公开(公告)号：US20050139642A1

公开(公告)日：2005-06-30

申请号：US10747927

申请日：2003-12-30

申请人： Paul Koning ,  Bryan White

发明人： Paul Koning ,  Bryan White

IPC分类号： B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  H01L23/373 ,  H01L23/42 ,  B23K31/00

CPC分类号： H01L24/32 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/26 ,  B82Y10/00 ,  B82Y30/00 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/325 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/16152

摘要： An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.

摘要翻译： 装置和系统以及其制造方法可以包括结合在焊料中的金属装饰的碳纳米管的热中间结构。

公开(公告)号：US20050104197A1

公开(公告)日：2005-05-19

申请号：US10991621

申请日：2004-11-17

申请人： Sabina Houle ,  Paul Koning

发明人： Sabina Houle ,  Paul Koning

IPC分类号： H01L23/373 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L21/4882 ,  H01L23/373 ,  H01L23/3733 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/15321 ,  H01L2924/16195 ,  Y10T428/24994 ,  Y10T428/249945 ,  H01L2224/0401

摘要： A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.

公开(公告)号：US06597575B1

公开(公告)日：2003-07-22

申请号：US10035209

申请日：2002-01-04

申请人： James C. Matayabas, Jr. ,  Paul Koning ,  Jinlin Wang

发明人： James C. Matayabas, Jr. ,  Paul Koning ,  Jinlin Wang

IPC分类号： H05K720

CPC分类号： H01L23/3737 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/00

摘要： An electronic package includes a heat-generating electronic component such as an integrated circuit chip, a thermally conductive member, which may be an integrated heat spreader, and a low modulus thermal interface material in heat conducting relation between the electronic component and the thermally conductive member. Increased thermal performance requirements at the electronic component level are met by the thermal interface material, which includes a polymer matrix and thermally conductive filler, which has a storage shear modulus (G′) at 125° C. of less than about 100 kPa, and which has a gel point, as indicated by a value of G′/G″ of ≧1, where G″ is the loss shear modulus of the thermal interface material. The values for G′ and G″ are measured by a strain-controlled rheometer.

摘要翻译： 电子封装包括诸如集成电路芯片的发热电子部件，可以是集成散热器的导热部件和在电子部件和导热部件之间的导热关系中的低模量热界面材料 。 通过热界面材料满足电子部件水平的增加的热性能要求，其包括聚合物基质和导热填料，其在125℃下的储能剪切模量（G'）小于约100kPa，以及 其具有如G'/ G“>> 1的值所示的凝胶点，其中G”是热界面材料的损耗剪切模量。 G'和G“的值由应变控制流变仪测量。

公开(公告)号：US20080237897A1

公开(公告)日：2008-10-02

申请号：US12151332

申请日：2008-05-06

申请人： James Christopher Matayabas ,  Paul Koning

发明人： James Christopher Matayabas ,  Paul Koning

IPC分类号： H01L23/29 ,  C08G59/00

CPC分类号： C09K19/3411 ,  Y10T428/10 ,  Y10T428/25

摘要： Liquid crystalline epoxy compounds, compositions including the compounds, and methods of using the compositions are disclosed. In one aspect, an epoxy compound may have a melting point that is less than 140° C. and may be liquid crystalline at a temperature greater than 150° C.

摘要翻译： 公开了液晶环氧化合物，包括该化合物的组合物和使用该组合物的方法。 一方面，环氧化合物的熔点可以低于140℃，并且在大于150℃的温度下可以是液晶。

公开(公告)号：US20080178778A1

公开(公告)日：2008-07-31

申请号：US12058795

申请日：2008-03-31

申请人： Paul Koning ,  Matthew Ruster ,  Jack Nyenhuis

发明人： Paul Koning ,  Matthew Ruster ,  Jack Nyenhuis

IPC分类号： A47B3/00

CPC分类号： A47B3/0818

摘要： A latch assembly connecting a leg of a table to a table top comprises a housing assembly comprising a housing and a cover, a pivot mounted on the housing and pivotable between an upright position and a pivoted position, wherein the pivot defines an upright slot and a pivoted position slot, a remote release mechanism located remote from the pivot outside the housing assembly and movable from a first position to a second position, and a slider connected to the remote release mechanism and movable in response to movement of the remote release mechanism. When the remote release mechanism is in the first position the pivot is locked with respect to the housing assembly in one of the upright position and the pivoted position, and when the remote release mechanism is moved to the second position the pivot is movable between the upright position and the pivoted position.

