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公开(公告)号:US11581031B2
公开(公告)日:2023-02-14
申请号:US17338191
申请日:2021-06-03
发明人: Dale H. Hiscock , Debra M. Bell , Michael Kaminski , Joshua E. Alzheimer , Anthony D. Veches , James S. Rehmeyer
IPC分类号: G11C16/04 , G11C11/406 , G11C29/00 , G11C11/409 , G11C11/4074
摘要: Memory with partial bank refresh is disclosed herein. In one embodiment, a memory system includes a memory controller and a memory device operably connected to the memory controller. The memory device includes (i) a memory array having a memory bank with a plurality of memory cells arranged in a plurality of memory rows and (ii) circuitry. In some embodiments, the circuitry is configured to disable at least one memory row of the memory bank from receiving refresh commands such that memory cells of the at least one memory row are not refreshed during refresh operations of the memory device. In some embodiments, the memory controller is configured to track memory rows that include utilized memory cells and/or to write data to the memory rows in accordance with a programming sequence of the memory device.
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公开(公告)号:US20220335993A1
公开(公告)日:2022-10-20
申请号:US17811153
申请日:2022-07-07
发明人: Di Wu , Debra M. Bell , Anthony D. Veches , James S. Rehmeyer , Libo Wang
IPC分类号: G11C7/22 , G11C7/10 , G11C8/10 , G11C11/4096 , G11C11/4076
摘要: Tracking circuitry may be used to determine if commands and/or command sequences include illegal commands and/or illegal command sequences. If the commands and/or command sequences include illegal commands and/or illegal command sequences, the tracking circuitry may activate signals that prevent execution of the commands and/or notice of the detected illegal commands and/or command sequences.
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公开(公告)号:US11442940B2
公开(公告)日:2022-09-13
申请号:US16807692
申请日:2020-03-03
发明人: Debra M. Bell , Libo Wang , Di Wu , James S. Rehmeyer , Anthony D. Veches
IPC分类号: G06F16/2455 , G11C11/407 , G11C11/4096 , G11C11/54 , G11C7/10
摘要: Embodiments of the disclosure are drawn to apparatuses, systems, methods, and memories that are capable of performing pattern matching operations within a memory device. The pattern matching operations may be performed on data stored within the memory based on a pattern stored in a register. The result of the pattern matching operation may be provided by the memory. The data on which the pattern matching operation is performed may not be output from the memory during the pattern matching operation.
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公开(公告)号:US20220230901A1
公开(公告)日:2022-07-21
申请号:US17248344
申请日:2021-01-21
IPC分类号: H01L21/673 , B65D81/30 , B65D85/30
摘要: Containers for supporting one or more semiconductor devices therein may include walls positioned to at least partially surround a semiconductor device. At least one of the walls may include a radiation-shielding material. A support structure may be shaped, positioned, and configured to support the semiconductor device within the walls.
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公开(公告)号:US11379299B2
公开(公告)日:2022-07-05
申请号:US17214684
申请日:2021-03-26
发明人: Anthony D. Veches
IPC分类号: G06F11/10
摘要: Memory devices, systems including memory devices, and methods of operating memory devices are described, in which a memory device may select an option for a host device to access a memory array including a first portion configured to store user data and a second portion configured to store different data based on whether an ECC function of the memory device is enabled or disabled—e.g., storing ECC data when the ECC function is enabled, storing additional user data, metadata, or both when the ECC function is disabled. The host device may disable the ECC function and transmit an input to the memory device as to how to access the memory array. The memory device, based on the input, may select the option for the host device to access the memory array and communicate with the host device in accordance with the selected option.
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公开(公告)号:US20210158863A1
公开(公告)日:2021-05-27
申请号:US16693949
申请日:2019-11-25
发明人: Dale H. Hiscock , Debra M. Bell , Michael Kaminski , Joshua E. Alzheimer , Anthony D. Veches , James S. Rehmeyer
IPC分类号: G11C11/406 , G11C11/4074 , G11C11/409 , G11C29/00
摘要: Memory devices and systems with partial array refresh control over memory regions in a memory array, and associated methods, are disclosed herein. In one embodiment, a memory system includes a memory controller and a memory device operably connected to the memory controller. The memory device includes (i) a memory array having a memory bank with a plurality of memory cells arranged in a plurality of memory row and (ii) circuitry. In some embodiments, the circuitry is configured to disable at least one memory row of the memory bank from receiving refresh commands such that memory cells of the at least one row are not refreshed during refresh operations of the memory device. In some embodiments, the memory controller is configured to track memory rows that include utilized memory cells and/or to write data to the memory rows in accordance with a programming sequence of the memory device.
