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公开(公告)号：US20180081094A1
公开(公告)日：2018-03-22
申请号：US15709442
申请日：2017-09-19
Applicant: Apple Inc.
Inventor： Randol W. Aikin , Malcolm J. Northcott , Daniel E. Potter , Matthew E. Last
CPC classification number: G02B5/124 , B60R13/10 , G01S7/481 , G01S7/4811 , G01S13/75 , G01S13/931 , G01S17/06 , G01S17/74 , G01S17/936 , G01S2013/9339 , G02B5/128 , G02B5/13 , G05D1/0236 , G05D1/024 , G05D1/0242 , G05D1/028 , G08G1/017 , G08G1/095 , G08G1/09623 , G08G1/166 , H01Q1/3233 , H01Q15/14 , H01Q15/18
Abstract: A retroreflector system including an outer body panel coupled to a vehicle, wherein the outer body panel is configured to allow a radar signal originating from an external radar device to pass through the outer body panel. The retroreflector system also includes a plurality of retroreflectors embedded in the vehicle, where the plurality of retroreflectors is configured to reflect the signal to the external signal source as a reflected signal, and where the plurality of retroreflectors is configured to have a peak reflectivity for a radar wavelength range or a light detection and ranging (lidar) wavelength range.
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公开(公告)号：US09190379B2
公开(公告)日：2015-11-17
申请号：US13629544
申请日：2012-09-27
Applicant: Apple Inc.
Inventor： Shawn X. Arnold , Matthew E. Last
IPC: H01L23/00 , H01L23/538 , H01L23/31 , H01L23/498
CPC classification number: H01L24/19 , H01L23/3121 , H01L23/3128 , H01L23/49822 , H01L23/5389 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
Abstract: One embodiment of a perimeter trench sensor array package can include a thinned substrate device that includes a perimeter trench formed near the edges of the device that can be configured to be thinner than a central portion of the thinned substrate device. The perimeter trench can include bond pads that can couple to electrical elements included in the thinned substrate device. The thinned substrate device can be attached to a core layer that can in turn support one or more resin layers. The core layer and the resin layers can form a printed circuit board assembly, a flex cable assembly or a stand-alone module.
Abstract translation: 周边沟槽传感器阵列封装的一个实施例可以包括减薄的衬底器件，其包括在器件边缘附近形成的周边沟槽，该周边沟槽可以被配置为比薄的衬底器件的中心部分更薄。 周边沟槽可以包括可以耦合到包括在薄化衬底器件中的电气元件的接合焊盘。 可以将薄化的衬底装置附接到可以依次支撑一个或多个树脂层的芯层。 芯层和树脂层可以形成印刷电路板组件，柔性电缆组件或独立模块。
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公开(公告)号：US20150230339A1
公开(公告)日：2015-08-13
申请号：US14696327
申请日：2015-04-24
Applicant: Apple Inc.
Inventor： Shawn X. Arnold , Terry L. Gilton , Matthew E. Last
CPC classification number: H05K1/183 , G06F1/16 , G06F3/041 , G06K9/00053 , H01L23/24 , H01L24/11 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/85 , H01L29/0657 , H01L2224/43 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48479 , H01L2224/85 , H01L2224/85051 , H01L2224/85186 , H01L2924/00 , H01L2924/00014 , H01L2924/10155 , H01L2924/10253 , H05K1/111 , H05K2201/09036 , H05K2201/10151 , H01L2924/20752 , H01L2224/48471 , H01L2224/4554
Abstract: Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.
Abstract translation: 描述了用于形成低轮廓组件的各种方法。 薄型组件可以包括集成电路。 集成电路以及与集成电路相关的部件可以位于集成电路所在的印刷电路板的表面的下方。 集成电路可以包括配置成将集成电路电连接到其他部件的接合线。 薄型组件可以包括在衬底上形成各种层并且随后去除一些层。
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公开(公告)号：US09053952B2
公开(公告)日：2015-06-09
申请号：US13631769
申请日：2012-09-28
Applicant: Apple Inc.
