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公开(公告)号：US08739406B2
公开(公告)日：2014-06-03
申请号：US13788722
申请日：2013-03-07
Applicant: International Business Machines Corporation
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/20309 , B23P15/26 , F28D9/0025 , F28D15/02 , F28F3/046 , F28F3/12 , F28F9/02 , H05K7/203 , H05K7/20809 , Y10T29/4935 , Y10T29/49359 , Y10T29/49396
Abstract: A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.
Abstract translation: 提供一种制造蒸汽冷凝器的方法，其包括三维折叠结构，该三维折叠结构至少部分限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 平行于蒸气冷凝通道延伸。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道
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公开(公告)号：US11019755B2
公开(公告)日：2021-05-25
申请号：US16749134
申请日：2020-01-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. ELLSWORTH, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.
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公开(公告)号：US09686889B2
公开(公告)日：2017-06-20
申请号：US14827617
申请日：2015-08-17
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC: H05K7/20
CPC classification number: H05K7/203 , H05K7/20 , H05K7/20236 , H05K7/20336 , H05K7/20781
Abstract: A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.
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公开(公告)号：US09357675B2
公开(公告)日：2016-05-31
申请号：US14058530
申请日：2013-10-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/20318 , B23P15/26 , B23P2700/10 , H05K7/203 , H05K7/20781 , H05K7/2079 , Y10T29/49361
Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.
Abstract translation: 提供冷却装置及其制造方法，其有助于电子部件的抽吸浸没冷却。 所述冷却装置包括具有容纳所述电子部件的隔室的外壳和所述隔室内的介电流体，至少部分地浸没所述电子部件。 液体冷却散热器与外壳相关联，以冷却与隔室相关联的至少一个冷却表面，并且便于通过介电流体从电子部件传递到散热器。 泵设置在隔室的外部并与其流体连通以便于泵送的介电流体流过隔间。 泵送的电介质流体流过隔室增强了通过冷却表面从电子部件到液体冷却的散热器的热传递。 在一个实施方案中，泵送介质流体流通过沸腾流向电子部件提供两相冷却。
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公开(公告)号：US09338924B2
公开(公告)日：2016-05-10
申请号：US14063123
申请日：2013-10-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: H05K7/202 , F28D1/0471 , F28D1/0475 , F28D1/05366 , F28D2021/0038 , F28F1/126 , F28F1/32 , F28F17/005 , H05K7/20218 , H05K7/20318 , H05K7/20572 , H05K7/20609 , H05K7/20627 , H05K7/20645 , H05K7/20736 , H05K7/20754 , H05K7/20763 , H05K7/20781 , H05K7/20836
Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.
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Patent Agency Ranking
36.发明授权Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater 有权带有备用风冷散热片和辅助制冷剂加热器的蒸气压缩式制冷装置公开(公告)号：US09301433B2
公开(公告)日：2016-03-29
申请号：US14134017
申请日：2013-12-19
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: H05K7/208 , F25B39/02 , F25B49/02 , F25B2400/01 , F25B2500/06 , H05K7/20809 , H05K7/20836 , Y10T29/49826
Abstract: Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with a component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with a refrigerant loop, an air-cooled heat sink coupled to the refrigerant evaporator, for providing backup cooling to the electronic component in a backup, air cooling mode, and a controllable refrigerant heater coupled to the heat sink. The refrigerant heater is in thermal communication across the heat sink with refrigerant passing through the refrigerant evaporator, and is controlled in a primary, refrigeration cooling mode to apply an auxiliary heat load to refrigerant passing through the refrigerant evaporator to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.
