公开(公告)号：US12193280B1

公开(公告)日：2025-01-07

申请号：US18746747

申请日：2024-06-18

Applicant: Applied Materials, Inc.

Inventor： Jungmin Lee ,  Dieter Haas

IPC: H10K59/122 ,  H10K59/35 ,  H10K59/80 ,  H10K71/20 ,  H10K102/00

Abstract: Embodiments described herein generally relate to a display. In one or more embodiments, a sub-pixel circuit includes at least two anodes disposed over a substrate. Adjacent anodes define a well. Adjacent overhang structures are disposed in the well. The overhang structures have an overhang thickness from the substrate to an upper surface of the overhang structures. The overhang thickness and the anode thickness are substantially equivalent. The overhang structures include overhang extensions extending past lower sidewalls. The well has a trench area defined by the lower sidewalls and a bottom surface of the overhang extensions, with a gap between the overhang extensions of the adjacent overhang structures. An organic light emitting diode (OLED) material is disposed over the anode, the upper surface of the overhang structures, under the overhang structures, and within the trench area. A cathode is disposed over the OLED material.

公开(公告)号：US12029077B2

公开(公告)日：2024-07-02

申请号：US18498140

申请日：2023-10-31

Applicant: Applied Materials, Inc.

Inventor： Ji-Young Choung ,  Jungmin Lee ,  Chung-Chia Chen ,  Yusin Lin ,  Dieter Haas ,  Si Kyoung Kim

IPC: H10K59/122 ,  H10K50/822 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K50/822 ,  H10K59/173

Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.

公开(公告)号：US11839116B2

公开(公告)日：2023-12-05

申请号：US18065124

申请日：2022-12-13

Applicant: Applied Materials, Inc.

Inventor： Ji-young Choung ,  Jungmin Lee ,  Chung-chia Chen ,  Yusin Lin ,  Dieter Haas ,  Si Kyoung Kim

IPC: H10K59/122 ,  H10K50/822 ,  H10K59/173

CPC classification number: H10K59/122 ,  H10K50/822 ,  H10K59/173

Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.

公开(公告)号：US20230389343A1

公开(公告)日：2023-11-30

申请号：US17985632

申请日：2022-11-11

Applicant: Applied Materials, Inc.

Inventor： Chung-Chia Chen ,  Yu-Hsin Lin ,  Jungmin Lee ,  Takuji Kato ,  Dieter Haas ,  Si Kyoung Kim ,  Ji Young Choung

IPC: H01L51/44 ,  H01L51/52 ,  H01L51/00

CPC classification number: H01L51/442 ,  H01L51/5206 ,  H01L51/0017 ,  H01L2251/306 ,  H01L2251/308 ,  H01L2251/303

Abstract: Exemplary methods of OLED device processing are described. The methods may include forming an anode on a substrate. Forming the anode may include forming a first metal oxide material on the substrate, forming a metal layer over the first metal oxide material, forming a protective barrier over the metal layer, and forming a second metal oxide material over the amorphous protection material. The protective barrier may be an amorphous protection material overlying the metal layer.

公开(公告)号：US11718904B2

公开(公告)日：2023-08-08

申请号：US16422794

申请日：2019-06-26

Applicant: Applied Materials, Inc.

Inventor： Stefan Bangert ,  Tommaso Vercesi ,  Daniele Gislon ,  Oliver Heimel ,  Andreas Lopp ,  Dieter Haas

IPC: H01L21/67 ,  C23C14/04 ,  C23C16/04 ,  C23C16/458 ,  G03F1/38 ,  C23C14/56 ,  H01L21/673 ,  H01L21/677 ,  G01F1/42 ,  H10K71/16

CPC classification number: C23C14/042 ,  C23C14/56 ,  C23C16/042 ,  C23C16/4587 ,  G03F1/38 ,  H01L21/67346 ,  H01L21/67712 ,  G01F1/42 ,  H10K71/166

Abstract: A mask arrangement for masking a substrate in a processing chamber is provided. The mask arrangement includes a mask frame having one or more frame elements and is configured to support a mask device, wherein the mask device is connectable to the mask frame; and at least one actuator connectable to at least one frame element of the one or more frame elements, wherein the at least one actuator is configured to apply a force to the at least one frame element.

