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31.发明授权Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith 失效包含环氧树脂组合物的萘环和其中包含的半导体器件
公开(公告)号：US5190995A
公开(公告)日：1993-03-02
申请号：US645498
申请日：1991-01-24
CPC分类号： H01L23/293 , C08G59/08 , C08G59/3218 , C08G59/621 , C08L63/04 , H01B3/40 , H01L2924/0002
摘要： Epoxy resin compositions comprising (A) an epoxy resin of formula (1), (B) a curing agent based on a novolak type phenol resin and/or a triphenolalkane resin of formula (2), and (C) an inorganic filler are suitable for encapsulating semiconductor elements because they show good flow behavior upon casting and cure into less stressed products having improved mechanical strength, Tg, and moisture resistance. ##STR1## R.sup.1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR2## m is 0, 1 or 2, n is 1 or 2, and l is 0, 1, 2 or 3.
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公开(公告)号：US5173544A
公开(公告)日：1992-12-22
申请号：US523814
申请日：1990-05-16
摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, and a copolymer mixture comprising a long-chain organopolysiloxane copolymer [I] and a short-chain organopolysiloxane copolymer [II] which are each prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain or short-chain organopolysiloxane containing pendant phenyl groups at a weight ratio of [II] to [I] of 0.3 to 0.6 is disclosed. The epoxy resin composition exhibits excellent printability, crack resistance, and moldability properties.
摘要翻译： 包含环氧树脂，固化剂和包含长链有机聚硅氧烷共聚物[I]和短链有机聚硅氧烷共聚物[II]的共聚物混合物的环氧树脂组合物，其各自通过含链烯基的 公开了具有含有重量比[II]至[I]为0.3至0.6的侧基苯基的长链或短链有机聚硅氧烷的环氧树脂。 环氧树脂组合物表现出优异的可印刷性，抗龟裂性和成型性。
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33.发明授权
公开(公告)号：US5162400A
公开(公告)日：1992-11-10
申请号：US713841
申请日：1991-06-12
IPC分类号： C08G59/62 , C08G8/00 , C08G8/08 , C08G59/00 , C08G59/20 , C08G59/24 , C08G59/32 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/3218 , C08L63/00 , H01B3/40 , H01L2924/0002
摘要： An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.
摘要翻译： 一种环氧树脂组合物，其包含（A）在分子中具有至少两个环氧基的环氧树脂，（B）分子中具有至少一个萘环的酚醛树脂和（C）无机填料，具有改善的流动性和固化性 具有低膨胀系数，高Tg，低吸湿性的产品。 因此，该组合物适用于封装半导体器件。
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34.发明授权
公开(公告)号：US4701479A
公开(公告)日：1987-10-20
申请号：US865390
申请日：1986-05-21
摘要： The inorganic filler in the inventive epoxy resin-based composition is a combination of two kinds of quartz powder of which one is a quartz powder having a spherical particle form and the other is a pulverized quartz powder in a specified proportion. The resin composition is highly flowable and capable of giving encapsulation of semiconductor devices with little fins having outstandingly small thermal expansion coefficient and highly resistant against crack formation.
摘要翻译： 本发明环氧树脂基组合物中的无机填料是两种石英粉末的组合，其中一种是具有球形颗粒形式的石英粉末，另一种是规定比例的粉碎石英粉末。 该树脂组合物是高度流动的并且能够使具有极小的热膨胀系数的小翅片的半导体器件封装，并且高度抗裂纹形成。
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35.发明授权公开(公告)号：US06723452B2
公开(公告)日：2004-04-20
申请号：US10196222
申请日：2002-07-17
申请人： Yasuo Kimura , Kazutoshi Tomiyoshi , Tarou Shimoda , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
发明人： Yasuo Kimura , Kazutoshi Tomiyoshi , Tarou Shimoda , Eiichi Asano , Takayuki Aoki , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： H01L23/293 , C08G59/20 , C08G59/245 , C08G59/3218 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L2666/22 , H01L2924/00
摘要： Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.
摘要翻译： 环氧树脂组合物，其包含（A）环氧当量至少为185的具有两个苯环可以直接键合的结构的环氧树脂，具有sp 2类型原子轨道的碳原子占至少50％ 所有碳原子，（B）β-萘酚型酚醛树脂固化剂，（C）固化促进剂，和（D）无机填料固化成使用无铅焊料和改善火焰时具有令人满意的耐焊料裂纹性的产品 尽管不存在卤化环氧树脂和锑化合物，因此适用于半导体封装。
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36.发明授权公开(公告)号：US06518332B2
公开(公告)日：2003-02-11
申请号：US09841046
申请日：2001-04-25
IPC分类号： C08K310
CPC分类号： H01L23/293 , C08G59/3218 , C08K9/12 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L61/04 , H01L2924/00
摘要： Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.
