Semiconductor device and a method of manufacturing the same
    31.
    发明申请
    Semiconductor device and a method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US20060024906A1

    公开(公告)日:2006-02-02

    申请号:US11116190

    申请日:2005-04-28

    Applicant: Kazuhide Abe

    Inventor: Kazuhide Abe

    Abstract: The present invention provides a semiconductor device, having: a semiconductor substrate; a first electrode formed over the semiconductor substrate; a first insulation film covering the first electrode and having an aperture for exposing a part of the first electrode; a first conductive film formed on a part of the first insulation film and the first electrode inside the aperture; an isolation region placed inside the aperture; and a second conductive film formed on the first conductive film and the isolation region.

    Abstract translation: 本发明提供一种半导体器件,具有:半导体衬底; 形成在半导体衬底上的第一电极; 覆盖所述第一电极并具有用于暴露所述第一电极的一部分的孔的第一绝缘膜; 形成在第一绝缘膜的一部分上的第一导电膜和孔内的第一电极; 放置在孔内的隔离区; 以及形成在第一导电膜和隔离区上的第二导电膜。

    Tunable filter and portable telephone
    32.
    发明申请
    Tunable filter and portable telephone 失效
    可调滤波器和便携式电话

    公开(公告)号:US20050212612A1

    公开(公告)日:2005-09-29

    申请号:US11039872

    申请日:2005-01-24

    Abstract: A tunable filter has a plurality of variable capacitors and a plurality of inductor elements, each being formed on a common substrate, a filter circuit formed by using at least a portion of the plurality of variable capacitors and a portion of the plurality of inductor elements, a monitor circuit formed by using at least a portion of the plurality of variable capacitors and a portion of the plurality of inductor elements, a detecting circuit which detects a prescribed circuit constant of the monitor circuit, a storage which stores information relating to a reference circuit constant of the monitor circuit, and a capacitance control circuit which controls capacitance of the variable capacitors in the monitor circuit and capacitance of the variable capacitors in the filter circuit, based on a result detected by the detecting circuit and information stored in the storage.

    Abstract translation: 可调谐滤波器具有多个可变电容器和多个电感器元件,每个电感器元件形成在公共基板上,通过使用多个可变电容器的至少一部分和多个电感器元件的一部分形成的滤波器电路, 通过使用多个可变电容器的至少一部分和多个电感器元件的一部分形成的监视电路,检测监视电路的规定电路常数的检测电路,存储与参考电路有关的信息的存储器 基于由检测电路检测的结果和存储在存储器中的信息,控制监视电路中的可变电容器的电容和滤波器电路中的可变电容器的电容的电容控制电路。

    Thin film piezoelectric actuator
    33.
    发明申请
    Thin film piezoelectric actuator 失效
    薄膜压电致动器

    公开(公告)号:US20050194867A1

    公开(公告)日:2005-09-08

    申请号:US11054404

    申请日:2005-02-10

    CPC classification number: H01G7/06 H01H2057/006 H01L41/0933 H01L41/094

    Abstract: A thin film piezoelectric actuator comprises a driving part at least one end of which is supported by an anchor portion. The driving part includes: a piezoelectric film, a first lower electrode provided under a first region of the piezoelectric film, a second lower electrode provided under a second region different from the first region of the piezoelectric film, a first upper electrode provided opposite to the first lower electrode on the piezoelectric film, a second upper electrode provided opposite to the second lower electrode on the piezoelectric film, a first connection part that electrically connects the first lower electrode and the second upper electrode via a first via hole formed in the piezoelectric film, and a second connection part that electrically connects the second lower electrode and the first upper electrode via a second via hole formed in the piezoelectric film.

    Abstract translation: 薄膜压电致动器包括驱动部件,其至少一端由锚固部分支撑。 驱动部包括:压电膜,设置在压电膜的第一区域下方的第一下电极,设置在与压电膜的第一区不同的第二区域下方的第二下电极,与第一下电极相对设置的第一上电极 压电膜上的第一下电极,与压电膜上的第二下电极相对设置的第二上电极,经由形成在压电膜中的第一通孔电连接第一下电极和第二上电极的第一连接部 以及第二连接部,其经由形成在所述压电膜中的第二通路孔电连接所述第二下部电极和所述第一上部电极。

    Method of forming buried wiring in semiconductor device

    公开(公告)号:US20050009319A1

    公开(公告)日:2005-01-13

    申请号:US10765155

    申请日:2004-01-28

    Applicant: Kazuhide Abe

    Inventor: Kazuhide Abe

    CPC classification number: H01L21/7685 H01L21/7684 H01L21/76867

    Abstract: A method of forming buried wiring, includes the steps of forming an insulating layer having a trench on a semiconductor substrate; forming a conductive layer mainly composed of copper on the insulating layer in such a manner that the trench is filled with the conductive layer; removing an oxide layer generated in a surface of the conductive layer by oxidation; forming a cap layer made of a material having less mechanical strength than the oxide layer, on the conductive layer; and removing the cap layer and a part of the conductive layer by chemical mechanical polishing in such a manner that the conductive layer is left in the trench.