摘要翻译： 将桌子的腿部连接到台面的闩锁组件包括壳体组件，其包括壳体和盖子，枢轴安装在壳体上并且可在直立位置和枢转位置之间枢转，其中枢轴限定直立狭槽和 枢转定位槽，远离释放机构的位置远离壳体组件的枢轴并且可从第一位置移动到第二位置，滑块连接到远程释放机构并且响应于远程释放机构的移动而可移动。 当远程释放机构处于第一位置时，枢轴在垂直位置和枢转位置中的一个中相对于壳体组件被锁定，并且当远程释放机构移动到第二位置时，枢轴可在立柱 位置和枢轴位置。

公开(公告)号：US20070218652A1

公开(公告)日：2007-09-20

申请号：US11801465

申请日：2007-05-09

申请人： Eric Li ,  Daoqiang Lu ,  Christopher Rumer ,  Paul Koning ,  Darcy Fleming ,  Gudbjorg Oskarsdottir ,  Tiffany Byrne

发明人： Eric Li ,  Daoqiang Lu ,  Christopher Rumer ,  Paul Koning ,  Darcy Fleming ,  Gudbjorg Oskarsdottir ,  Tiffany Byrne

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/78 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2221/6834 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1181 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81011 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps and thereby prevents oxidation of the bumps between die prep and chip and attach. In an alternative embodiment, an ultraviolet light absorber is added to the wafer coat formulation to enhance the wafer coat layer's energy absorption and thereby improve the laser's ability to ablate the wafer coat layer. In an alternative embodiment, a conformal wafer coat layer is deposited on the wafer and die bumps, thereby reducing wafer coat layer thickness variations that can impact the laser scribing ability.

摘要翻译： 公开了用于形成晶片涂层的制剂和方法。 在一个实施方案中，在激光划线操作之前，将有机表面保护剂并入沉积到半导体晶片上的晶片涂层制剂中。 在去除晶片涂层时，有机表面保护剂保留在凸块上，从而防止芯片准备和芯片之间的凸起的氧化附着。 在替代实施例中，将紫外光吸收剂添加到晶片涂层配方中以增强晶片涂层的能量吸收，从而提高激光器烧蚀晶片涂层的能力。 在替代实施例中，保形晶片涂层沉积在晶片和模具凸起上，从而减少可能影响激光划线能力的晶片涂层厚度变化。

公开(公告)号：US20060223284A1

公开(公告)日：2006-10-05

申请号：US11097424

申请日：2005-03-31

申请人： Eric Li ,  Daoqiang Lu ,  Christopher Rumer ,  Paul Koning ,  Darcy Fleming ,  Gudbjorg Oskarsdottir ,  Tiffany Byrne

发明人： Eric Li ,  Daoqiang Lu ,  Christopher Rumer ,  Paul Koning ,  Darcy Fleming ,  Gudbjorg Oskarsdottir ,  Tiffany Byrne

IPC分类号： H01L21/00 ,  H01L21/31

CPC分类号： H01L21/6835 ,  H01L21/78 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2221/6834 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1181 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81011 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps and thereby prevents oxidation of the bumps between die prep and chip and attach. In an alternative embodiment, an ultraviolet light absorber is added to the wafer coat formulation to enhance the wafer coat layer's energy absorption and thereby improve the laser's ability to ablate the wafer coat layer. In an alternative embodiment, a conformal wafer coat layer is deposited on the wafer and die bumps, thereby reducing wafer coat layer thickness variations that can impact the laser scribing ability.

