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公开(公告)号：US20240408650A1
公开(公告)日：2024-12-12
申请号：US18206367
申请日：2023-06-06
Applicant: Applied Materials, Inc.
Inventor： Haosheng Wu , Shou-Sung Chang , Hui Chen , Chih Chung Chou , Sih-Ling Yeh , Emily Drauss , Elton Zhong , Chad Pollard , Songling Shin , Jianshe Tang , Jeonghoon Oh
Abstract: A chemical mechanical polishing system includes a first polishing station including a first platen to support a first polishing pad, a transfer station to receive a substrate from a robot, a carrier head movable on a predetermined path from the polishing station to the transfer station, a gas flow regulator having an input for a carrier gas, a liquid flow regulator having an input for a cleaning liquid, and a fluid jet cleaner at a position along the predetermined path. The fluid jet cleaner includes an atomizer nozzle including an input port coupled to the gas flow regulator, an injection port coupled to the liquid flow regulator, and an output port positioned to spray the cleaning liquid entrained in the carrier gas onto the substrate held by the carrier head when the carrier head is located above the fluid jet cleaner.
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公开(公告)号：US20240307928A1
公开(公告)日：2024-09-19
申请号：US18665882
申请日：2024-05-16
Applicant: Applied Materials, Inc.
Inventor： Haosheng Wu , Jianshe Tang , Hari Soundararajan , Shou-Sung Chang , Hui Chen , Chih Chung Chou , Alexander John Fisher , Paul D. Butterfield
CPC classification number: B08B3/106 , B24B37/34 , H01L21/67051 , H01L21/67248 , B08B2203/007
Abstract: An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.
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公开(公告)号：US20240157504A1
公开(公告)日：2024-05-16
申请号：US18417304
申请日：2024-01-19
Applicant: Applied Materials, Inc.
Inventor： Surajit Kumar , Hari Soundararajan , Hui Chen , Shou-Sung Chang
IPC: B24B37/015 , B24B37/10 , B24B37/26
CPC classification number: B24B37/015 , B24B37/107 , B24B37/26 , B24B41/047
Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.
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公开(公告)号：US20240026530A1
公开(公告)日：2024-01-25
申请号：US17813829
申请日：2022-07-20
Applicant: Applied Materials, Inc.
Inventor： Kirk Allen FISHER , John Ford , James M. Amos , Hui Chen , Shawn Joseph Bonham , Xinning Luan , Philip Michael Amos , Aimee S. Erhardt , Cathryne A. Ryan , Michael R. Riordan
IPC: C23C16/32 , C23C16/02 , C23C16/458
CPC classification number: C23C16/325 , C23C16/0209 , C23C16/4581
Abstract: Embodiments disclosed herein include to a component support for use in coating chamber components via chemical vapor deposition (CVD). The component support includes contact rods configured to contact chamber components at fixture points located on the backside of the chamber components. The component supports are configured to support the chamber components in the processing volume with minimal contact of the chamber components. The fixture points on the backside reduce exposure of the fixture points to reactant gases when the chamber components are installed.
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Patent Agency Ranking
公开(公告)号：US20230390895A1
公开(公告)日：2023-12-07
申请号：US17967762
申请日：2022-10-17
Applicant: Applied Materials, Inc.
Inventor： Haosheng Wu , Shou-Sung Chang , Jianshe Tang , Jeonghoon Oh , Chad Pollard , Chih Chung Chou , Ningzhuo Cui , Hui Chen
IPC: B24B53/017 , B24B53/12 , B24B53/00 , B24B53/007 , B24B37/04
CPC classification number: B24B53/017 , B24B53/12 , B24B53/005 , B24B53/007 , B24B37/042
Abstract: A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.
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公开(公告)号：US20230249225A1
公开(公告)日：2023-08-10
申请号：US18301883
申请日：2023-04-17
Applicant: Applied Materials, Inc.
Inventor： Haosheng Wu , Jianshe Tang , Hari Soundararajan , Shou-Sung Chang , Hui Chen , Chih Chung Chou , Alexander John Fisher , Paul D. Butterfield
CPC classification number: B08B3/00 , B08B3/106 , H01L21/02057 , B08B1/001 , B24B53/017 , B24B37/20 , B08B2203/007 , H01L21/30625
Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad, a boiler, a component that is movable between a first position spaced from the polishing pad and a second position in contact with the polishing pad, a plurality of nozzles to direct steam from the boiler onto the component of the polishing system when located at the first position, an actuator to move the component from the first position to the second position in contact with the polishing pad, and a controller configured to cause the treatment station to direct the steam onto the component to clean the component, and cause the actuator to move the cleaned component from the treatment station into contact with the polishing pad.
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公开(公告)号：US11446711B2
公开(公告)日：2022-09-20
申请号：US16886571
申请日：2020-05-28
Applicant: Applied Materials, Inc.
Inventor： Haosheng Wu , Jianshe Tang , Hari Soundararajan , Shou-Sung Chang , Hui Chen , Chih Chung Chou , Alexander John Fisher , Paul D. Butterfield
Abstract: An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.
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公开(公告)号：US20200376523A1
公开(公告)日：2020-12-03
申请号：US16886571
申请日：2020-05-28
Applicant: Applied Materials, Inc.
Inventor： Haosheng Wu , Jianshe Tang , Hari Soundararajan , Shou-Sung Chang , Hui Chen , Chih Chung Chou , Alexander John Fisher , Paul D. Butterfield
Abstract: An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.
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公开(公告)号：US10229842B2
公开(公告)日：2019-03-12
申请号：US13951913
申请日：2013-07-26
Applicant: Applied Materials, Inc.
Inventor： Clinton Sakata , Hui Chen , Jim K. Atkinson , Tomohiko Kitajima , Brian J. Brown
IPC: H01L21/67
Abstract: A buff module and method for using the same are provided. In one embodiment, a buff module includes housing having an interior volume, a plurality of drive rollers and a pair of buff heads. The drive rollers are arranged to rotate a substrate within the interior volume on a substantially horizontal axis. The buff heads are disposed in the housing, each buff head rotatable on an axis substantially aligned with the horizontal axis and movable to a position substantially parallel with the horizontal axis.
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