公开(公告)号：US08476090B2

公开(公告)日：2013-07-02

申请号：US12952760

申请日：2010-11-23

Applicant: Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

Inventor： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC: H01L33/52 ,  H05K3/10

CPC classification number: H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

Abstract translation: 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。

公开(公告)号：US20130154083A1

公开(公告)日：2013-06-20

申请号：US13408829

申请日：2012-02-29

Applicant: Young Hoon Kwak ,  Kwang Soo Kim ,  Young Ki Lee

Inventor： Young Hoon Kwak ,  Kwang Soo Kim ,  Young Ki Lee

IPC: H01L23/467

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably to disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit.

Abstract translation: 这里公开了半导体封装。 半导体封装包括半导体模块，第一散热单元，第二散热单元和壳体。 半导体模块包含半导体器件。 第一散热单元设置在半导体模块的下方。 第一散热单元包括至少一个第一冷却水通过的第一管道。 第一旋转体可旋转地设置在第一管中。 第二散热单元设置在半导体模块上。 第二散热单元包括至少一个第二冷却水通过的第二管道。 第二旋转体可旋转地设置在第二管中。 壳体设置在半导体模块，第一散热单元和第二散热单元的相对侧上，并且支撑半导体模块，第一散热单元和第二散热单元。

公开(公告)号：US20130062744A1

公开(公告)日：2013-03-14

申请号：US13316121

申请日：2011-12-09

Applicant: Kwang Soo Kim ,  Jung Eun Kang ,  Young Ki Lee

Inventor： Kwang Soo Kim ,  Jung Eun Kang ,  Young Ki Lee

IPC: H01L23/495

CPC classification number: H01L23/3677 ,  H01L23/36 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed herein is a power module package, including: a first substrate having one surface and the other surface; first vias formed to penetrate from one surface of the first substrate to the other surface thereof; a metal layer formed on one surface of the first substrate; semiconductor devices formed on the metal layer; and a metal plate formed on the other surface of the first substrate.

Abstract translation: 本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 形成为从第一基板的一个表面穿透到其另一个表面的第一通孔; 形成在所述第一基板的一个表面上的金属层; 形成在金属层上的半导体器件; 以及形成在所述第一基板的另一个表面上的金属板。

公开(公告)号：US08373755B2

公开(公告)日：2013-02-12

申请号：US12832371

申请日：2010-07-08

Applicant: Young-ki Lee

Inventor： Young-ki Lee

IPC: H04N7/18

CPC classification number: H04N7/181 ,  H04N5/232 ,  H04N5/23206 ,  H04N7/185

Abstract: A system for operating network cameras, a method for operating network cameras, and a network camera having a storage function are provided so that the system does not have to include a network video recorder.

Abstract translation: 提供了用于操作网络摄像机的系统，用于操作网络摄像机的方法和具有存储功能的网络摄像机，使得系统不必包括网络录像机。

公开(公告)号：US20130026616A1

公开(公告)日：2013-01-31

申请号：US13557834

申请日：2012-07-25

Applicant: Suk Ho LEE ,  Jae Cheon DOH ,  Young Hoon KWAK ,  Tae Hoon KIM ,  Tao Jyun KIM ,  Young Ki LEE

Inventor： Suk Ho LEE ,  Jae Cheon DOH ,  Young Hoon KWAK ,  Tae Hoon KIM ,  Tao Jyun KIM ,  Young Ki LEE

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/4334 ,  H01L23/3107 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1017 ,  H01L2225/1047 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1515 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015

Abstract: The present invention relates to a power device package module and a manufacturing method thereof. In one aspect of the present invention, a power device package module includes: a control unit a first lead frame, a control chip and a first coupling portion that are mounted on a first substrate, wherein the first lead frame and the first coupling portion are electrically connected to the control chip, and individually molded; and a power unit including a second lead frame, a power chip and a second coupling portion that are mounted on a second substrate, wherein the second lead frame and the second coupling portion are electrically connected to the power chip, and individually molded, wherein the individually molded control unit and power unit are coupled by the first coupling portion and the second coupling portion.

