公开(公告)号：US20190250220A1

公开(公告)日：2019-08-15

申请号：US16394338

申请日：2019-04-25

Applicant: Allegro MicroSystems, LLC

Inventor： Alexander Latham ,  Michael C. Doogue ,  Jason Boudreau

IPC: G01R33/00 ,  G01R33/032 ,  H01F5/00 ,  G01N27/90 ,  G01R33/12 ,  G01R33/025

CPC classification number: G01R33/0094 ,  G01N27/90 ,  G01R33/0005 ,  G01R33/0011 ,  G01R33/0017 ,  G01R33/0029 ,  G01R33/025 ,  G01R33/032 ,  G01R33/1284 ,  H01F5/003 ,  H01F2027/348

Abstract: An apparatus comprises a first substrate and two coils supported by the first substrate and arranged next to each other, the coils configured to each generate a magnetic field which produces eddy currents in and a reflected magnetic field from a conductive target, the two coils arranged so their respectively generated magnetic fields substantially cancel each other in an area between the coils. One or more magnetic field sensing elements are positioned in the area between the coils and configured to detect the reflected magnetic field.

公开(公告)号：US20190025084A1

公开(公告)日：2019-01-24

申请号：US15655400

申请日：2017-07-20

Applicant: Allegro MicroSystems, LLC

Inventor： Michael C. Doogue ,  P. Karl Scheller

IPC: G01D5/14 ,  G01P3/487 ,  G01R33/07 ,  G01D5/165 ,  G01R33/09

CPC classification number: G01D5/145 ,  G01D3/08 ,  G01D5/165 ,  G01P3/487 ,  G01P13/045 ,  G01R33/072 ,  G01R33/091

Abstract: In one aspect, an integrated circuit (IC) includes a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure. The magnetic field sensor includes at least two magnetic field sensing elements configured to sense changes in a magnetic field caused by rotation of the magnetic structure. The IC also includes an output port configured to provide an output signal of the magnetic field sensor. The frequency of the output signal indicates the speed and the direction or indicates a fault.

公开(公告)号：US20180149677A1

公开(公告)日：2018-05-31

申请号：US15363285

申请日：2016-11-29

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

CPC classification number: G01R15/148 ,  G01R15/202 ,  G01R15/205 ,  G01R15/207 ,  G01R19/0092 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US09620705B2

公开(公告)日：2017-04-11

申请号：US15049732

申请日：2016-02-22

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: H01L23/00 ,  H01L43/04 ,  H01L23/495 ,  H01L23/31 ,  G01R33/00 ,  H01L43/02 ,  H01L43/12 ,  G01R33/07 ,  G01R33/09 ,  H01L43/06 ,  H01L43/08 ,  H01L43/14

CPC classification number: H01L43/04 ,  G01R33/0029 ,  G01R33/0052 ,  G01R33/0076 ,  G01R33/07 ,  G01R33/09 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/17 ,  H01L43/02 ,  H01L43/06 ,  H01L43/065 ,  H01L43/08 ,  H01L43/12 ,  H01L43/14 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods and apparatus to provide a magnetic field sensor device including a magnetic sensor element, a die having wafer bumps, wherein the magnetic sensor element is positioned in relation to the die, and conductive leadfingers having respective portions electrically connected to the wafer bumps. In embodiments, the device includes a region about the magnetic sensor element that does not contain electrically conductive material for preventing eddy current flow.

公开(公告)号：US20150243882A1

公开(公告)日：2015-08-27

申请号：US14707319

申请日：2015-05-08

Applicant: Allegro MicroSystems, LLC

Inventor： Michael C. Doogue ,  William P. Taylor ,  Vijay Mangtani

IPC: H01L43/04 ,  H01L43/08 ,  G01R33/06 ,  H01L43/06

CPC classification number: H01L43/02 ,  B82Y25/00 ,  G01R15/08 ,  G01R15/207 ,  G01R33/02 ,  G01R33/06 ,  G01R33/07 ,  G01R33/09 ,  G01R33/093 ,  H01L23/49541 ,  H01L25/162 ,  H01L43/04 ,  H01L43/065 ,  H01L43/08 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit can have a first substrate supporting a magnetic field sensing element and a second substrate supporting another magnetic field sensing element. The first and second substrates can be arranged in a variety of configurations. Another integrated circuit can have a first magnetic field sensing element and second different magnetic field sensing element disposed on surfaces thereof.