公开(公告)号：US10483465B2

公开(公告)日：2019-11-19

申请号：US16300484

申请日：2016-05-10

Applicant: Applied Materials, Inc.

Inventor： Jose Manuel Dieguez-Campo ,  Stefan Bangert ,  Andreas Lopp ,  Harald Wurster ,  Dieter Haas

IPC: H01L51/00 ,  H01L51/56 ,  C23C14/12 ,  C23C14/04 ,  C23C14/24 ,  C23C14/56

Abstract: A method of operating a deposition apparatus is provided. The method comprises: Deposition of an evaporated source material on a substrate by guiding the evaporated source material from one or more outlets of an evaporation source toward the substrate, wherein part of the evaporated source material is blocked by and attaches to a shielding device arranged between the one or more outlets and the substrate, followed by a cleaning of the shielding device by at least locally heating the shielding device for releasing at least part of the attached source material from the shielding device. According to a further aspect, a deposition apparatus is provided that can be operated according to the described methods.

公开(公告)号：US10184179B2

公开(公告)日：2019-01-22

申请号：US15107878

申请日：2015-01-20

Applicant: Applied Materials, Inc.

Inventor： Shinichi Kurita ,  Jozef Kudela ,  John M. White ,  Dieter Haas

IPC: C23C16/455 ,  H01L51/56 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  C23C16/04 ,  C23C16/44 ,  C23C16/54 ,  H01J37/32 ,  H01L51/52 ,  H01L51/00

Abstract: The present disclosure relates to methods and apparatus for an atomic layer deposition (ALD) processing chamber for device fabrication and methods for replacing a gas distribution plate and mask of the same. The ALD processing chamber has a slit valve configured to allow removal and replacement of a gas distribution plate and mask. The ALD processing chamber may also have actuators operable to move the gas distribution plate to and from a process position and a substrate support assembly operable to move the mask to and from a process position.

公开(公告)号：US09899635B2

公开(公告)日：2018-02-20

申请号：US15113752

申请日：2014-02-04

Applicant: Applied Materials, Inc.

Inventor： Stefan Bangert ,  Uwe Schüβler ,  Jose Manuel Dieguez-Campo ,  Dieter Haas

IPC: H01L51/40 ,  H01L51/56 ,  C23C14/04 ,  C23C14/12 ,  C23C14/24 ,  C23C14/50 ,  C23C14/56 ,  H01L51/00

CPC classification number: H01L51/56 ,  B05D1/60 ,  C23C14/042 ,  C23C14/12 ,  C23C14/243 ,  C23C14/246 ,  C23C14/505 ,  C23C14/56 ,  C23C14/562 ,  C23C14/564 ,  C23C14/566 ,  C23C14/568 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67271 ,  H01L21/67712 ,  H01L21/67718 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/6776 ,  H01L51/001 ,  H01L51/0011

Abstract: A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.

公开(公告)号：US09350040B2

公开(公告)日：2016-05-24

申请号：US13898912

申请日：2013-05-21

Applicant: Applied Materials, Inc.

Inventor： Byung-Sung Kwak ,  Stefan Bangert ,  Dieter Haas ,  Omkaram Nalamasu

IPC: H01M10/04 ,  H01M4/62 ,  H01M10/052 ,  H01M10/0585

CPC classification number: H01M10/0404 ,  H01M4/621 ,  H01M6/40 ,  H01M10/052 ,  H01M10/0585 ,  Y02E60/122 ,  Y02P70/54 ,  Y10T29/52

Abstract: Methods of and factories for thin-film battery manufacturing are described. A method includes operations for fabricating a thin-film battery. A factory includes one or more tool sets for fabricating a thin-film battery.