Abstract translation: 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的制冷剂蒸发器和与蒸发器流体连通的制冷剂回路，以便制冷剂流过蒸发器。 该装置还包括与制冷剂回路流体连通的压缩机，耦合到制冷剂蒸发器的空气冷却散热器，用于在备用空气冷却模式中向电子部件提供备用冷却，以及耦合到 散热器。 制冷剂加热器通过散热器与通过制冷剂蒸发器的制冷剂热连通，并且被控制在主要的冷冻冷却模式中，以对通过制冷剂蒸发器的制冷剂施加辅助热负荷，以确保制冷剂回路中的制冷剂 进入压缩机处于过热的热力学状态。
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公开(公告)号：US09285050B2
公开(公告)日：2016-03-15
申请号：US13783628
申请日：2013-03-04
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: F16K31/002 , F28F3/12 , F28F27/00 , F28F27/02 , H05K7/20781 , H05K7/20836
Abstract: Methods are presented for facilitating dissipation of heat generated by one or more electronic components. The methods include providing a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).
Abstract translation: 提出了用于促进由一个或多个电子部件产生的热量消散的方法。 这些方法包括提供冷却剂冷却的散热器和恒温控制阀。 散热器包括一个或多个冷却剂承载通道和与通道相交的一个或多个阀井。 恒温控制阀至少部分地设置在相应的阀井内，以与相应的冷却剂承载通道相交，并且包括阀盘和机械耦合以旋转阀盘的热敏致动器。 阀盘可以在允许冷却剂流过相应的冷却剂输送通道的打开位置和阻止冷却剂流过相应通道的关闭位置之间旋转。 执行器根据电子部件对热敏致动器的加热，使阀盘在打开位置和关闭位置之间旋转。
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公开(公告)号：US09261308B2
公开(公告)日：2016-02-16
申请号：US13671857
申请日：2012-11-08
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: F28D15/02 , F28F3/048 , F28F3/12 , F28F2250/08 , H05K7/203 , H05K7/20772 , H05K7/20809 , Y10T29/4935 , Y10T29/49359
Abstract: Cooling apparatuses and methods of fabrication thereof are provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.
Abstract translation: 提供冷却装置及其制造方法以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。
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公开(公告)号：US09218008B2
公开(公告)日：2015-12-22
申请号：US13706543
申请日：2012-12-06
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
CPC classification number: H05K7/20836 , G05B15/02 , G05D23/1932 , H05K7/2079
Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.
Abstract translation: 部分地基于组件的加权冷却效率来提供电子系统的冷却系统冷却的能量效率控制。 该控制包括自动确定冷却系统的多个可调冷却部件的速度控制设置。 所述自动确定至少部分地基于所述冷却系统的组件的加权冷却效果，并且所述确定操作以限制至少所述冷却系统的功率消耗，同时确保与至少一个 冷却系统或电子系统在所需的范围内，通过基于加权的冷却效果，提供冷却系统的多个可调冷却部件之间的期望的目标温度变化。 供应包括至少部分地通过所确定的控制设置向多个可调冷却部件供应应用的功率。
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40.发明授权公开(公告)号：US09201474B2
公开(公告)日：2015-12-01
申请号：US14519422
申请日：2014-10-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
CPC classification number: H05K7/20818 , G06F1/20 , G06F2200/201 , H05K7/2029 , H05K7/20309 , H05K7/20318 , H05K7/20809
Abstract: Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the coolant exhaust.
Abstract translation: 提供了方便冷却电子系统的方法，其包括：提供被配置为冷却电子部件的散热器，所述散热器包括用于第一冷却剂的冷却剂传送通道，所述第一冷却剂 向电子部件提供两相冷却，并以冷却剂蒸气作为冷却剂排出从散热器排出; 提供与所述散热器流体连通的节点级冷凝模块，所述冷凝模块从所述散热器接收第一冷却剂排出物，并经由第二冷却剂进行液冷，以冷却冷却剂蒸汽，然后返回到 机架式回流歧管; 自动控制散热器的液体冷却中的至少一个或冷凝模块的液体冷却; 并且提供用于调节第二冷却剂到冷凝模块的流量的控制阀，基于冷却剂排气中的冷却剂蒸汽的表征来自动控制控制阀。
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