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公开(公告)号:US20230343904A1
公开(公告)日:2023-10-26
申请号:US18305852
申请日:2023-04-24
Applicant: Applied Materials, Inc.
Inventor: Kai Ding , Lisong Xu , Mingwei Zhu , Zhiyong Li , Hou T. Ng , Sivapackia Ganapathiappan , Nag Patibandla
CPC classification number: H01L33/46 , H01L25/167 , H01L2933/0025
Abstract: Micro-LED structures include an LED epilayer that may be formed before the micro-LED structure is coupled to a backplane substrate. In order to prevent light leakage and maximize light output, the sidewalls and other surfaces of the LED epilayer may be coated with a reflective coating. For example, the reflective coating may include a metal layer that is electrically insulated between dielectric layers from the micro-LED electrodes. The reflective coating may also be formed using multiple layers in a distributed Bragg reflector configuration. This reflective coating may be formed during the LED fabrication process before the micro-LED structure is coupled to the backplane. The pixel isolation structures on the backplane may also include a reflective coating that is applied above the LED epilayers.
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公开(公告)号:US20230335693A1
公开(公告)日:2023-10-19
申请号:US18126701
申请日:2023-03-27
Applicant: Applied Materials, Inc.
Inventor: Sivapackia Ganapathiappan , Kulandaivelu Sivanandan , Lisong Xu , Mingwei Zhu , Hou T. Ng , Nag Patibandla
CPC classification number: H01L33/58 , H01L27/156 , H01L33/502
Abstract: Exemplary device structures may include a light emitting diode structure. The light emitting diode structure may be operable to generate light. The structures may include a photoluminescent region containing a photoluminescent material. The photoluminescent region may be positioned on the light emitting diode structure. The structures may include an ultraviolet (UV) light filter positioned above the photoluminescent region. The UV light filter may be operable to absorb light generated by the light emitting diode structure characterized by an emission wavelength of less than or about 430 nm.
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公开(公告)号:US11745302B2
公开(公告)日:2023-09-05
申请号:US17209137
申请日:2021-03-22
Applicant: Applied Materials, Inc.
Inventor: Sivapackia Ganapathiappan , Boyi Fu , Ashwin Chockalingam , Daniel Redfield , Rajeev Bajaj , Mahendra C. Orilall , Hou T. Ng , Jason G. Fung , Mayu Yamamura
IPC: B24B37/24 , B33Y70/00 , B24D3/28 , B33Y10/00 , B33Y80/00 , C09G1/16 , B33Y70/10 , B29K33/04 , B24B37/22 , B24B37/26 , B29C64/112 , B24D11/00 , B24D11/04 , B29C35/08 , C09D4/00
CPC classification number: B24B37/24 , B24B37/22 , B24B37/26 , B24D3/28 , B24D11/001 , B24D11/04 , B29C35/0805 , B29C64/112 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C09D4/00 , C09G1/16 , B24D2203/00 , B29C2035/0827 , B29K2033/04 , B29K2995/0077 , B29K2995/0092 , B33Y70/10
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
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公开(公告)号:US11646397B2
公开(公告)日:2023-05-09
申请号:US17006624
申请日:2020-08-28
Applicant: Applied Materials, Inc.
Inventor: Yingdong Luo , Daihua Zhang , Hou T. Ng , Sivapackia Ganapathiappan , Nag B. Patibandla
CPC classification number: H01L33/504 , H01L27/156 , H01L33/30
Abstract: A photocurable composition includes quantum dots, quantum dot precursor materials, a chelating agent, one or more monomers, and a photoinitiator. The quantum dots are selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The quantum dot precursor materials include metal atoms or metal ions corresponding to metal components present in the quantum dots. The chelating agent is configured to chelate the quantum dot precursor materials. The photoinitiator initiates polymerization of the one or more monomers in response to absorption of radiation in the second wavelength band.
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公开(公告)号:US11446740B2
公开(公告)日:2022-09-20
申请号:US15941812
申请日:2018-03-30
Applicant: Applied Materials, Inc.
