公开(公告)号：US09146253B2

公开(公告)日：2015-09-29

申请号：US13699235

申请日：2011-05-20

申请人： Takanori Aono ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

发明人： Takanori Aono ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

IPC分类号： G01P1/02 ,  G01P15/08 ,  B81C1/00 ,  G01C19/56 ,  G01P15/125 ,  G01C19/5783 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： G01P15/0802 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81B2207/095 ,  B81C1/00293 ,  B81C2203/031 ,  G01C19/56 ,  G01C19/5783 ,  G01P15/125 ,  H01L21/561 ,  H01L23/315 ,  H01L24/94 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/16235 ,  Y10T29/49146 ,  Y10T29/49826 ,  H01L2924/00

摘要： An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors.A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.

摘要翻译： 加速度传感器和角速度传感器在一系列接合步骤的过程中被密封在适合于其的相应的压力环境中，从而提高传感器的检测灵敏度。 加速度传感器11的可动部件111和角速度传感器12的振动器121被制造在相同的传感器晶片10上，壁16插入其中。 形成盖片20，其中设置有与加速度传感器11的可动构件111对应的间隙21,22和角速度传感器12的振子121。 凸起23设置在角速度传感器12的间隙22附近。加速度传感器11在大气压下被密封。 然后，对角速度传感器12进行高温高负荷的真空密封。 此后，进行用金刚石磨石切割并安装电路基板和布线基板以形成组合的传感器。

公开(公告)号：US20110219873A1

公开(公告)日：2011-09-15

申请号：US13029520

申请日：2011-02-17

申请人： Kazunori OHTA ,  Masahide Hayashi

发明人： Kazunori OHTA ,  Masahide Hayashi

IPC分类号： G01C19/56

CPC分类号： G01C19/5783 ,  G01C19/56 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/15311 ,  H01L2924/00014

摘要： An angular rate sensor includes a metallic core board having a core meal layer made of a metal plate and a wiring layer including a wiring structure, a semiconductor device for detecting an angular rate fixed on the core metal layer, and a cap fixed to the wiring layer. The semiconductor device for detecting an angular rate is disposed in a hollow chamber formed by the cap and the metallic core board. The metallic core board, the semiconductor device, and the cap are molded with resin. Consequently, the angular rate sensor has a packaging structure in which electromagnetic noise resistance and moisture resistance are improved while stress applied to the semiconductor device for detecting an angular rate is reduced.

摘要翻译： 角速率传感器包括具有由金属板制成的芯粕层的金属芯板和包括布线结构的布线层，用于检测固定在芯金属层上的角速率的半导体器件和固定到布线的帽 层。 用于检测角速率的半导体装置设置在由盖和金属芯板形成的中空室中。 金属芯板，半导体器件和盖子用树脂模制。 因此，角速率传感器具有改善电磁噪声阻抗和耐湿性的封装结构，同时减小了施加到用于检测角速率的半导体器件的应力。

公开(公告)号：US20110209815A1

公开(公告)日：2011-09-01

申请号：US13028592

申请日：2011-02-16

申请人： Takanori AONO ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

发明人： Takanori AONO ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

IPC分类号： A63B39/00 ,  B23P17/04

CPC分类号： G01C19/56 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/096 ,  B81C1/00285 ,  B81C2203/0118 ,  B81C2203/035 ,  G01C19/5769 ,  G01C19/5783 ,  G01P15/0802 ,  G01P2015/0882 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4908 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49826 ,  H01L2924/00012

摘要： A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.

摘要翻译： 加速度传感器的可移动装置和陀螺仪的振动装置形成在通过壁彼此间隔开的相同传感器晶片上。 为晶片提供具有与加速度传感器和陀螺仪的可移动机械部件相对应的间隙的盖片晶片，并且分离成多个分割部分的吸附剂设置在用于陀螺仪的间隙中。 在传感器晶片和盖晶片已经在吸附剂失活的温度下并且在惰性气体和活性气体的大气压氛围下结合在一起，吸附剂分段依次被激活以吸附活性气体，以便调节 陀螺仪内部的压力，从而制造组合的传感器晶片。

公开(公告)号：US07260992B2

公开(公告)日：2007-08-28

申请号：US10500873

申请日：2003-01-17

申请人： Masahide Hayashi ,  Katsuhiko Kikuchi ,  Hiromichi Ebine

发明人： Masahide Hayashi ,  Katsuhiko Kikuchi ,  Hiromichi Ebine

IPC分类号： G01L7/00

CPC分类号： G01L19/0092 ,  G01L19/0038 ,  G01L19/0084 ,  G01L19/141

摘要： An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.