Inventor： Shawn X. Arnold , Matthew E. Last
IPC: H01L29/02 , H01L21/78 , H01L21/762 , H01L29/06 , H01L21/683 , H01L21/822
CPC classification number: H01L29/0657 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L21/822 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381
Abstract: One embodiment for forming a shaped substrate for an electronic device can form a shaped perimeter to define the substrate shape on the surface of a substrate. The shaped perimeter can extend at least part way into the substrate. A subsequent thinning process can remove substrate material and expose the shaped perimeter effectively forming shaped dies from the substrate.
Abstract translation: 用于形成用于电子器件的成形衬底的一个实施例可以形成成形周边以限定衬底表面上的衬底形状。 成形的周边可以至少部分地延伸到基底中。 随后的变薄过程可以去除衬底材料并且使形状的周边有效地从衬底形成成形的模具。
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公开(公告)号：US09018091B2
公开(公告)日：2015-04-28
申请号：US14252596
申请日：2014-04-14
Applicant: Apple Inc.
Inventor： Shawn X. Arnold , Terry L. Gilton , Matthew E. Last
IPC: H01L21/4763 , G06K9/00 , H01L23/00 , H01L29/06 , H01L23/24
CPC classification number: H05K1/183 , G06F1/16 , G06F3/041 , G06K9/00053 , H01L23/24 , H01L24/11 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/85 , H01L29/0657 , H01L2224/43 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48479 , H01L2224/85 , H01L2224/85051 , H01L2224/85186 , H01L2924/00 , H01L2924/00014 , H01L2924/10155 , H01L2924/10253 , H05K1/111 , H05K2201/09036 , H05K2201/10151 , H01L2924/20752 , H01L2224/48471 , H01L2224/4554
Abstract: Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.
Abstract translation: 描述了用于形成低轮廓组件的各种方法。 薄型组件可以包括集成电路。 集成电路以及与集成电路相关的部件可以位于集成电路所在的印刷电路板的表面的下方。 集成电路可以包括配置成将集成电路电连接到其他部件的接合线。 薄型组件可以包括在衬底上形成各种层并且随后去除一些层。
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Patent Agency Ranking
公开(公告)号：US08981578B2
公开(公告)日：2015-03-17
申请号：US13842092
申请日：2013-03-15
Applicant: Apple Inc.
Inventor： Matthew E. Last , Lili Huang , Seung Jae Hong , Ralph E. Kauffman , Tongbi Tom Jiang
IPC: H01L23/48
CPC classification number: H01L23/481 , H01L21/485 , H01L24/05 , H01L24/45 , H01L24/48 , H01L29/0657 , H01L2224/04042 , H01L2224/45015 , H01L2224/48091 , H01L2224/48137 , H01L2224/48464 , H01L2224/48465 , H01L2224/48479 , H01L2224/85051 , H01L2224/85186 , H01L2924/00014 , H01L2924/10155 , H01L2924/10253 , H01L2924/00 , H01L2924/20752 , H01L2224/45099 , H01L2924/00012 , H01L2224/48471 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
Abstract: A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board.
Abstract translation: 传感器阵列封装可以包括设置在基板的第一侧上的传感器。 信号沟槽可以沿着衬底的边缘形成，并且导电层可以沉积在信号沟槽中并且可以耦合到传感器信号焊盘。 接合线可以附接到导电层并且可以被布置成在传感器的表面下方。 传感器阵列封装可嵌入印刷电路板中，使得接合线能够终止于印刷电路板内的其它导体。
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公开(公告)号：US20140197317A1
公开(公告)日：2014-07-17
申请号：US13740081
申请日：2013-01-11
Applicant: APPLE INC.
Inventor： Henry H. Yang , Matthew E. Last
IPC: G01J5/10
CPC classification number: G06F1/3265 , G06F1/1684 , G06F1/3231 , H04M1/22 , H04M1/32 , H04M1/72577 , H04M2250/12 , H04M2250/22 , Y02D10/153 , Y02D10/173
Abstract: An electronic device may be provided with proximity sensor capabilities for monitoring for the presence of nearby external objects. The electronic device may make temperature measurements such as measurements involving the monitoring of nearby objects for emitted blackbody light indicative of whether or not the external object is a heat-emitting object such as a human body part. The same sensor that is used in gathering temperature readings may be used in gathering proximity sensor data or separate temperature sensor and proximity sensor detector structures may be used. Motion sensor capabilities may be provided using sensor structures having an array of heat sensing elements. Signals from the array of heat sensing elements may be used in making temperature measurements and in gathering proximity sensor readings. Sensor structures may operate at wavelengths longer than 3 microns such as wavelengths from 3-5 microns or 10-15 microns.
