ,  B81B2207/012 ,  B81C1/005 ,  G01P15/125 ,  G01P2015/082 ,  H01L2924/0002 ,  H03H3/0073 ,  H03H9/2426 ,  H01L2924/00

Abstract: The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element.

Abstract translation: 集成电路包括具有相对的第一和第二主表面的支撑基板。 空腔通过支撑基板并连接第一和第二主表面。 集成电路包括具有移动元件的装置，移动元件和一对相关联的电极包括在空腔中。 移动元件的锚定节点位于第一主表面的水平面上。 集成电路包括布置在第一主表面的电平处的第一基本芯片，并与移动元件电连接到该装置。

公开(公告)号：US07960900B2

公开(公告)日：2011-06-14

申请号：US11629586

申请日：2005-06-13

Applicant: Grégory Caruyer ,  Guillaume Bouche ,  Pascal Ancey

Inventor： Grégory Caruyer ,  Guillaume Bouche ,  Pascal Ancey

IPC: H01L41/08

CPC classification number: B81C1/0015 ,  B81B3/0021 ,  B81B2201/032 ,  B81B2203/0315 ,  B81B2203/04 ,  H01H57/00 ,  H01H2057/006 ,  H03H9/172 ,  H03H2009/241 ,  Y10T29/49105

Abstract: The invention relates to a device consisting of an electromechanical microswitch comprising mobile beam (2). According to the invention, at least part (14) of the beam forms the piezoelectric element of a piezoelectric actuator.

Abstract translation: 本发明涉及由包括移动光束（2）的机电微型开关组成的装置。 根据本发明，梁的至少一部分（14）形成压电致动器的压电元件。

公开(公告)号：US20100295416A1

公开(公告)日：2010-11-25

申请号：US12850126

申请日：2010-08-04

Applicant: Nicolas Abelé ,  Pascal Ancey ,  Alexandre Talbot ,  Karim Segueni ,  Guillaume Bouche ,  Thomas Skotnicki ,  Stéphane Monfray ,  Fabrice Casset

Inventor： Nicolas Abelé ,  Pascal Ancey ,  Alexandre Talbot ,  Karim Segueni ,  Guillaume Bouche ,  Thomas Skotnicki ,  Stéphane Monfray ,  Fabrice Casset

IPC: H02N1/08

CPC classification number: H03H9/2405 ,  H03H3/0072 ,  H03H2009/02496

Abstract: A microresonator comprising a single-crystal silicon resonant element and at least one activation electrode placed close to the resonant element, in which the resonant element is placed in an opening of a semiconductor layer covering a substrate, the activation electrode being formed in the semiconductor layer and being level at the opening.

Abstract translation: 一种微谐振器，包括单晶硅谐振元件和靠近谐振元件放置的至少一个激活电极，其中谐振元件放置在覆盖衬底的半导体层的开口中，激活电极形成在半导体层中 并在开幕式的水平。

公开(公告)号：US07804383B2

公开(公告)日：2010-09-28

申请号：US11845268

申请日：2007-08-27

Applicant: Alexandre Volatier ,  Pascal Ancey ,  Bertrand Dubus

Inventor： Alexandre Volatier ,  Pascal Ancey ,  Bertrand Dubus

IPC: H03H9/54 ,  H03H9/56

CPC classification number: H03H9/02228 ,  Y10T29/42

Abstract: A coupled Lamb wave resonator filter includes first and second Lamb wave resonators. The first Lamb wave resonator includes a first resonant layer, and first and second electrodes on opposite sides of the first resonant layer. The second Lamb wave resonator includes a second resonant layer, and third and fourth electrodes on opposite sides of the second resonant layer. One of the sides of the first resonant layer belongs to a plane parallel to a plane corresponding to one of the sides of the second resonant layer. Both planes pass through the third and fourth electrodes of the second Lamb wave resonator. A periodic lattice acoustically couples the first and second resonant layers.

Abstract translation: 耦合兰姆波谐振滤波器包括第一和第二兰姆波谐振器。 第一兰姆波谐振器包括第一谐振层，以及在第一谐振层的相对侧上的第一和第二电极。 第二兰姆波谐振器包括第二谐振层，第二谐振层的相对侧上的第三和第四电极。 第一共振层的一个侧面属于平行于与第二共振层的一个侧面相对应的平面的平面。 两个平面通过第二兰姆波谐振器的第三和第四电极。 周期性晶格声耦合第一和第二谐振层。

公开(公告)号：US07550900B2

公开(公告)日：2009-06-23

申请号：US11009688

申请日：2004-12-10

Applicant: Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

Inventor： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

IPC: H01L41/08

CPC classification number: H03H9/587 ,  H03H9/564

Abstract: Acoustic resonator device (1) includes an active element (6) and a support provided with a membrane (5). The active element (6) is provided with at least one piezoelectric layer (10) and is surmounted by a multilayer stack (12). The multilayer stack (12) is provided with at least three layers, including at least one layer (15) of high acoustic impedance and at least one layer (13) of low acoustic impedance. An integrated circuit including at least one such acoustic resonator device is also disclosed.

Abstract translation: 声谐振器装置（1）包括有源元件（6）和具有膜（5）的支撑件。 有源元件（6）设置有至少一个压电层（10），并被多层叠层（12）所覆盖。 多层堆叠（12）设置有至少三层，包括至少一层高声阻抗层（15）和至少一层低声阻抗层（13）。 还公开了包括至少一个这样的声谐振器装置的集成电路。

公开(公告)号：US20080076211A1

公开(公告)日：2008-03-27

申请号：US11904859

申请日：2007-09-27

Applicant: Fabrice Casset ,  Cedric Durand ,  Pascal Ancey

Inventor： Fabrice Casset ,  Cedric Durand ,  Pascal Ancey

IPC: H01L21/56

CPC classification number: B81C1/0065 ,  B81B2201/0271 ,  B81B2207/015 ,  H03H3/0073 ,  H03H9/1057 ,  H03H9/2405 ,  H03H2009/02496

Abstract: Method for making an electromechanical component on a plane substrate and comprising at least one structure vibrating in the plane of the substrate and actuation electrodes. The method comprises at least the following steps in sequence: formation of the substrate comprising one silicon area partly covered by two insulating areas, formation of a sacrificial silicon and germanium alloy layer by selective epitaxy starting from the uncovered part of the silicon area, formation of a strongly doped silicon layer by epitaxy, comprising a monocrystalline area arranged on said sacrificial layer and two polycrystalline areas arranged on insulating areas, simultaneous formation of the vibrating structure and actuation electrodes, by etching of a predetermined pattern in the monocrystalline area designed to form spaces between the electrodes and the vibrating structure, elimination of said sacrificial silicon and germanium alloy layer by selective etching.

Abstract translation: 一种用于在平面基板上制造机电部件并且包括在所述基板和致动电极的平面中振动的至少一个结构的方法。 该方法至少包括以下步骤：基底的形成，其包括由两个绝缘区域部分覆盖的一个硅区域，通过从硅区域的未覆盖部分开始的选择性外延形成牺牲硅和锗合金层，形成 通过外延的强掺杂硅层，包括布置在所述牺牲层上的单晶区域和布置在绝缘区域上的两个多晶区域，同时形成振动结构和致动电极，通过在设计成形成空间的单晶区域中蚀刻预定图案 在电极和振动结构之间，通过选择性蚀刻消除所述牺牲硅和锗合金层。