    Infrared detection element and infrared detector
    35.
    发明授权
    Infrared detection element and infrared detector 失效
    红外探测元件和红外探测器

    公开(公告)号:US06797957B2

    公开(公告)日:2004-09-28

    申请号:US10097405

    申请日:2002-03-15

    CPC classification number: H01L37/02

    Abstract: An infrared detection element having a single-crystalline base layer 3 with a thickness of 50 nm to 10 &mgr;m having a principal surface, a first electrode layer 4 formed on the principal surface of the single-crystalline base layer 3, a ferroelectric layer 5 which is formed on the first electrode layer 4 and is composed of a single-crystalline layer or a unidirectionally oriented layer. Distortion of the single-crystalline layer or a unidirectionally oriented layer in a surface parallel to the principal surface of the single-crystalline base layer 3 is elastically constrained by the single-crystalline base layer 3. The infrared detection element further has a second electrode layer 6 formed on the ferroelectric layer 5. An amount of charge varies with changes in temperature caused by irradiation of infrared light to the ferroelectric layer 5.

    Abstract translation: 具有厚度为50nm〜10μm的具有主面的单晶基底层3的红外线检测元件,形成在单晶基底层3的主面上的第一电极层4,强电介质层5 形成在第一电极层4上,由单晶层或单向取向层构成。 在与单晶基底层3的主表面平行的表面中的单晶层或单向取向层的失真由单晶基底层3弹性约束。红外线检测元件还具有第二电极层 形成在铁电层5上。电荷量随着红外光照射到铁电层5而引起的温度变化。

    Method of embedding contact hole by damascene method
    37.
    发明授权
    Method of embedding contact hole by damascene method 失效
    通过镶嵌法嵌入接触孔的方法

    公开(公告)号:US06455430B2

    公开(公告)日:2002-09-24

    申请号:US09431181

    申请日:1999-11-01

    Applicant: Kazuhide Abe

    Inventor: Kazuhide Abe

    CPC classification number: H01L21/76802 H01L21/3146 H01L21/3212 H01L21/7684

    Abstract: A carbon film is formed over an insulating film and a contact hole is defined therein by patterning. Copper is formed over an entire surface including the contact hole and polished by chemical mechanical polishing. The polishing of the copper is terminated with the carbon film as an etching stopper thereby to allow the copper to remain in the contact hole alone, whereby an embedded interconnection made up of the copper is formed by a damascene method.

    Abstract translation: 在绝缘膜上形成碳膜,通过图案化形成接触孔。 铜在包括接触孔的整个表面上形成并通过化学机械抛光抛光。 用碳膜作为蚀刻停止器终止铜的抛光,从而允许铜单独留在接触孔中,由此通过镶嵌法形成由铜构成的嵌入式互连。

    Method for forming an interconnection in a semiconductor element
    38.
    发明授权
    Method for forming an interconnection in a semiconductor element 失效
    在半导体元件中形成互连的方法

    公开(公告)号:US6103618A

    公开(公告)日:2000-08-15

    申请号:US346943

    申请日:1999-07-02

    Applicant: Kazuhide Abe

    Inventor: Kazuhide Abe

    Abstract: A method for forming an interconnection in a semiconductor element includes a process for forming a groove on an underlying substrate so as to correspond to the designed pattern of the interconnection. An underlayer for improving crystalline orientation of the interconnection is formed on the underlying substrate having the groove. A thin film of interconnection material is formed in the groove and a heattreatment process is carried out to ensure that the groove is filled with the thin film of the interconnection material. Formation of the interconnection is completed by polishing the surface of the thin film by a predetermined quantity.

    Abstract translation: 在半导体元件中形成互连的方法包括在下面的基底上形成与所设计的互连图案对应的凹槽的工艺。 用于改善互连结晶取向的底层形成在具有凹槽的底层基底上。 在槽中形成互连材料的薄膜,并进行热处理工艺,以确保槽被互连材料的薄膜填充。 通过以预定量抛光薄膜的表面来完成互连的形成。

    Thin film capacitor
    39.
    发明授权
    Thin film capacitor 失效
    薄膜电容器

    公开(公告)号:US5889299A

    公开(公告)日:1999-03-30

    申请号:US804394

    申请日:1997-02-21

    CPC classification number: H01L28/55

    Abstract: A thin film capacitor including a first electrode having on its surface a (100) face of cubic system or a (001) face of tetragonal system, a dielectric thin film epitaxially grown on the first electrode and exhibiting a crystal structure which inherently belongs to a perovskite structure of cubic system, and a second electrode formed on the dielectric thin film. Further, the dielectric thin film meets the following relationship V/V.sub.0 .gtoreq.1.01 where a unit lattice volume of true perovskite crystal structure belonging to the cubic system (lattice constant a.sub.0) is represented by V.sub.0 =a.sub.0.sup.3, and a unit lattice volume (lattice constant a=b.noteq.c) which is strained toward a tetragonal system after the epitaxial growth is represented by V=a.sup.2 c, and also meets the following relationship c/a.gtoreq.1.01 where c/a represents a ratio between a lattice constant "c" in the direction thicknesswise of the film and a lattice constant "a" in the direction parallel with a plane of the film.

    Abstract translation: 一种薄膜电容器,包括在其表面上具有立方体系的(100)面或四方晶系的(001)面的第一电极,在第一电极上外延生长并呈现出固有地属于 立方体的钙钛矿结构,以及形成在电介质薄膜上的第二电极。 此外,电介质薄膜满足以下关系V / V0 / = 1.01,其中属于立方体系的真实钙钛矿晶体结构的单位晶格体积(晶格常数a0)由V0 = a03表示,单位晶格体积 晶格常数a = b NOTEQUAL c),其外延生长后由V = a2c表示为四方晶系,并满足以下关系c / a> / = 1.01其中c / a表示晶格常数 在膜的厚度方向上的“c”和与膜的平面平行的方向上的晶格常数“a”。

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