Abstract translation: 可以为电子设备提供接近传感器能力，用于监视附近的外部物体的存在。 电子设备可以进行温度测量，例如涉及监视附近物体的发射黑体光的指示外部物体是否是诸如人体部分的发热物体的测量。 用于收集温度读数的相同传感器可用于收集接近传感器数据或单独的温度传感器，并且可以使用接近传感器检测器结构。 可以使用具有热敏元件阵列的传感器结构来提供运动传感器功能。 来自热敏元件阵列的信号可用于进行温度测量和收集接近传感器读数。 传感器结构可以在长于3微米的波长下工作，例如3-5微米或10-15微米的波长。
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公开(公告)号：US11505119B2
公开(公告)日：2022-11-22
申请号：US17404185
申请日：2021-08-17
Applicant: Apple Inc.
Inventor： Clarisse Mazuir , Arthur Y. Zhang , Matthew E. Last
Abstract: Lighting may be provided using light sources such as lighting systems with arrays of light-emitting diodes. A lighting system may be integrated into a seat, a door panel, a dashboard, or other interior portions of a system such as a vehicle. The interior portions of the vehicle may be illuminated using lighting systems to provide ambient light, to provide custom surface textures and other decorative patterns, to provide icons, text, and other information, and to provide custom gauges and other illuminated regions. Illuminated regions may overlap sensors such as capacitive touch sensors, force sensors, and other sensors. The light-emitting diodes in a lighting system may supply light that passes through openings in a cover layer. The layer may be formed from fabric, leather, or other materials. Lens structures may guide light through the openings.
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公开(公告)号：US20220242343A1
公开(公告)日：2022-08-04
申请号：US17473762
申请日：2021-09-13
Applicant: Apple Inc.
Inventor： Daniel E. Potter , Bivin J. Varghese , Christopher P. Child , Mira S. Misra , Clarisse Mazuir , Malcolm J. Northcott , Albert J. Golko , Daniel J. Reetz , Matthew E. Last , Thaddeus Stefanov-Wagner , Christopher J. Sataline , Michael A. Cretella , Collin J. Palmer
IPC: B60R16/037 , B60Q1/50 , B60R25/24 , G06T7/70 , B60R25/31
Abstract: Aspects of the present disclosure involve projecting an interactive scene onto a surface from a projecting object. In one particular embodiment, the interactive scene is projected from a vehicle and may be utilized by the vehicle to provide a scene or image that a user may interact with through various gestures detected by the system. In addition, the interactive scene may be customized to one or more preferences determined by the system, such as user preferences, system preferences, or preferences obtained through feedback from similar systems. Based on one or more user inputs (such as user gestures received at the system), the projected scene may be altered or new scenes may be projected. In addition, control over some aspects of the vehicle (such as unlocking of doors, starting of the motor, etc.) may be controlled through the interactive scene and the detected gestures of the users.
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公开(公告)号：US11117535B2
公开(公告)日：2021-09-14
申请号：US15552536
申请日：2017-08-18
Applicant: Apple Inc.
Inventor： Daniel E. Potter , Bivin J. Varghese , Christopher P. Child , Mira S. Misra , Clarisse Mazuir , Malcolm J. Northcott , Albert J. Golko , Daniel J. Reetz , Matthew E. Last , Thaddeus Stefanov-Wagner , Christopher J. Sataline , Michael A. Cretella , Collin J. Palmer
IPC: B60R25/31 , B60R16/037 , B60Q1/50 , B60R25/24 , G06T7/70
Abstract: Aspects of the present disclosure involve projecting an interactive scene onto a surface from a projecting object. In one particular embodiment, the interactive scene is projected from a vehicle and may be utilized by the vehicle to provide a scene or image that a user may interact with through various gestures detected by the system. In addition, the interactive scene may be customized to one or more preferences determined by the system, such as user preferences, system preferences, or preferences obtained through feedback from similar systems. Based on one or more user inputs (such as user gestures received at the system), the projected scene may be altered or new scenes may be projected. In addition, control over some aspects of the vehicle (such as unlocking of doors, starting of the motor, etc.) may be controlled through the interactive scene and the detected gestures of the users.
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