公开(公告)号：US20060044796A1

公开(公告)日：2006-03-02

申请号：US10923687

申请日：2004-08-24

申请人： Bily Wang ,  Jonnie Chuang ,  John Lin

发明人： Bily Wang ,  Jonnie Chuang ,  John Lin

IPC分类号： F21S13/14 ,  F21V21/00

CPC分类号： G09F9/33

摘要： A mixing light board which shows specific pattern is described. The present invention have some advantages, including simple construction, easy production, thinness and cheapness. The mixing light board has a body with a front surface and a back surface. A plurality of conducting material is set on the front surface of the body. A plurality of LEDs is mounted by SMT on the front surface of the body, and the plurality of LEDs is arranged to form a specific pattern. The mixing light board can be made to fit demands.

摘要翻译： 描述具有特定图案的混合灯板。 本发明具有结构简单，生产方便，薄度小廉价等优点。 混合灯板具有前表面和后表面的主体。 多个导电材料设置在主体的前表面上。 多个LED通过SMT安装在主体的前表面上，并且多个LED被布置成形成特定图案。 混合灯板可以满足需求。

公开(公告)号：US20060034085A1

公开(公告)日：2006-02-16

申请号：US10915539

申请日：2004-08-11

申请人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

IPC分类号： F21V29/00

CPC分类号： F21V29/76 ,  F21K9/00 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

摘要翻译： 一种用于照明模块的水冷散热装置，其包括模块化的多个LED，并且包括散热板，在散热板内凹入的至少一个弯曲槽，形成在所述散热板的一侧上的至少一个入口 选择性地形成散热片，以及至少一个出口选择性地形成在散热片的一侧上。 作为散热板的一部分产生的弯曲的管道横向延伸并且包括布置在其上的至少一个弯曲部分。 入口和出口分别与弯曲部分和弯曲管道的自由端分别连通。 照明模块直接接触散热装置的顶部。

公开(公告)号：USD509195S1

公开(公告)日：2005-09-06

申请号：US29179243

申请日：2003-04-08

申请人： Bily Wang ,  Jonnie Chuang ,  Yann Lee

设计人： Bily Wang ,  Jonnie Chuang ,  Yann Lee

公开(公告)号：US06919584B2

公开(公告)日：2005-07-19

申请号：US10677783

申请日：2003-10-03

申请人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

发明人： Bily Wang ,  Jonnie Chuang ,  Chuanfa Lin

IPC分类号： H01L25/075 ,  H01L33/50 ,  H01L29/06

CPC分类号： H01L25/0753 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L33/504 ,  H01L2924/0002 ,  Y10S257/918 ,  H01L2924/00

摘要： A colorless light approaching that of white light in nature, is produced by using a blue color LEDs and a green color LED are covered with a red color phosphorescent glue and a yellow phosphorescent glue in separate layers or a mixed layer.

摘要翻译： 通过使用蓝色LED产生白色光的无色光，绿色LED由分开的层或混合层中的红色磷光胶和黄色磷光胶覆盖。

公开(公告)号：US20050128767A1

公开(公告)日：2005-06-16

申请号：US10731097

申请日：2003-12-10

申请人： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

发明人： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

IPC分类号： F21V7/04 ,  H01L25/075 ,  H01L25/16

CPC分类号： H01L25/167 ,  H01L25/0753 ,  H01L2224/48137

摘要： A light source structure for a light emitting diode (LED) has a high modulating flexibility and a low manufacturing cost. The LED light source is a white light source for an electrical device. The LED light source structure is used to meet the illumination requirement of the electrical device and the benefit from the light source structure of LED is more modulating ability with a small volume. The Led light source structure has an electrical circuit substrate, a red light LED chip, a green light LED chip, a blue light LED chip, a controlling integral circuit chip and a certain shape of packaging material.

摘要翻译： 用于发光二极管（LED）的光源结构具有高调制灵活性和低制造成本。 LED光源是用于电气设备的白色光源。 LED光源结构用于满足电气设备的照明要求，LED的光源结构受益于较小的体积调制能力。 LED光源结构具有电路基板，红光LED芯片，绿光LED芯片，蓝光LED芯片，控制集成电路芯片和一定形状的封装材料。

公开(公告)号：US06841934B2

公开(公告)日：2005-01-11

申请号：US10372848

申请日：2003-02-26

申请人： Bily Wang ,  Jonnie Chuang ,  Yann Lee

发明人： Bily Wang ,  Jonnie Chuang ,  Yann Lee

IPC分类号： H01J1/62 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H05B33/00 ,  H05B33/04

CPC分类号： H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48247 ,  H05B33/04 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A white light source is obtained by converting short wavelength color light emitted from a light emitting diode (LED). The conversion is achieved by covering the LED chip with a fluorescent glue. The LED chip is mounted on a split substrate, and the outer ends of the substrate serve as terminals for the LED. A wall may be erected around the LED chip to contain the fluorescent glue, and another transparent glue may be used to cover the fluorescent glue for protection.