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37.发明授权公开(公告)号：US06274251B1
公开(公告)日：2001-08-14
申请号：US09337520
申请日：1999-06-22
申请人： Kenji Ohashi , Tatsuya Ishizaki , Masayuki Umeno , Eiichi Asano , Kazutoshi Tomiyoshi , Shoichi Osada , Toshio Shiobara
发明人： Kenji Ohashi , Tatsuya Ishizaki , Masayuki Umeno , Eiichi Asano , Kazutoshi Tomiyoshi , Shoichi Osada , Toshio Shiobara
IPC分类号： C09D16300
CPC分类号： H01L23/293 , C08G59/688 , C08L63/00 , H01L2924/0002 , Y10T428/12528 , C08L61/04 , H01L2924/00
摘要： An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. The composition is effectively flowable, moldable and curable and thus suitable for semiconductor encapsulation.
摘要翻译： 环氧树脂组合物含有（A）环氧树脂，（B）酚醛树脂固化剂，（C）固化催化剂和（D）无机填料。 催化剂是与具有至少两个羟基的酚醛树脂混合并反应的季磷化合物或季磷化合物。 该组合物是有效流动的，可模制的和可固化的，因此适合于半导体封装。
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公开(公告)号：US06207296B1
公开(公告)日：2001-03-27
申请号：US09326588
申请日：1999-06-07
IPC分类号： H01L2912
CPC分类号： H01L23/295 , C01P2004/32 , C01P2004/61 , C01P2006/12 , C01P2006/22 , C01P2006/80 , C08K7/18 , C09C1/3009 , C09C3/04 , H01L2924/0002 , Y10T428/12528 , C08L63/00 , H01L2924/00
摘要： By removing a fraction of fine particles having a particle size of less than 2 &mgr;m from starting inorganic filler particles having a mean particle size of 10-50 mm and adding thereto particles having a mean particle size of 0.1-2 &mgr;m and a specific surface area of 3-10 m2/g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 &mgr;m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.
摘要翻译： 通过从平均粒径为10-50mm的起始无机填料颗粒中除去粒径小于2μm的一部分细粒，并加入平均粒径为0.1-2μm的颗粒和比表面积 为3-10m 2 / g（BET），得到平均粒度为5-40μm的颗粒状无机填料。 当大量的无机填料装载在环氧树脂组合物中时，该组合物保持足够低的熔体粘度以成型，并且对于封装半导体器件而言不会引起芯片焊盘的变形和焊丝变形。 封装的半导体器件是高度可靠的。
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39.发明授权公开(公告)号：US06177489B1
公开(公告)日：2001-01-23
申请号：US09003517
申请日：1998-01-06
申请人： Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
发明人： Satoshi Okuse , Kazutoshi Tomiyoshi , Toshio Shiobara , Takayuki Aoki , Eiichi Asano , Shigeki Ino
IPC分类号： C08L6302
CPC分类号： H01L23/295 , C08G59/245 , C08G59/621 , C08K3/36 , C08K5/20 , C08K5/5397 , C08K5/54 , C08L63/00 , C09K21/14 , H01L2924/0002 , C08L83/00 , C08L2666/22 , H01L2924/00
摘要： A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.
摘要翻译： 适用于半导体封装的阻燃性环氧树脂组合物含有（A）30重量％间甲酚溶液在25℃时粘度低于80厘泊的结晶环氧树脂，（B）具有至少两个 酚羟基和（C）二氧化硅。 组合物任选地含有（D）有机聚硅氧烷，（E）有机氧化膦，（F）含酰胺基的脱模剂和/或（G）硅烷偶联剂。 固化的组合物获得UL-94V-0的阻燃等级，而不需要阻燃剂并在高温下保持稳定。
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40.发明授权
公开(公告)号：US6162878A
公开(公告)日：2000-12-19
申请号：US310999
申请日：1999-05-13
IPC分类号： C08G59/08 , C08G59/20 , C08G59/40 , C08G59/62 , C08K3/00 , C08L61/04 , C08L63/00 , C08L83/04 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/08 , C08G59/4085 , C08L61/04 , C08L63/00 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
摘要翻译： 一种环氧树脂组合物，其包含（A）含有联苯骨架的环氧树脂，（B）含有联苯骨架的酚醛树脂作为固化剂，（C）含有苯基和有机氧基的有机硅氧烷和（D）无机填料， 适用于半导体封装，因为它可以有效地模制，并固化成具有改善的回流裂纹性，耐湿性和阻燃性的部分。 它不会对人体健康或环境构成危害。
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