Abstract:
An ultrasonic transmitter and receiver includes a MEMS composite transducer. The MEMS composite transducer includes a substrate. Portions of the substrate define an outer boundary of a cavity. A first MEMS transducing member includes a first size. A first portion of the first MEMS transducing member is anchored to the substrate. A second portion of the first MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. A second MEMS transducing member includes a second size that is smaller than the first size of the first MEMS transducing member. A first portion of the second MEMS transducing member is anchored to the substrate. A second portion of the second MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. A compliant membrane is positioned in contact with the first and second MEMS transducing members. A first portion of the compliant membrane covers the first and second MEMS transducing members. A second portion of the compliant membrane is anchored to the substrate.
Abstract:
A method of continuously ejecting liquid includes providing a liquid ejection system that includes a substrate and an orifice plate affixed to the substrate. Portions of the substrate define a liquid chamber. The orifice plate includes a MEMS transducing member. A first portion of the MEMS transducing member is anchored to the substrate. A second portion of the MEMS transducing member extends over at least a portion of the liquid chamber. The second portion of the MEMS transducing member is free to move relative to the liquid chamber. A compliant membrane is positioned in contact with the MEMS transducing member. A first portion of the compliant membrane covers the MEMS transducing member and a second portion of the compliant membrane is anchored to the substrate. The compliant membrane includes an orifice. Liquid is provided under a pressure sufficient to eject a continuous jet of the liquid through the orifice located in the compliant membrane of the orifice plate by a liquid supply. A drop of liquid is caused to break off from the liquid jet by selectively actuating the MEMS transducing member which causes a portion of the compliant membrane to be displaced relative to the liquid chamber.
Abstract:
A liquid dispenser includes a substrate. A first portion of the substrate defines a liquid dispensing channel including an outlet opening. A second portion of the substrate defines an outer boundary of a cavity. Other portions of the substrate define a liquid supply channel and a liquid return channel. A liquid supply provides a continuous flow of liquid from the liquid supply through the liquid supply channel through the liquid dispensing channel through the liquid return channel and back to the liquid supply. A diverter member is selectively actuatable to divert a portion of the liquid flowing through the liquid dispensing channel through outlet opening of the liquid dispensing channel. The diverter member includes a MEMS transducing member. A first portion of the MEMS transducing member is anchored to the substrate. A second portion of the MEMS transducing member extends over at least a portion of the cavity and is free to move relative to the cavity. A compliant membrane is positioned in contact with the MEMS transducing member. A first portion of the compliant membrane covers the MEMS transducing member. A second portion of the compliant membrane is anchored to the substrate such that the compliant membrane forms a portion of a wall of the liquid dispensing channel. The wall is positioned opposite the outlet opening.
Abstract:
An apparatus for producing a separate pulse width modulation signal for each of a plurality of integrated devices, comprising circuitry for each integrated device having structures that :receive and convert a digital signal for each integrated device to an analog voltage level; sample the analog voltage level and storing such analog voltage level; and compare the stored analog voltage level to a common dynamic reference signal and producing a variable width pulse having a first level when the reference signal is above the analog voltage level and a second level when the reference signal is below the analog voltage level, wherein the common dynamic reference signal is the same signal for each integrated device
Abstract:
Device comprising an ohmic via contact, and method of fabricating thereof. A preferred embodiment comprises forming a metal layer over a substrate, forming a conductive barrier layer over the metal layer, depositing an insulating layer over the conductive barrier layer, creating an opening in the insulating layer to expose the conductive barrier layer, and forming a via contact in the opening. The conductive barrier layer protects the metal layer by preventing the formation of an oxide layer, which could reduce conductivity.
Abstract:
A method of operating a semiconductor device, a semiconductor device and a digital micromirror system are presented. In an embodiment, the semiconductor device comprises a grounded substrate, a memory array, and a reset driver. The memory array may be isolated from the grounded substrate with a buried layer. The set of voltages of the memory array may be shifted with respect to a reset voltage. The reset driver may drive the reset voltage and the reset driver may have at least one extended drain transistor in the grounded substrate.
Abstract:
A micromirror array fabricated on a semiconductor substrate. The array is comprised of three operating layers. An addressing layer is fabricated on the substrate. A hinge layer is spaced above the addressing layer by an air gap. A mirror layer is spaced over the hinge layer by a second air gap. The hinge layer has a hinge under and attached to the mirror, the hinge permitting the mirror to tilt. The hinge layer further has spring tips under the mirror, which are attached to the addressing layer. These spring tips provide a stationary landing surface for the mirror.
Abstract:
Failsafe interface circuits are provided for an integrated circuit having a core logic section providing a signal to, or receiving a signal from, a bond pad connection. The interface circuits employ high voltage tolerant, extended drain devices in circuit arrangements which insure that the stress of a failsafe event is only exhibited by the extended drain devices. A failsafe event is defined as a bond pad voltage which exceeds the supply voltage of the integrated circuit plus the threshold voltage of the transistors within the integrated circuit. Both failsafe output driver circuit and failsafe receiver circuit embodiments are provided.
Abstract:
A spatial light modulator with an anti-reflective coating (ARC) 100 integrated into its structure. The manufacturing of the device is altered to include deposition of an ARC 100, and any necessary patterning and etching to allow the elements of the array to operate properly. The ARC could reside in several places of the element structure including over the addressing circuitry 26, over a middle layer 32 or on the underside of the reflective structure 10. Micromechanical spatial light modulators, as well as non-moving modulators, such as reflective and transmissive LCD modulators can use the invention.
Abstract:
An improved memory cell (300) for use in applications, such as micromirror arrays, in which little space is available and a slow read-back cycle is tolerated. The memory (300) comprises a first input/output node (314) connected to the input of a first inverter and to the output of a second inverter. The first inverter is comprised of two transistors (304, 306) and drives a signal to a second input/output node (316). The input of the second inverter is connected to the second input/output node (316). When used to drive a typical micromirror cell, the address electrode of the micromirror cell are electrically connected to the first input/output node (314) and the second input/output node (316).