摘要翻译： 通过转换从发光二极管（LED）发射的短波长颜色光获得白色光源。 通过用荧光胶覆盖LED芯片来实现转换。 LED芯片安装在分离的基板上，并且基板的外端用作LED的端子。 可以在LED芯片周围竖起一个墙壁以容纳荧光胶，另外透明胶可以用来覆盖荧光胶以进行保护。

公开(公告)号：US07828464B2

公开(公告)日：2010-11-09

申请号：US11984447

申请日：2007-11-19

申请人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu

IPC分类号： F21V29/00

CPC分类号： F21V29/83 ,  F21K9/00 ,  F21V29/70 ,  F21V29/71 ,  F21V29/773

摘要： An LED lamp structure with high-efficiency heat-dissipating function includes a heat-dissipating module, a light-emitting module, a power-transmitting module, and a casing module. The heat-dissipating module has a plurality of heat-dissipating fins, and the heat-dissipating fins are combined together to form a radial shape and a receiving space. The light-emitting module is received in the receiving space of the heat-dissipating module. The power-transmitting module is electrically connected with the light-emitting module. The casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins. Both the top board body and the joint board body have an opening for exposing the light-emitting module. Each heat-dissipating fin has a top side contacted with the joint board body and a bottom side separated from the bottom board body by a predetermined distance.

摘要翻译： 具有高效散热功能的LED灯具结构包括散热模块，发光模块，电力传输模块和壳体模块。 散热模块具有多个散热翅片，并且散热翅片组合在一起形成径向形状和容纳空间。 发光模块被接收在散热模块的接收空间中。 电力传输模块与发光模块电连接。 套管模块具有顶板主体，与顶板主体配合的底板体，以及设置在顶板主体和散热翅片之间的接合板体。 顶板主体和联合板体均具有用于使发光模块曝光的开口。 每个散热翅片具有与接合板体接触的顶面和与底板主体分离预定距离的底侧。

公开(公告)号：US07662661B2

公开(公告)日：2010-02-16

申请号：US11304558

申请日：2005-12-16

申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

IPC分类号： H01L21/66 ,  G01R31/26 ,  H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H05K3/0052 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/09881 ,  H05K2203/0228 ,  H05K2203/0278 ,  H05K2203/1536

摘要： A method of manufacturing a substrate structure includes the steps of: (1) providing a metal substrate having a metal portion; (2) chemically etching a plurality of trenches in the metal substrate; (3) applying a polymer composite material into the trenches to form a substrate having a polymer composite portion abutted to the metal portion; (4) polishing a surface of the substrate to make a height of the polymer composite portion equal to that of the metal portion; (5) forming a covering material on the surface of the substrate; and (6) cutting the substrate via the polymer composite portion for decreasing cutting bur produced on the metal portion. Furthermore, the method is provided for combining the metal substrate and the polymer composite material, thereby to increase cutting precision and strength of the substrate structure.

摘要翻译： 一种制造衬底结构的方法包括以下步骤：（1）提供具有金属部分的金属衬底; （2）化学蚀刻金属基板中的多个沟槽; （3）将聚合物复合材料施加到沟槽中以形成具有与金属部分邻接的聚合物复合部分的基底; （4）研磨基板的表面，使聚合物复合部的高度与金属部的高度相等; （5）在基板的表面上形成覆盖材料; 和（6）通过聚合物复合部分切割基底以减少在金属部分上产生的切割毛刺。 此外，提供了用于组合金属基板和聚合物复合材料的方法，从而提高基板结构的切割精度和强度。

公开(公告)号：US20090152574A1

公开(公告)日：2009-06-18

申请号：US12379258

申请日：2009-02-18

申请人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

发明人： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin

IPC分类号： H01L33/00

CPC分类号： C09K11/7787 ,  C09K11/7789 ,  C09K11/7794 ,  F21K9/00 ,  H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y02B20/181 ,  H01L2924/00014

摘要： A multi-wavelength white light-emitting structure uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light-emitting structure having good color rendering. The multi-wavelength white light-emitting structure uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.

摘要翻译： 多波长白色发光结构使用UV发光二极管芯片和蓝色发光二极管芯片来激发红色荧光体和绿色荧光体，并产生具有良好显色性能的白色发光结构。 多波长白色发光结构使用发射波长在350〜430nm之间的光的UV发光二极管芯片，以激发红色荧光体发射波长在600〜700nm之间的红色光。 然后，本发明使用发射波长在400〜500nm之间的光的蓝色发光二极管芯片发射蓝色光并使用蓝色发光二极管芯片来激发绿色荧光体，发出波长在490nm之间的绿色光 〜560nm。 混合红光，蓝光和绿光形成白光。

公开(公告)号：US20090020770A1

公开(公告)日：2009-01-22

申请号：US11779556

申请日：2007-07-18

申请人： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

发明人： Bily Wang ,  Jonnie Chuang ,  Wen-Kuei Wu

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： B29C45/14655 ,  B29C33/0022 ,  F21K9/00 ,  F21K9/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips.

摘要翻译： 具有高效率发光效果的LED芯片封装结构包括基板单元，发光单元和封装胶体单元。 基板单元具有分别形成在基板主体上的基板主体和正极迹线和负极迹线。 发光单元具有布置在基板主体上的多个LED芯片，并且每个LED芯片分别具有正极侧和负极侧，并与基板单元的正极迹线和负极迹线电连接。 封装胶体单元具有分别覆盖在LED芯片上的多个封装胶体。