公开(公告)号：US20190165228A1

公开(公告)日：2019-05-30

申请号：US16263191

申请日：2019-01-31

Applicant: Cree, Inc.

Inventor： Shaow B. Lin ,  James Sievert ,  Jesse Colin Reiherzer ,  Barry Rayfield ,  Christopher P. Hussell

IPC: H01L33/60

Abstract: Light emitting devices and components having excellent chemical resistance and related methods are disclosed. In one embodiment, a component of a light emitting device can include a silver (Ag) portion, which can be silver on a substrate, and a protective layer disposed over the Ag portion. The protective layer can at least partially include an inorganic material for increasing the chemical resistance of the Ag portion.

公开(公告)号：US10134961B2

公开(公告)日：2018-11-20

申请号：US13800284

申请日：2013-03-13

Applicant: CREE, Inc.

Inventor： Jesse Colin Reiherzer ,  Christopher P. Hussell

IPC: H01L33/52 ,  H01L33/60 ,  H01L33/00 ,  H01L33/48

Abstract: Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In one aspect, a method of providing a submount based light emitter component can include providing a ceramic based submount, providing at least one light emitter chip on the submount, providing at least one electrical contact on a portion of the submount, and providing a non-ceramic based reflector cavity on a portion of the submount.

公开(公告)号：US20180261741A1

公开(公告)日：2018-09-13

申请号：US15453594

申请日：2017-03-08

Applicant: Cree, Inc.

Inventor： Erin R. F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Arthur Fong-Yuen Pun

IPC: H01L33/62 ,  H01L33/60 ,  H01L25/075 ,  H01L21/48 ,  H01L33/54 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L21/4846 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.

公开(公告)号：USD778848S1

公开(公告)日：2017-02-14

申请号：US29523168

申请日：2015-04-07

Applicant: Cree, Inc.

Designer： Colin Kelly Blakely ,  Jesse Colin Reiherzer

公开(公告)号：US09209354B2

公开(公告)日：2015-12-08

申请号：US14148102

申请日：2014-01-06

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

IPC: H01L33/00 ,  H01L33/08 ,  H01L25/075 ,  H01L33/62 ,  H01L25/16 ,  H01L33/52

CPC classification number: H01L33/08 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.

Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底和布置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。

公开(公告)号：US20130270592A1

公开(公告)日：2013-10-17

申请号：US13800284

申请日：2013-03-13

Applicant: CREE, INC.

Inventor： Jesse Colin Reiherzer ,  Christopher P. Hussell

IPC: H01L33/52 ,  H01L33/60

CPC classification number: H01L33/52 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In one aspect, a method of providing a submount based light emitter component can include providing a ceramic based submount, providing at least one light emitter chip on the submount, providing at least one electrical contact on a portion of the submount, and providing a non-ceramic based reflector cavity on a portion of the submount.

Abstract translation: 公开了基于底座的表面贴装设计（SMD）光发射器部件和相关方法。 在一个方面，提供基于基座的光发射器部件的方法可以包括提供基于陶瓷的基座，在所述基座上提供至少一个光发射器芯片，在所述子安装座的一部分上提供至少一个电触点， 在基座的一部分上的陶瓷基反射器腔。

公开(公告)号：US10964858B2

公开(公告)日：2021-03-30

申请号：US16380400

申请日：2019-04-10

Applicant: Cree, Inc.

Inventor： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

公开(公告)号：US10930826B2

公开(公告)日：2021-02-23

申请号：US16380400

申请日：2019-04-10

Applicant: Cree, Inc.

Inventor： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

Abstract: Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

公开(公告)号：USD890961S1

公开(公告)日：2020-07-21

申请号：US29689497

申请日：2019-04-30

Applicant: Cree, Inc.

Designer： Jesse Colin Reiherzer ,  Colin Kelly Blakely ,  Samuel Richard Harrell, Jr. ,  Erin R. F. Welch ,  Roshan Murthy

公开(公告)号：US10192854B2

公开(公告)日：2019-01-29

申请号：US15192790

申请日：2016-06-24

Applicant: Cree, Inc.

Inventor： Erin R. F. Welch ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/56 ,  H01L33/62 ,  H01L23/538

Abstract: Light emitter components and related methods are provided. In some aspects, light emitter components and related methods include a ceramic submount having a reflective surface. Light emitter components and related methods can include light emitter chips disposed over the reflective surface. Each light emitter chip can include a sapphire substrate, an epi area disposed over the sapphire substrate, and first and second electrical contacts disposed over the epi area. The first and second electrical contacts may face the reflective surface. A ratio between a combined epi area of the plurality of light emitter chips and a surface area of the reflective surface may be at least 0.4 or more, and a ratio between a combined planar surface area of the plurality of light emitter chips and a planar surface area of the reflective surface may be at least approximately 0.25 or more.