Abstract translation: 功率器件封装模块及其制造方法技术领域本发明涉及功率器件封装模块及其制造方法。 在本发明的一个方面，功率器件封装模块包括：控制单元，安装在第一衬底上的第一引线框架，控制芯片和第一耦合部分，其中第一引线框架和第一耦合部分是 电连接到控制芯片，并单独模制; 以及功率单元，其包括安装在第二基板上的第二引线框架，功率芯片和第二耦合部分，其中所述第二引线框架和所述第二耦合部分电连接到所述功率芯片，并且分别模制，其中 单独模制的控制单元和动力单元通过第一联接部分和第二联接部分联接。

公开(公告)号：US20120319259A1

公开(公告)日：2012-12-20

申请号：US13235176

申请日：2011-09-16

Applicant: Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

Inventor： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

IPC: H01L23/495 ,  H01L21/50

CPC classification number: H01L24/43 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

Abstract translation: 这里公开了功率模块封装及其制造方法。 功率模块封装包括：布置成彼此面对的第一和第二引线框架，第一和第二框架中的任一个或第二框架由铝制成; 阳极氧化层形成在第一和第二引线框架中由铝制成的引线框架的部分上; 以及安装在第一和第二引线框架的第一表面上的半导体器件。

公开(公告)号：US20120225508A1

公开(公告)日：2012-09-06

申请号：US13418241

申请日：2012-03-12

Applicant: Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

Inventor： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

IPC: H01L33/48

CPC classification number: H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

Abstract translation: 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

公开(公告)号：US20120085574A1

公开(公告)日：2012-04-12

申请号：US13064364

申请日：2011-03-21

Applicant: Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

Inventor： Ji Hyun Park ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Ki Ho Seo ,  Cheol Ho Heo ,  Young Ki Lee

IPC: H05K1/14 ,  H05K3/42

CPC classification number: H05K3/44 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/202 ,  H05K3/4053 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0315 ,  Y10T29/49165

Abstract: Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.

Abstract translation: 提供一种散热基板及其制造方法。 散热基板包括具有通孔的基板，通过阳极氧化处理形成在具有通孔的基板的整个表面上的阳极氧化层，形成在基板上的阳极氧化物层为阳极氧化层 以及形成在通孔的下部以连接到通孔的第二电路图案。 因此，通过在制造散热基板时不使用常规的粘合层和金属种子，通过施加金属阳极接合工艺来简化电路形成工艺并容易地制造散热基板。

公开(公告)号：US20120043875A1

公开(公告)日：2012-02-23

申请号：US12964285

申请日：2010-12-09

Applicant: Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

Inventor： Ki Ho Seo ,  Tae Hoon Kim ,  Sang Hyun Shin ,  Cheol Ho Heo ,  Young Ki Lee ,  Ji Hyun Park

IPC: H01J7/24 ,  H01R43/00

CPC classification number: H01L33/641 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L33/642 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2933/0075 ,  H01S5/02276 ,  H01S5/02476 ,  Y10T29/49117

Abstract: The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.

Abstract translation: 本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。

公开(公告)号：US08052554B2

公开(公告)日：2011-11-08

申请号：US12770266

申请日：2010-04-29

Applicant: Young Ki Lee

Inventor： Young Ki Lee

IPC: F42B6/08

CPC classification number: F42B6/06 ,  F42B6/08

Abstract: Disclosed herein is an arrow for hunting. The arrow includes an arrow shaft having a predetermined length and including a nock on one end and a shaft threaded part in the other end. A plurality of feathers is positioned to be adjacent to the nock of the arrow shaft. A connector includes a connecting threaded part fastened to the shaft threaded part, a stopper, and a penetration threaded part. An arrowhead is connected to the connector in such a way as to be opposite to the connecting threaded part. A penetration rotary unit has a threaded part to be fastened to the penetration threaded part of the connector, is shorter than the penetration threaded part, and has wings. A spring is positioned between the stopper and the penetration rotary unit, and provides a restoring force to bias the penetration rotary unit toward the arrowhead.

Abstract translation: 这里公开了一种狩猎的箭头。 箭头包括具有预定长度的箭头轴，并且在另一端包括一端的一个孔和一个轴螺纹部分。 多个羽毛被定位成与箭头轴的nock相邻。 连接器包括紧固到轴螺纹部分的连接螺纹部分，止动件和穿透螺纹部分。 箭头以与连接螺纹部分相对的方式连接到连接器。 穿透旋转单元具有要紧固到连接器的穿透螺纹部分的螺纹部分，比穿透螺纹部分短，并且具有翼部。 弹簧定位在止动器和穿透旋转单元之间，并且提供恢复力以将穿透旋转单元偏向箭头。