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    OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT
    31.
    发明申请
    OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20190355882A1

    公开(公告)日：2019-11-21

    申请号：US16478996

    申请日：2018-01-24

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Martin Brandl ,  Markus Pindl

    IPC: H01L33/54 ,  H01L33/48 ,  H01L33/20

    Abstract: An optoelectronic component includes a housing including a first cavity bounded by a first wall, wherein a circumferentially extending first step is formed at an inner side of the first wall, the first step circumferentially extends around the first cavity obliquely with respect to a bottom of the first cavity, a first optoelectronic semiconductor chip is arranged at the bottom of the first cavity, the first optoelectronic semiconductor chip is embedded into a first potting material arranged in the first cavity and extending from the bottom of the first cavity as far as the first step, and a first potting surface of the first potting material is formed at the first step.

    Lead frame and method of producing a chip housing
    32.
    发明授权
    Lead frame and method of producing a chip housing 有权

    公开(公告)号：US10297537B2

    公开(公告)日：2019-05-21

    申请号：US15541765

    申请日：2016-01-07

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Martin Brandl ,  Tobias Gebuhr

    IPC: H01L23/495 ,  H01L33/00 ,  H01L33/62 ,  H01L23/00 ,  H01L33/48 ,  H01L21/56

    Abstract: A lead frame used to produce a chip package includes a first lead frame section and a second lead frame section connected to one another by a bar, wherein the bar includes a first longitudinal section, a second longitudinal section and a third longitudinal section, the first longitudinal section adjoins the first lead frame section and the third longitudinal section adjoins the second lead frame section, the first longitudinal section and the third longitudinal section are oriented parallel to one another, the first longitudinal section and the second longitudinal section form an angle not equal to 180° and not equal to 90°, and the lead frame is planar.

    OPTOELECTRONIC COMPONENT WITH A LEAD FRAME SECTION
    33.
    发明申请
    OPTOELECTRONIC COMPONENT WITH A LEAD FRAME SECTION 审中-公开

    公开(公告)号：US20190074418A1

    公开(公告)日：2019-03-07

    申请号：US16079749

    申请日：2017-02-24

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Michael Wittmann ,  Martin Brandl

    IPC: H01L33/62 ,  H01L33/44

    Abstract: An optoelectronic component has at least one lead frame section, wherein an optoelectronic element is arranged on the lead frame section, a mold material is applied at least on a first face of the lead frame section and adhesively connected to the lead frame section by the first face, the lead frame section consists of a predetermined material, a part of the first face of the lead frame section is provided with a coating, a region of the first face is free of the coating, and the mold material connects to the material of the lead frame section in the free region.

    METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT
    36.
    发明申请
    METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT 有权
    生产光电组件的方法

    公开(公告)号：US20160163932A1

    公开(公告)日：2016-06-09

    申请号：US14902105

    申请日：2014-07-03

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Martin Brandl ,  Markus Burger

    IPC: H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

    CPC classification number: H01L33/505 ,  H01L33/005 ,  H01L33/486 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

    Abstract: A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a mask layer arranged on an upper side of the optoelectronic semiconductor chip; providing a carrier having walls arranged on a surface of the carrier, the walls laterally limiting a receiving region; arranging an optoelectronic semiconductor chip in the receiving region, wherein a bottom side of the optoelectronic semiconductor chip faces the surface of the carrier; filling a region of the receiving region surrounding the optoelectronic semiconductor chip with an optically reflective material up to a height that lies between the upper side of the optoelectronic semiconductor chip and an upper side of the mask layer; removing the mask layer to create a free space in the optically reflective material; and introducing a wavelength-converting material into the free space.

    Abstract translation: 制造光电子部件的方法包括提供具有布置在所述光电子半导体芯片的上侧的掩模层的光电子半导体芯片; 提供具有布置在所述载体的表面上的壁的载体，所述壁横向限制接收区域; 在接收区域中布置光电子半导体芯片，其中所述光电半导体芯片的底侧面向所述载体的表面; 用光反射材料填充围绕光电子半导体芯片的接收区域的区域，直到光电半导体芯片的上侧和掩模层的上侧之间的高度为止; 去除掩模层以在光学反射材料中产生自由空间; 并将波长转换材料引入自由空间。

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