Inventor: Christopher A. Rowland , Anantha K. Subramani , Kasiraman Krishnan , Kartik Ramaswamy , Thomas B. Brezoczky , Swaminathan Srinivasan , Jennifer Y. Sun , Simon Yavelberg , Srinivas D. Nemani , Nag B. Patibandla , Hou T. Ng
IPC: B22F10/30 , B33Y30/00 , B33Y10/00 , B29C64/153 , B22F12/00 , B33Y50/02 , B23K10/00 , B23K10/02 , B28B1/00 , B22F10/10 , B22F12/55 , B22F12/63 , B22F12/41 , B22F3/105 , H05B3/00
Abstract: An additive manufacturing system includes a platen to support an object to be fabricated, a dispenser assembly positioned above the platen, and an energy source configured to selectively fuse a layer of powder. The dispenser assembly includes a first dispenser, a second dispenser, and a drive system. The first dispenser delivers a first powder in a first linear region that extends along a first axis, and the second dispenser delivers a second powder in a second linear region that extends parallel to the first linear region and is offset from the first linear region along a second axis perpendicular to the first axis. The drive system a drive system moves the support with the first dispenser and second dispenser together along the second axis.
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公开(公告)号:US20220293826A1
公开(公告)日:2022-09-15
申请号:US17692012
申请日:2022-03-10
Applicant: Applied Materials, Inc.
Inventor: Hou T. Ng , Nag B. Patibandla , Giorgio Cellere , Daihua Zhang
IPC: H01L33/50 , H01L25/075
Abstract: A method of fabricating a multi-color display includes forming a host matrix over a display having an array of light emitting diodes. The host matrix is sensitive to ultraviolet light. A first plurality of light emitting diodes in a first plurality of wells are activated to illuminate a portion of the host matrix to cause the portion of the host matrix to develop internal porous structures. A first photo-curable fluid including a first color conversion agent is dispensed. The first plurality of light emitting diodes in the first plurality of wells are activated to illuminate and cure the first photo-curable fluid to form a first color conversion layer over each of the first plurality of light emitting diodes, and an uncured remainder of the first photo-curable fluid is removed.
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公开(公告)号:US20220293435A1
公开(公告)日:2022-09-15
申请号:US17690993
申请日:2022-03-09
Applicant: Applied Materials, Inc.
Inventor: Hou T. Ng , Daihua Zhang , Nag B. Patibandla
Abstract: A LED display fabrication tool includes first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, first and second curing stations to cure the workpiece to form first and second color conversion layers over a first and second set of LEDs on the workpiece, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors from the workpiece and then dry the workpiece. Each of the chambers is independently sealable. A controller controls a workpiece transport system to move the workpiece sequentially between the chambers.
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公开(公告)号:US11322381B2
公开(公告)日:2022-05-03
申请号:US16838999
申请日:2020-04-02
Applicant: Applied Materials, Inc.
Inventor: Daihua Zhang , Hou T. Ng , Nag B. Patibandla , Sivapackia Ganapathiappan , Yingdong Luo , Kyuil Cho , Han-Wen Chen
Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, positioning a substrate within the support structure, printing one or more anchors on the substrate and the support structure by printing and curing the liquid precursor material to secure the substrate to the support structure, and printing one or more device structures on the substrate while anchored by printing and curing the liquid precursor material.
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公开(公告)号:US20220069174A1
公开(公告)日:2022-03-03
申请号:US17006663
申请日:2020-08-28
Applicant: Applied Materials, Inc
Inventor: Yingdong Luo , Lisong Xu , Sivapackia Ganapathiappan , Hou T. Ng , Byung Sung Kwak , Mingwei Zhu , Nag B. Patibandla
Abstract: A photocurable composition includes a blue photoluminescent material, one or more monomers, and a photoinitiator that initiates polymerization of the one or more monomers in response to absorption of the ultraviolet light. The blue photoluminescent material is selected to absorb ultraviolet light with a maximum wavelength in a range of about 300 nm to about 430 nm and to emit blue light. The blue photoluminescent material also has an emission peak in a range of about 420 nm to about 480 nm. The full width at half maximum of the emission peak is less than 100 nm, and the photoluminescence quantum yield is in a range of 5% to 100%.
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公开(公告)号:US11251226B2
公开(公告)日:2022-02-15
申请号:US16908462
申请日:2020-06-22
Applicant: Applied Materials, Inc.
Inventor: Mingwei Zhu , Sivapackia Ganapathiappan , Boyi Fu , Hou T. Ng , Nag B. Patibandla
IPC: H01L21/683 , H01L21/66 , H01L27/15 , H01L33/00 , H01L23/00 , H01L33/48 , H01L25/075
Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.
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