摘要:
The object of the present invention is to suppress the increase of the contact resistance at the interface between the metal layer and the silicon plug in the wiring structure in which a metal layer is formed on and connected to a silicon plug. For its achievement, a lower semiconductor layer (drain) of a vertical-type MISFET is connected to an intermediate metal layer via an underlying plug composed of a polycrystalline silicon film, and a trap layer composed of a silicon nitride (TiN) film is formed on a part of the surface of the intermediate metal layer so as to surround the plug. The trap layer is formed in order to prevent an undesired high-resistance oxide layer from being formed at the interface between the plug and the intermediate metal layer.
摘要:
The invention provides a semiconductor memory device comprising a plurality of word lines, a plurality of bit lines, and a plurality of static memory cells each having a first, second, third, fourth, fifth, and sixth transistors. While each of channels of the first, second, third, and fourth transistors are formed vertical against a substrate of the semiconductor memory device. Each of semiconductor regions forming a source or a drain of the fifth and sixth transistors forms a PN junction against the substrate. According to another aspect of the invention, the SRAM device of the invention has a plurality of SRAM cells, at least one of which is a vertical SRAM cell comprising at least four vertical transistors onto a substrate, and each vertical transistor includes a source, a drain, and a channel therebetween aligning in one aligning line which penetrates into the substrate surface at an angle greater than zero degree.
摘要:
A switching power supply unit includes a transformer including a primary winding, a secondary winding, and a feedback winding; an input power supply and a first switching element that are connected in series with the primary winding; a control circuit provided between one end of the feedback winding and a control terminal of the first switching element; a rectification circuit connected to the secondary winding; and an output voltage detection circuit for detecting output voltage output from the rectification circuit and for sending a feedback signal to the control circuit. The control circuit includes an on-period control circuit for stabilizing the output voltage by turning off the first switching element in an on-state in accordance with the feedback signal. The control circuit also includes an off-period control circuit for stabilizing the output voltage by delaying turning on of the first switching element in accordance with the feedback signal.
摘要:
A switching power supply unit includes a control output circuit, a non-control output circuit, and a regulator circuit. With this switching power supply unit, it is no longer necessary to set the voltage of the non-control output to be greater than a required value when the control output circuit is unloaded or lightly loaded. The regulator circuit is connected to the non-control output circuit and includes a first transistor defining a first impedance element connected in series to the non-control output circuit, a second transistor defining a second impedance element connected between the control output circuit and the base of the first transistor, and a voltage control circuit controlling the impedance of the second transistor such that the output voltage of the regulator circuit is maintained constant.
摘要:
A switching power supply unit comprises: a transformer, a main switching element, a rectifying smoothing circuit, a mode switching circuit and a delay circuit. The transformer has a primary winding, a secondary winding and a bias winding. The main switching element is connected to the primary winding and receives an output of the bias winding as a positive feedback so as to form a ringing choke converter operating in self-excitation oscillation. The rectifying smoothing circuit is connected to the bias winding. The mode switching circuit is turned on and off depending on whether or not the rectifying smoothing voltage of the rectifying smoothing circuit is a threshold voltage or higher. The delay circuit is coupled to the mode switching circuit and is connected between the main switching element and the bias winding and delays the output of the bias winding and applies the delayed output to the main switching element. The delay circuit lengthens a turn-on delay time when the mode switching circuit detects an output voltage of the rectifying smoothing circuit which is less than the threshold voltage.
摘要:
In a method of manufacturing a semiconductor device having a memory mat portion in which an active region and a field region are formed densely, after a polishing stopper film is deposited on a semiconductor substrate, there are formed grooves by etching a polishing stopper film of a field region and the semiconductor substrate. Then, after an insulating film is deposited so as to fill the grooves, then insulating film is partly removed from the memory mat portion by etching. Under this state, the insulating film is chemically mechanically polished until the polishing stopper film is exposed. The film thickness of the polishing stopper film on the active region can be reduced, and an electrical element isolation characteristic of the field region can be improved. At the same time, upon chemical mechanical polishing, a silicon substrate can be prevented from being exposed at the central portion of the memory mat portion and the insulating film can be prevented from being left on the silicon nitride film near the outer periphery, thereby making it possible to form elements having uniform electrical characteristics on all active regions of the memory mat portion.
摘要:
Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.
摘要:
The gate tunnel leakage current is increased in the up-to-date process, so that it is necessary to reduce the gate tunnel leakage current in the LSI which is driven by a battery for use in a cellular phone and which needs to be in a standby mode at a low leakage current. In a semiconductor integrated circuit device, the ground source electrode lines of logic and memory circuits are kept at a ground potential in an active mode, and are kept at a voltage higher than the ground potential in an unselected standby mode. The gate tunnel leakage current can be reduced without destroying data.
摘要:
A semiconductor substrate having a main surface, first and second floating gates formed spaced apart from each other on the main surface of the semiconductor substrate, first and second control gates respectively located on the first and second floating gates, a first insulation film formed on the first control gate, a second insulation film formed on the second control gate to contact the first insulation film, and a gap portion formed at least between the first floating gate and the second floating gate by achieving contact between the first insulation film and the second insulation film are included. With this, a function of a nonvolatile semiconductor device can be ensured and a variation in a threshold voltage of a floating gate can be suppressed.
摘要:
A semiconductor substrate having a main surface, first and second floating gates formed spaced apart from each other on the main surface of the semiconductor substrate, first and second control gates respectively located on the first and second floating gates, a first insulation film formed on the first control gate, a second insulation film formed on the second control gate to contact the first insulation film, and a gap portion formed at least between the first floating gate and the second floating gate by achieving contact between the first insulation film and the second insulation film are included. With this, a function of a nonvolatile semiconductor device can be ensured and a variation in a threshold voltage of a floating gate can be suppressed.