Methods and Apparatus for Forming Multi-Layer Structures Including Use of A Sacrificial Patternable Mold Material
    36.
    发明申请
    Methods and Apparatus for Forming Multi-Layer Structures Including Use of A Sacrificial Patternable Mold Material 审中-公开
    形成多层结构的方法和装置,包括使用可牺牲图案的模具材料

    公开(公告)号:US20150308006A1

    公开(公告)日:2015-10-29

    申请号:US14676716

    申请日:2015-04-01

    Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

    Abstract translation: 提供了多种电化学制造方法和装置,用于使用粘附的掩模(例如由液体光致抗蚀剂或干膜形成)从多层沉积材料制备多层结构(例如具有中尺度或微尺度特征),其中两个 或者可以在每层中提供更多的材料,其中至少一种材料是结构材料,并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。 材料可以包括以无电解方式电沉积或沉积的导电材料。 在一些实施例中,特别注意确保在连续层上形成的图案之间的对准。

    Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature
    37.
    发明申请
    Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature 有权
    形成具有减小的应力和/或曲率的三维结构的方法

    公开(公告)号:US20140238865A1

    公开(公告)日:2014-08-28

    申请号:US14194564

    申请日:2014-02-28

    CPC classification number: B81C1/00666 C25D5/022

    Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

    Abstract translation: 用于生产单层或多层结构的电化学制造方法和装置,其中每个层包括至少两种材料的沉积,并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料,其在形成期间包围它,并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组,它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真,而另一些实施例试图平衡应力以最小化失真。

    Methods of Forming Parts Using Laser Machining
    38.
    发明申请
    Methods of Forming Parts Using Laser Machining 有权
    使用激光加工形成零件的方法

    公开(公告)号:US20140197145A1

    公开(公告)日:2014-07-17

    申请号:US14156437

    申请日:2014-01-15

    Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

    Abstract translation: 实施例涉及形成微尺度或毫米级结构或制造这种结构的方法,其中结构由至少一个片状结构材料形成,并且可以包括附加的片状结构材料或沉积的结构材料,其中所有或部分图案化 的结构材料通过激光切割发生。 在一些实施例中,使用选择性沉积来提供图案化的一部分。 在一些实施例中,结构材料或结构材料由牺牲桥接材料(例如金属)从下方限定,并且可能由上面由牺牲性封盖材料(例如金属)限定。

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