摘要翻译： 例如，与压力传感器一起使用的外壳连接器部分，量规壳体壳体等通常由热塑性或热固性树脂制成。 然而，树脂物理地引起固化收缩。 特别是当金属用树脂嵌入成型时，树脂的固化收缩在树脂和金属之间的界面处产生间隙。 通过在间隙中填充厌氧性高渗透性粘合剂，可以确保气密密封，提高可靠性。 实现了廉价的密封和增强的可靠性。

公开(公告)号：US20130226506A1

公开(公告)日：2013-08-29

申请号：US13879566

申请日：2011-10-20

申请人： Toshiaki Nakamura ,  Masahide Hayashi

发明人： Toshiaki Nakamura ,  Masahide Hayashi

IPC分类号： G06F17/00

CPC分类号： G06F17/00 ,  G01C19/56 ,  G01C19/5776 ,  G01D3/08 ,  G01P15/097 ,  G01P15/125 ,  G01P15/18

摘要： An object is to provide a physical quantity detection device capable of reducing a communication load for transmitting a sensor detection result, and also, of reducing a processing load of a receiving device receiving the sensor detection result.In a case a sensor is not normally operating, the physical quantity detection device according to the present invention transmits a diagnosis result without transmitting a detection result of the sensor (see FIG. 4).

摘要翻译： 本发明的目的是提供一种物理量检测装置，其能够减少用于传送传感器检测结果的通信负荷，并且还降低接收传感器检测结果的接收装置的处理负荷。 在传感器不正常工作的情况下，根据本发明的物理量检测装置发送诊断结果而不发送传感器的检测结果（参见图4）。

公开(公告)号：US08459108B2

公开(公告)日：2013-06-11

申请号：US13029520

申请日：2011-02-17

申请人： Kazunori Ohta ,  Masahide Hayashi

发明人： Kazunori Ohta ,  Masahide Hayashi

IPC分类号： G01P1/02

CPC分类号： G01C19/5783 ,  G01C19/56 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/15311 ,  H01L2924/00014

摘要： An angular rate sensor includes a metallic core board having a core meal layer made of a metal plate and a wiring layer including a wiring structure, a semiconductor device for detecting an angular rate fixed on the core metal layer, and a cap fixed to the wiring layer. The semiconductor device for detecting an angular rate is disposed in a hollow chamber formed by the cap and the metallic core board. The metallic core board, the semiconductor device, and the cap are molded with resin. Consequently, the angular rate sensor has a packaging structure in which electromagnetic noise resistance and moisture resistance are improved while stress applied to the semiconductor device for detecting an angular rate is reduced.

摘要翻译： 角速率传感器包括具有由金属板制成的芯粕层的金属芯板和包括布线结构的布线层，用于检测固定在芯金属层上的角速率的半导体器件和固定到布线的帽 层。 用于检测角速率的半导体装置设置在由盖和金属芯板形成的中空室中。 金属芯板，半导体器件和盖子用树脂模制。 因此，角速率传感器具有改善电磁噪声阻抗和耐湿性的封装结构，同时减小了施加到用于检测角速率的半导体器件的应力。

公开(公告)号：US20130068020A1

公开(公告)日：2013-03-21

申请号：US13699235

申请日：2011-05-20

申请人： Takanori Aono ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

发明人： Takanori Aono ,  Kengo Suzuki ,  Akira Koide ,  Masahide Hayashi

IPC分类号： G01P3/44 ,  H05K3/30 ,  H05K3/28 ,  B23P11/00

CPC分类号： G01P15/0802 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81B2207/095 ,  B81C1/00293 ,  B81C2203/031 ,  G01C19/56 ,  G01C19/5783 ,  G01P15/125 ,  H01L21/561 ,  H01L23/315 ,  H01L24/94 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/16235 ,  Y10T29/49146 ,  Y10T29/49826 ,  H01L2924/00

摘要： An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors.A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.