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公开(公告)号:US10803926B2
公开(公告)日:2020-10-13
申请号:US16237115
申请日:2018-12-31
发明人: Dale H. Hiscock , Debra M. Bell , Michael Kaminski , Joshua E. Alzheimer , Anthony D. Veches , James S. Rehmeyer
IPC分类号: G11C5/02 , G11C11/4093 , G11C11/406 , G11C7/18 , H01L25/10 , G11C11/4096
摘要: Memory devices and systems with on-die data transfer capability, and associated methods, are disclosed herein. In one embodiment, a memory device includes an array of memory cells and a plurality of input/output lines operably connecting the array to data pads of the device. In some embodiments, the memory device can further include a global cache and/or a local cache. The memory device can be configured to internally transfer data stored at a first location in the array to a second location in the array without outputting the data from the memory device. To transfer the data, the memory device can copy data on one row of memory cells to another row of memory cells, directly write data to the second location from the first location using data read/write lines of the input/output lines, and/or read the data into and out of the global cache and/or the local cache.
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公开(公告)号:US20200185024A1
公开(公告)日:2020-06-11
申请号:US16216894
申请日:2018-12-11
IPC分类号: G11C11/4094 , G11C11/406 , G11C11/4096 , G11C11/408
摘要: Methods, systems, and devices for phase charge sharing are described. In some memory systems or memory devices, one or more decoders may be used to bias access lines of a memory die. The decoders may transfer voltage or current between a first conductive line of the decoder and a second conductive line of the decoder via a shorting device. Transferring the voltage or current may be performed as part of or in association with an operation (e.g., an activate or pre-charge operation) to access one or more memory cells of the memory die. In some examples, the decoders may transfer voltage or current between a first conductive line of a decoder associated with a first refresh activity and a second conductive line of the decoder associated with a second refresh activity via a shorting device.
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39.
公开(公告)号:US20190252355A1
公开(公告)日:2019-08-15
申请号:US16391804
申请日:2019-04-23
发明人: Anthony D. Veches
IPC分类号: H01L25/065 , H01L25/00 , H01L23/64
CPC分类号: H01L25/0657 , H01L23/642 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/92 , H01L25/50 , H01L2224/0401 , H01L2224/05552 , H01L2224/05553 , H01L2224/05555 , H01L2224/0557 , H01L2224/056 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05684 , H01L2224/06181 , H01L2224/13109 , H01L2224/13111 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2225/06531 , H01L2225/06541 , H01L2225/06544 , H01L2225/06565 , H01L2225/06582 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/01047 , H01L2924/00014 , H01L2924/00
摘要: Semiconductor die assemblies including stacked semiconductor dies having parallel plate capacitors formed between adjacent pairs of semiconductor dies in the stack, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor die assembly includes a first semiconductor die and a second semiconductor die stacked over the first semiconductor die. The first semiconductor die includes an upper surface having a first capacitor plate formed thereon, and the second semiconductor die includes a lower surface facing the upper surface of the first semiconductor die and having a second capacitor plate formed thereon. A dielectric material is formed at least partially between the first and second capacitor plates. The first capacitor plate, second capacitor plate, and dielectric material together form a capacitor that stores charge locally within the stack, and that can be accessed by the first and/or second semiconductor dies.
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40.
公开(公告)号:US10134712B1
公开(公告)日:2018-11-20
申请号:US15684703
申请日:2017-08-23
发明人: Anthony D. Veches
IPC分类号: H01L23/48 , H01L25/065 , H01L23/64 , H01L25/00
摘要: Semiconductor die assemblies including stacked semiconductor dies having parallel plate capacitors formed between adjacent pairs of semiconductor dies in the stack, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor die assembly includes a first semiconductor die and a second semiconductor die stacked over the first semiconductor die. The first semiconductor die includes an upper surface having a first capacitor plate formed thereon, and the second semiconductor die includes a lower surface facing the upper surface of the first semiconductor die and having a second capacitor plate formed thereon. A dielectric material is formed at least partially between the first and second capacitor plates. The first capacitor plate, second capacitor plate, and dielectric material together form a capacitor that stores charge locally within the stack, and that can be accessed by the first and/or second semiconductor dies.
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