摘要翻译： 公开了用于形成晶片涂层的制剂和方法。 在一个实施方案中，在激光划线操作之前，将有机表面保护剂并入沉积到半导体晶片上的晶片涂层制剂中。 在去除晶片涂层时，有机表面保护剂保留在凸块上，从而防止芯片准备和芯片之间的凸起的氧化附着。 在替代实施例中，将紫外光吸收剂添加到晶片涂层配方中以增强晶片涂层的能量吸收，从而提高激光器烧蚀晶片涂层的能力。 在替代实施例中，保形晶片涂层沉积在晶片和模具凸起上，从而减少可能影响激光划线能力的晶片涂层厚度变化。

公开(公告)号：US20050284920A1

公开(公告)日：2005-12-29

申请号：US10877924

申请日：2004-06-25

申请人： Edward Martin ,  Paul Koning

发明人： Edward Martin ,  Paul Koning

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K3/34 ,  B23K31/00

CPC分类号： H01L21/4867 ,  H01L23/49866 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/742 ,  H01L2924/01322 ,  H05K3/3484 ,  H05K2203/043 ,  H01L2924/00014

摘要： Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.

摘要翻译： 描述了形成集成电路封装的焊料凸点的方法。 焊膏由具有其暴露于电磁辐射时其沉积实例基本上保持其几何形状的特性的材料形成。

公开(公告)号：US20050260790A1

公开(公告)日：2005-11-24

申请号：US10853307

申请日：2004-05-24

申请人： Michael Goodner ,  Paul Koning ,  James Matabayas ,  Robert Meagley

发明人： Michael Goodner ,  Paul Koning ,  James Matabayas ,  Robert Meagley

IPC分类号： H01L21/44 ,  H01L21/48 ,  H05K3/00 ,  H05K3/10 ,  H05K3/46

CPC分类号： H01L21/4846 ,  H05K3/005 ,  H05K3/107 ,  H05K3/465 ,  H05K2201/09036 ,  H05K2203/0108 ,  H05K2203/1189

摘要： A method of making an electronics substrate is provided. A material is deposited on a base component. The material has a first composition and includes a polymer. A pattern is imprinted into the material by contacting the material with a die and moving a profile of the die into the material. The material is then modified while being held in the profile of the die to cause at least partial curing of the material due to a change in composition of the material from a first composition to a second composition. The die is then removed from the material. Electric conductors are then formed in trenches of the pattern.

摘要翻译： 提供一种制造电子基板的方法。 材料沉积在基底部件上。 该材料具有第一组成并且包括聚合物。 通过使材料与模具接触并将模具的轮廓移动到材料中，将图案压印到材料中。 然后在将材料保持在模具的轮廓中的同时将材料改性以由于材料从第一组合物到第二组合物的组成的变化而使材料至少部分固化。 然后将模具从材料中取出。 然后在图案的沟槽中形成导电体。

公开(公告)号：US20050235886A1

公开(公告)日：2005-10-27

申请号：US10833251

申请日：2004-04-27

申请人： Paul Koning ,  Matthew Ruster ,  Jack Nyenhuis

发明人： Paul Koning ,  Matthew Ruster ,  Jack Nyenhuis

IPC分类号： A47B3/00 ,  A47B3/08 ,  B60N2/02

CPC分类号： A47B3/0818

摘要： A latch assembly is disclosed comprising a handle pivotable from a first position to a second position, a slider movable in response to movement of the handle between the first position and the second position, and a pivot pivotable between an upright position and a foldable position, wherein when the handle is in the first position the pivot is locked in one of the upright position and the foldable position, and when the handle is moved to the second position the pivot is movable between the upright position and the foldable position.

摘要翻译： 公开了一种闩锁组件，包括可从第一位置转动到第二位置的手柄，响应于手柄在第一位置和第二位置之间的移动而可移动的滑块以及可在直立位置和可折叠位置之间枢转的枢轴， 其中当所述手柄处于所述第一位置时，所述枢轴锁定在所述直立位置和所述可折叠位置中的一个位置，并且当所述手柄移动到所述第二位置时，所述枢轴可在所述直立位置和所述可折叠位置之间移动。