摘要翻译： 加速度传感器和角速度传感器在一系列接合步骤的过程中被密封在适合于其的相应的压力环境中，从而提高传感器的检测灵敏度。 加速度传感器11的可动部件111和角速度传感器12的振动器121被制造在相同的传感器晶片10上，壁16插入其中。 形成盖片20，其中设置有与加速度传感器11的可动构件111对应的间隙21,22和角速度传感器12的振子121。 凸起23设置在角速度传感器12的间隙22附近。加速度传感器11在大气压下被密封。 然后，对角速度传感器12进行高温高负荷的真空密封。 此后，进行用金刚石磨石切割并安装电路基板和布线基板以形成组合的传感器。

公开(公告)号：US20090020419A1

公开(公告)日：2009-01-22

申请号：US12175347

申请日：2008-07-17

申请人： Kengo SUZUKI ,  Takeshi Harada ,  Yasuo Osone ,  Masahide Hayashi ,  Teruhisa Akashi

发明人： Kengo SUZUKI ,  Takeshi Harada ,  Yasuo Osone ,  Masahide Hayashi ,  Teruhisa Akashi

IPC分类号： G01N27/30

CPC分类号： G01P15/0802 ,  B81B2207/096 ,  B81C1/00301 ,  G01C19/5719

摘要： There is provided a physical sensor which ensures long-term reliability and can be miniaturized and increased in density, and a method of producing the same. A physical sensor includes a supporting substrate, an element substrate that includes a sensor element and is joined to the supporting substrate through an insulating layer, a glass cap that covers an area of the sensor element and is joined to the element substrate, and a built-in electrode that is electrically connected to the sensor element. The built-in electrode is formed in a through hole passing through the element substrate, the insulating layer and the supporting substrate. A portion of the glass cap that covers an area of the built-in electrode is anodically bonded to the element substrate.

摘要翻译： 提供了一种物理传感器，其确保了长期可靠性并且可以小型化和增加密度，以及其制造方法。 物理传感器包括支撑基板，包括传感器元件并通过绝缘层与支撑基板接合的元件基板，覆盖传感器元件的区域并与元件基板接合的玻璃盖，以及内置 电连接到传感器元件。 内置电极形成在穿过元件基板，绝缘层和支撑基板的通孔中。 覆盖内置电极的区域的玻璃帽的一部分阳极接合到元件基板。

公开(公告)号：US20050115328A1

公开(公告)日：2005-06-02

申请号：US10500873

申请日：2003-01-17

申请人： Masahide Hayashi ,  Katsuhiko Kikuchi ,  Hiromichi Ebine

发明人： Masahide Hayashi ,  Katsuhiko Kikuchi ,  Hiromichi Ebine

IPC分类号： G01L9/00 ,  G01L19/00

CPC分类号： G01L19/0092 ,  G01L19/0038 ,  G01L19/0084 ,  G01L19/141

摘要： An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially, when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.

摘要翻译： 例如，与压力传感器一起使用的外壳连接器部分，量规壳体壳体等通常由热塑性或热固性树脂制成。 然而，树脂物理地引起固化收缩。 特别地，当金属用树脂嵌入成型时，树脂的固化收缩在树脂和金属之间的界面处产生间隙。 通过在间隙中填充厌氧性高渗透性粘合剂，可以确保气密密封，提高可靠性。 实现了廉价的密封和增强的可靠性。

公开(公告)号：US06601453B2

公开(公告)日：2003-08-05

申请号：US10101526

申请日：2002-03-20

申请人： Atsushi Miyazaki ,  Katsuhiko Kikuchi ,  Hiromichi Ebine ,  Satoshi Shimada ,  Masahide Hayashi

发明人： Atsushi Miyazaki ,  Katsuhiko Kikuchi ,  Hiromichi Ebine ,  Satoshi Shimada ,  Masahide Hayashi

IPC分类号： G01L916

CPC分类号： G01L19/147 ,  G01L19/0038 ,  G01L19/0084 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The present invention provides a pressure detector capable of easily responding to changes in specification. The pressure detector has a sensor unit for detecting pressure and electronic parts for reducing electrical disturbance which are electrically joined to an exposed part of lead material of an opening of an external case. Thermoset resin is injected and set in the opening to obtain fixed members. An external electronic part for compensating for transient voltage resistance and electromagnetic failure resistance of a single one-chip semiconductor sensor can be mounted, and cost can be reduced by miniaturization, light weight, and reduction in man-hours required for assembly.

摘要翻译： 本发明提供一种能够容易地响应于规格变化的压力检测器。 压力检测器具有用于检测压力的传感器单元和用于减少电气干扰的电子部件，其电连接到外部壳体的开口的引线材料的暴露部分。 将热固性树脂注入并置于开口中以获得固定构件。 可以安装用于补偿单个单芯片半导体传感器的瞬态电压和电磁破坏电阻的外部电子部件，并且可以通过小型化，轻量化和组装所需的工时减少成本。