Abstract translation: 集成电路可以具有支撑磁场感测元件的第一基板和支撑另一磁场感测元件的第二基板。 第一和第二基板可以以各种配置布置。 另一个集成电路可以具有设置在其表面上的第一磁场感测元件和第二不同的磁场感测元件。

公开(公告)号：US20150236869A1

公开(公告)日：2015-08-20

申请号：US14645957

申请日：2015-03-12

Applicant: Allegro MicroSystems, LLC

Inventor： Richard Vreeland ,  Nevenka Kozomora ,  Michael C. Doogue ,  Ricardo Scheinkerman

IPC: H04L12/403 ,  H04L29/12 ,  H04L29/08 ,  H04L12/40

CPC classification number: H04L12/403 ,  H04L67/125

Abstract: A network slave device includes a transceiver for communicating over a communication bus in accordance with a point-to-point network protocol. The network slave device may include an address to identify the network slave device on the network. It may also include a communication circuit configured to process a command received by the transceiver and generate a reply for transmission over the communication bus if an address included in the command matches the address of the slave device. A master device communicating on the network may send commands including the address of the slave device in accordance with the point-to-point network protocol. In an embodiment, the point-to-point protocol is the SENT protocol.

Abstract translation: 网络从设备包括用于根据点到点网络协议通过通信总线进行通信的收发器。 网络从设备可以包括用于标识网络上的网络从设备的地址。 还可以包括通信电路，其被配置为处理由收发器接收的命令，并且如果包括在命令中的地址与从设备的地址匹配，则生成通过通信总线的传输的答复。 在网络上通信的主设备可以根据点到点网络协议发送包括从设备地址的命令。 在一个实施例中，点到点协议是SENT协议。

公开(公告)号：US20140084400A1

公开(公告)日：2014-03-27

申请号：US14090037

申请日：2013-11-26

Applicant: Allegro Microsystems, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: H01L43/02 ,  H01L43/12

CPC classification number: H01L43/04 ,  G01R33/0029 ,  G01R33/0052 ,  G01R33/0076 ,  G01R33/07 ,  G01R33/09 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/17 ,  H01L43/02 ,  H01L43/06 ,  H01L43/065 ,  H01L43/08 ,  H01L43/12 ,  H01L43/14 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods and apparatus to provide an integrated circuit package having a conductive leadframe, a non-conductive die paddle mechanically coupled to the leadframe, and a die disposed on the die paddle and electrically connected to the leadframe. With this arrangement, eddy currents are reduced near the magnetic field transducer to reduce interference with magnetic fields.

Abstract translation: 提供集成电路封装的方法和装置，其具有导电引线框架，机械耦合到引线框架的非导电管芯焊盘以及设置在管芯焊盘上并电连接到引线框架的管芯。 通过这种布置，磁场传感器附近的涡流减小，以减少对磁场的干扰。

公开(公告)号：US20250027975A1

公开(公告)日：2025-01-23

申请号：US18354709

申请日：2023-07-19

Applicant: Allegro MicroSystems, LLC

Inventor： Matthew Hein ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R15/20 ,  G01R15/04 ,  G01R35/00

Abstract: A sensor integrated circuit configured to generate a sensor output current indicative of a sensed parameter includes a power connection to receive a supply voltage, a ground connection, a sensing circuit configured to generate a parameter current proportional to the sensed parameter, and an output connection at which the sensor output current is provided. An output current calibration circuit is configured to determine an offset current that corresponds to a bias voltage at the output connection equal to a fixed percentage of the supply voltage when the parameter current is substantially zero. The sensor output current is provided as a combination of the parameter current and the offset current.

公开(公告)号：US20240044946A1

公开(公告)日：2024-02-08

申请号：US17817796

申请日：2022-08-05

Applicant: Allegro MicroSystems, LLC

Inventor： Robert A. Briano ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R19/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00 ,  G01R15/14 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30

CPC classification number: G01R19/0092 ,  H01L23/4951 ,  H01L23/49531 ,  H01L21/4821 ,  H01L24/45 ,  G01R15/146 ,  H05K1/189 ,  H05K1/181 ,  H05K1/111 ,  H05K3/301 ,  H01L2224/4502 ,  H05K2201/09227 ,  H05K2201/09445 ,  H05K2201/10151 ,  H05K2201/10636 ,  H05K2201/10977

Abstract: A sensor package comprising a lead frame, a current sensor die, and an interposer. The lead frame includes: (i) a primary conductor, (ii) a plurality of secondary leads, and (iii) a layer of dielectric material that is disposed between the primary conductor and the plurality of secondary leads. The current sensor die includes one or more sensing elements. The current sensor die is configured to measure a level of electrical current through the primary conductor of the lead frame. The interposer is disposed over the layer of dielectric material. The interposer includes a plurality of conductive traces that are configured to couple each of a plurality of terminals of the current sensor die to a respective one of the plurality of secondary leads.

公开(公告)号：US10725100B2

公开(公告)日：2020-07-28

申请号：US13837982

申请日：2013-03-15

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R31/28 ,  G01R33/02 ,  G01R33/00 ,  G01R33/07

Abstract: Methods and apparatus for magnetic field sensor having a sensing element, an analog circuit path coupled to the sensing element for generating an output voltage in response to a magnetic field applied to the sensing element, and a coil in proximity to the sensing element, the coil having a first terminal that is accessible external to the magnetic field sensor.