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39 条记录 (耗时 0.031 秒)

    Method for controlling plating rate in an electroless plating system
    32.
    发明授权
    Method for controlling plating rate in an electroless plating system 失效
    无电镀系统中电镀速率控制方法

    公开(公告)号：US4623554A

    公开(公告)日：1986-11-18

    申请号：US709955

    申请日：1985-03-08

    申请人： Ronald A. Kaschak ,  Roy H. Magnuson ,  Edward J. Yarmchuk

    发明人： Ronald A. Kaschak ,  Roy H. Magnuson ,  Edward J. Yarmchuk

    IPC分类号： H05K3/18 ,  C23C18/16 ,  C23C18/31 ,  C23C18/40

    CPC分类号： C23C18/1683 ,  C23C18/1617 ,  C23C18/405

    摘要： Method for controlling plating in an electroless plating process. The plating rate is continuously monitored. The plating rate is compared with a set point plating rate. A control voltage is derived proportional to the difference in plating rate and the desired plating rate, the integral of the difference, and the derivative of the difference. The control voltage is applied to a replenishment control for controlling the replenishment rate of a constituent chemical of the plating process.

    摘要翻译： 在无电镀工艺中控制电镀的方法。 连续监测电镀速率。 将电镀速率与设定点电镀速率进行比较。 导出的控制电压与电镀速率和期望电镀速率的差值，差值的积分以及差分的导数成正比。 控制电压被施加到用于控制电镀处理的组成化学品的补充速率的补充控制。

    Removal of metal skin from a copper-Invar-copper laminate
    36.
    发明授权
    Removal of metal skin from a copper-Invar-copper laminate 失效
    从铜Inv铜层压板去除金属表皮

    公开(公告)号：US06228246B1

    公开(公告)日：2001-05-08

    申请号：US09347581

    申请日：1999-07-01

    申请人： Madhav Datta ,  Raymond T. Galasco ,  Lawrence P. Lehman ,  Roy H. Magnuson ,  Robin A. Susko ,  Robert D. Topa

    发明人： Madhav Datta ,  Raymond T. Galasco ,  Lawrence P. Lehman ,  Roy H. Magnuson ,  Robin A. Susko ,  Robert D. Topa

    IPC分类号： C25F300

    CPC分类号： H05K3/44 ,  C25F3/00 ,  H05K3/07 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2203/0285 ,  H05K2203/0361

    摘要： A method of removing a metal skin from a through-hole surface of a copper-Invar-copper (CIC) laminate without causing differential etchback of the laminate. The metal skin includes debris deposited on the through-hole surface as the through hole is being formed by laser or mechanical drilling of a substrate that includes the laminate as an inner plane. Removing the metal skin combines electrochemical polishing (ECP) with ultrasonics. ECP dissolves the metal skin in an acid solution, while ultrasonics agitates and circulates the acid solution to sweep the metal skin out of the through hole. ECP is activated when a pulse power supply is turned on and generates a periodic voltage pulse from a pulse power supply whose positive terminal is coupled to the laminate and whose negative terminal is coupled to a conductive cathode. After the metal skin is removed, the laminate is differentially etched such that the copper is etched at a faster rate than the Invar. To prevent the differential etching, a copper layer is formed on a surface of the substrate with an electrical resistance R1 between the copper layer and the positive terminal of the pulse power supply. Additionally, an electrical resistance R2 is formed between the laminate and the positive terminal of the pulse power supply. Adjustment of R1 and R2 controls the relative etch rates of the copper and the Invar.

    摘要翻译： 从铜 - 堇青铜（CIC）层压板的通孔表面去除金属表皮而不会引起层压板的不均匀回蚀的方法。 金属皮肤包括沉积在通孔表面上的碎屑，因为通孔是通过激光或机械钻孔形成的，所述基底包括层压体作为内平面。 去除金属皮肤结合电化学抛光（ECP）与超声波。 ECP将金属皮肤溶解在酸性溶液中，同时超声波搅拌并循环酸溶液以将金属皮肤从通孔中扫出。 当脉冲电源接通时，ECP被激活，并从脉冲电源产生周期性的电压脉冲，该脉冲电源的正极端子耦合到层压板并且其负极端子连接到导电阴极。 在去除金属表皮之后，层压体被差异蚀刻，使得以比Invar更快的速度蚀刻铜。 为了防止差分蚀刻，在衬底的表面上在铜层和脉冲电源的正端之间具有电阻R1形成铜层。 此外，在层压体和脉冲电源的正极端之间形成电阻R2。 R1和R2的调整控制铜和殷钢的相对蚀刻速率。

    Electroless plating with bi-level control of dissolved oxygen
    39.
    发明授权
    Electroless plating with bi-level control of dissolved oxygen 失效
    无电镀，双层控制溶解氧

    公开(公告)号：US4684545A

    公开(公告)日：1987-08-04

    申请号：US827427

    申请日：1986-02-10

    申请人： Edmond O. Fey ,  Peter Haselbauer ,  Dae Y. Jung ,  Ronald A. Kaschak ,  Hans-Dieter Kilthau ,  Roy H. Magnuson ,  Robert J. Wagner

    发明人： Edmond O. Fey ,  Peter Haselbauer ,  Dae Y. Jung ,  Ronald A. Kaschak ,  Hans-Dieter Kilthau ,  Roy H. Magnuson ,  Robert J. Wagner

    IPC分类号： C23C18/31 ,  C23C18/16 ,  C23C18/40 ,  H05K3/18

    CPC分类号： C23C18/40 ,  C23C18/1617 ,  C23C18/1683 ,  H05K3/187

    摘要： Nodule formation in a continuous electroless copper plating system is minimized by independently controlling the dissolved oxygen contents on the plating solution in the bath and in the associated external piping. The level of dissolved oxygen in the plating tank is maintained at a value such that satisfactory plating takes place. At the point where the plating solution leaves the tank, additional oxygen gas is introduced into the solution so that the level of dissolved oxygen in the plating solution in the external piping is high enough to prevent any plating from taking place in the external piping and so that in the external piping the copper is etched or dissolved back into solution. At the end of the external piping, the dissolved oxygen level is reduced so that the dissolved oxygen level of the plating solution in the tank is maintained at the level where plating will take place.

    摘要翻译： 通过独立地控制浴中的镀液和相关的外部管道中的溶解氧含量，使连续化学镀铜系统中的结节形成最小化。 电镀槽中的溶解氧水平保持在这样的值，使得发生令人满意的电镀。 在电镀溶液离开槽的位置，将另外的氧气引入溶液中，使得外部管道中的电镀溶液中的溶解氧水平足够高，以防止在外部管道中发生任何电镀，因此 在外部管道中，铜被蚀刻或溶解回溶液中。 在外部管道的末端，溶解氧水平降低，使得罐中的电镀液的溶解氧水平保持在电镀的水平。