Abstract:
A memory device includes a block of memory cells having a plurality of levels. Each level includes strips of memory cells extending in a first direction between first and second ends of the block. A first bit line structure, at each level at the first end, is coupled to a first string of memory cells extending from the first end. A second bit line structure, at each level at the second end, is coupled to a second string of memory cells extending from said second end. Bit line pairs extend in the first direction with each including odd and even bit lines. Odd and even bit line connectors connect the odd and even bit lines to the second and first bit line structures, respectively. Each bit line for a series of bit line pairs are separated by a bit line of an adjacent pair of bit lines.
Abstract:
A compute in memory device comprises a memory array including a plurality of data lines for parallel access to memory array data, and an input/output interface. Data path circuits between the memory array and the input/output interface include a page buffer, each buffer cell of the page buffer including a plurality of storage elements. A plurality of computation circuits is provided connected to respective buffer cells. The computation circuits execute a function of data in the storage elements of the respective buffer cells and can be configured in parallel to generate a results data page including operation results for the plurality of buffer cells. A data analysis circuit is connected to the data path circuits to execute a function of the results data page to generate an analysis result. A register can be provided to store the analysis result accessible via the input/output interface.
Abstract:
A memory device includes a data register operatively coupled to the memory array, a cache operatively coupled to the data register, and an input/output interface operatively coupled to the cache. A controller executes a continuous page read operation to sequentially load pages to the data register and move the pages to the cache, in response to a page read command, executes the cache read operation in response to a cache read command to move data from the cache to the input/output interface, and to stall moving of the data from the cache until a next cache read command, and terminates the continuous page read operation in response to a terminate command.
Abstract:
A memory controller accesses a memory page in a memory block of a storage memory array of a memory device. The memory controller reads memory data stored in the accessed memory page. The memory controller determines a number of error bits associated with the memory data. The memory controller obtains an erase count corresponding to the accessed memory page, the erase count indicating a number of erase operations performed on the accessed memory page. The memory controller determines, from among one or more error threshold values, an error threshold value based at least on the erase count. The memory controller determines a relationship between the number of error bits and the error threshold value. The memory controller triggers a data refresh for the accessed memory block if the relationship between the number of error bits and the error threshold value satisfy a known criterion.
Abstract:
Field configurable bad block repair for a memory array comprising a plurality of blocks utilizes a block repair information store for data identifying one or more bad blocks in the array. The block repair information store includes nonvolatile memory writable at least once. Block repair circuitry on the device is configurable to redirect commands to access bad blocks identified in the bad block repair information store to reserved blocks in the memory array. A controller is responsive to a command to write bad block repair information, such as an identifier of a bad block in the plurality of blocks to the block repair information store in the field, and to reconfigure the block repair circuitry in the field using the updated information.
Abstract:
A circuit for adjusting a select gate voltage of a non-volatile memory is provided. The circuit includes a well, a select gate, an adjustment unit, and a switch. There is a capacitive coupling between the well and the select gate. The adjustment unit generates a driving voltage for the select gate. The switch is coupled in series with the adjustment unit between the select gate and the well.
Abstract:
An integrated circuit memory includes a memory array, including a plurality of data lines. A buffer structure is coupled to the plurality of data lines, including a plurality of storage elements to store bit-level status values for the plurality of data lines. The memory includes logic to indicate bundle-level status values of corresponding bundles of storage elements in the buffer structure based on the bit-level status values of bits in the corresponding bundles. A plurality of bundle status circuits is arranged in a daisy chain and coupled to respective bundles in the buffer structure, producing an output of the daisy chain indicating detection of a bundle in the first status. Control circuitry executes cycles to determine the output of the daisy chain, each cycle clearing a bundle status circuit indicating the first status if the output indicates detection of a bundle in the first status in the cycle.
Abstract:
A circuit for adjusting a select gate voltage of a non-volatile memory is provided. The circuit includes a well, a select gate, an adjustment unit, and a switch. There is a capacitive coupling between the well and the select gate. The adjustment unit generates a driving voltage for the select gate. The switch is coupled in series with the adjustment unit between the select gate and the well.
Abstract:
A memory circuit includes word lines coupled to a memory array, including a first set of one or more word lines deselected in an erase operation, and a second set of one or more word lines selected in the erase operation. Control circuitry couples the first set of one or more word lines deselected in the erase operation to a reference voltage, responsive to receiving an erase command for the erase operation. Some examples further include a first transistor that switchably couples a word line to a global word line, and a second transistor that switchably couples the word line to a ground voltage. The control circuitry is coupled to the first transistor and the second transistor, wherein the control circuitry has a plurality of modes including at least an erase operation. In a first mode, the first transistor couples the word line to the global word line, and the second transistor decouples the word line from the ground voltage. In a second mode, the first transistor decouples the word line from the global word line, and the second transistor couples the word line to the ground voltage.
Abstract:
A charge storage memory is configured in a NAND array, and includes NAND strings coupled to bit lines via string select switches and includes word lines. A controller is configured to produce a bias for performing an operation on a selected cell of the NAND array. The bias includes charging the bit line while the string select switches are closed, such as to not introduce noise into the strings caused by such bit line charging. The semiconductor body regions in memory cells that are on both sides of the memory cells in the NAND strings that are coupled to a selected word line are coupled to reference voltages such that they are pre-charged while the word lines of the strings in the array are transitioned to various voltages during the operation.