公开(公告)号：US11417463B2

公开(公告)日：2022-08-16

申请号：US16643361

申请日：2017-09-05

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Zhe Wang ,  Qinglin Song ,  Debo Sun

IPC: H01F7/06 ,  H01F41/04 ,  H01F5/00 ,  H01F41/12

Abstract: Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.

公开(公告)号：US11117797B2

公开(公告)日：2021-09-14

申请号：US16339460

申请日：2016-10-08

Applicant: GOERTEK. INC

Inventor： Quanbo Zou ,  Zhe Wang ,  You Wang ,  Xianbin Wang

IPC: H04R25/00 ,  B81B7/00 ,  H04R1/04 ,  H04R19/00 ,  H04R19/01

Abstract: The present invention discloses a MEMS device and an electronics apparatus. The MEMS device comprises: a substrate; a MEMS element placed on the substrate; a cover encapsulating the MEMS element together with the substrate; and a port for the MEMS element to access outside, wherein the port is provided with a filter which has mesh holes and includes electrets to prevent particles from entering into the MEMS element.

公开(公告)号：US11024611B1

公开(公告)日：2021-06-01

申请号：US16620224

申请日：2017-06-09

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Peixuan Chen ,  Xiangxu Feng ,  Tao Gan ,  Xiaoyang Zhang ,  Zhe Wang

IPC: H01L27/12 ,  H01L25/075 ,  H01L21/67 ,  H01L21/677 ,  H01L33/00 ,  H01L51/00 ,  H01L21/683 ,  H01L21/60

Abstract: A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.

公开(公告)号：US10971890B2

公开(公告)日：2021-04-06

申请号：US16465745

申请日：2016-12-05

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01S5/02 ,  H01S5/042 ,  H01S5/183 ,  H01S5/42 ,  H01S5/0234 ,  H01S5/022 ,  H01S5/40

Abstract: A micro laser diode transfer method and a manufacturing method comprise: forming a bonding layer (515) on a receiving substrate (513), wherein first type electrodes (514) are connected to the bonding layer (515); bringing a first side of the micro laser diodes (500r) on a carrier substrate (520) into contact with the bonding layer (515), wherein the carrier substrate (520) is laser-transparent; and irradiating selected micro laser diodes (500r) with laser from the side of the carrier substrate (520) to lift-off the selected micro laser diodes (500r) from the carrier substrate (520). This method may improve yield.

公开(公告)号：US20200014892A1

公开(公告)日：2020-01-09

申请号：US16491120

申请日：2017-03-07

Applicant: GOERTEK INC.

Inventor： Zhe Wang ,  Xiaoyang Zhang ,  Quanbo Zou

IPC: H04N9/31 ,  G02B26/10 ,  G02B26/08

Abstract: The present disclosure provides a laser projection device and a laser projection system. The laser projection device comprises an optical fiber scanner and a MEMS scanning mirror; an optical fiber is disposed on the optical fiber scanner and the optical fiber is used to deliver laser beams needed by projection; the optical fiber scanner drives the optical fiber to scan in a first plane and enables the laser beam to project to the MEMS scanning mirror; and the MEMS scanning mirror makes scanning movement about a first axis and reflects the laser beam to a predetermined area to form a projection image; wherein the first axis is located in the first plane, or the first axis is parallel to the first plane. The present disclosure achieves laser projection by enabling the optical fiber scanner and the MEMS scanning mirror to scan simultaneously in different directions.

公开(公告)号：US10224308B2

公开(公告)日：2019-03-05

申请号：US15531270

申请日：2015-07-14

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L23/00 ,  H01L33/00 ,  H01L33/20 ,  H01L33/62 ,  H01L25/075

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate; irradiating the original substrate with laser from the original substrate side to lift-off the micro-LEDs from the original substrate; bring the micro-LEDs into contact with pads preset on a receiving substrate through a contactless action.

公开(公告)号：US10224307B2

公开(公告)日：2019-03-05

申请号：US15531243

申请日：2015-07-14

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L33/62 ,  H01L23/00 ,  H01L21/50 ,  H01L21/66 ,  H01L25/075 ,  H01L21/683

Abstract: The present invention discloses a assembling method, a manufacturing method, an device and an electronic apparatus of flip-die. The method for assembling a flip-die, comprises: temporarily bonding the flip-die onto a laser-transparent first substrate, wherein bumps of the flip-die are located on the side of the flip-die opposite to the first substrate; aligning the bumps with pads on a receiving substrate; irradiating the original substrate with laser from the first substrate side to lift-off the flip-die from the first substrate; and attaching the flip-die on the receiving substrate. A faster assembly rate can be achieved by using the present invention. A smaller chip size can be achieved by using the present invention. A lower profile can be achieved by using the present invention.

公开(公告)号：US10193012B2

公开(公告)日：2019-01-29

申请号：US15536040

申请日：2015-05-21

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L21/00 ,  H01L33/00 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L33/38 ,  H01L33/44 ,  H01L33/52 ,  H01L33/62

Abstract: A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED (402) are disclosed. The method for transferring micro-LED (402) comprises: transferring at least one micro-LED (402) from an original substrate (406) to a support body (412); transferring the at least one micro-LED (402) from the support body (412) to a backup substrate (415); and transferring the at least one micro-LED (402) from the backup substrate (415) to a receiving substrate (417).

公开(公告)号：US20170330856A1

公开(公告)日：2017-11-16

申请号：US15531243

申请日：2015-07-14

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L23/00 ,  H01L21/66 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L24/97 ,  H01L21/50 ,  H01L21/6835 ,  H01L22/14 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0753 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81011 ,  H01L2224/81121 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/81907 ,  H01L2224/83005 ,  H01L2224/83101 ,  H01L2224/83143 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2221/68304 ,  H01L21/78 ,  H01L22/10 ,  H01L2224/83104 ,  H01L2924/014

Abstract: The present invention discloses a assembling method, a manufacturing method, an device and an electronic apparatus of flip-die. The method for assembling a flip-die, comprises: temporarily bonding the flip-die onto a laser-transparent first substrate, wherein bumps of the flip-die are located on the side of the flip-die opposite to the first substrate; aligning the bumps with pads on a receiving substrate; irradiating the original substrate with laser from the first substrate side to lift-off the flip-die from the first substrate; and attaching the flip-die on the receiving substrate. A faster assembly rate can be achieved by using the present invention. A smaller chip size can be achieved by using the present invention. A lower profile can be achieved by using the present invention.