公开(公告)号：US5310428A

公开(公告)日：1994-05-10

申请号：US994868

申请日：1992-12-22

申请人： Anilkumar C. Bhatt ,  Kostas I. Papathomas ,  Terry D. Sinclair ,  Jerome J. Wagner

发明人： Anilkumar C. Bhatt ,  Kostas I. Papathomas ,  Terry D. Sinclair ,  Jerome J. Wagner

IPC分类号： B29C41/12 ,  B01D3/00 ,  G03F7/30 ,  G03F7/42 ,  H01L21/027 ,  H01L21/30 ,  B08B3/08

CPC分类号： G03F7/3092

摘要： Disclosed is a method of thermally stabilizing an effluent stream from an industrial process, such as a photolithographic process, to allow thermally manageable recovery of the solvent. In the separation and recovery process the solvent is exposed to temperatures that can cause polymerization of the relatively small amounts of monomer still contained therein. This polymerization is an exothermic polymerization, which can accelerate the polymerization of the remaining monomer, potentially causing a thermally initiated, exothermic, run away polymerization. Run away, thermally initiated, exothermic polymerization can materially degrade the solvent. The thermally initiated, run away exothermic reaction is inhibited by the inclusion of a thermal stabilizer or polymerization inhibitor.

摘要翻译： 公开了一种热稳定来自工业过程（例如光刻工艺）的流出物流的方法，以允许溶剂的热处理回收。 在分离和回收过程中，溶剂暴露于可能导致其中仍然含有的相对少量单体的​​聚合的温度。 该聚合是放热聚合，其可以加速剩余单体的聚合，潜在地引起热引发的放热聚合。 逃逸，热引发，放热聚合可能会使溶剂物理降解。 通过包含热稳定剂或阻聚剂来抑制热引发的，逃逸的放热反应。

公开(公告)号：US07145221B2

公开(公告)日：2006-12-05

申请号：US10920235

申请日：2004-08-18

申请人： Irving Memis ,  Kostas I. Papathomas

发明人： Irving Memis ,  Kostas I. Papathomas

IPC分类号： H01L23/58

CPC分类号： H01L23/145 ,  H01L21/48 ,  H01L21/50 ,  H01L23/4922 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K3/4602 ,  H05K2201/0209 ,  H01L2924/00

摘要： A circuitized substrate comprising a first layer comprised of a dielectric material including a low moisture absorptive polymer resin in combination with a nodular fluoropolymer web encased within the resin, the resulting dielectric layer formed from this combination not including continuous or semi-continuous fibers as part thereof. The substrate further includes at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate are also provided, as is an information handling system (e.g., computer) incorporating the circuitized substrate of the invention as part thereof.

摘要翻译： 电路化基板，包括由介电材料构成的第一层，该电介质材料包括与包含在该树脂内的结节状氟聚合物纤维网结合的低吸水性聚合物树脂，由该组合形成的所得电介质层不包括连续或半连续纤维作为其一部分 。 衬底还包括位于电介质第一层上的至少一个电路化层。 还提供电气组件和制造基板的方法，如本发明的电路化基板作为其一部分的信息处理系统（例如，计算机）。

公开(公告)号：US5668059A

公开(公告)日：1997-09-16

申请号：US679648

申请日：1996-07-12

申请人： Frederick Richard Christie ,  Kostas I. Papathomas ,  David Wei Wang

发明人： Frederick Richard Christie ,  Kostas I. Papathomas ,  David Wei Wang

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H05K3/28 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/285 ,  H05K3/3431 ,  Y10T428/31504 ,  Y10T428/31547

摘要： Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.

摘要翻译： 焊接互连密封剂，封装结构及其制造和使用方法，由此通过固化含有脂环族聚环氧化物和/或可固化氰酸酯的制剂获得的组合物填充载体基底和半导体器件之间的焊料连接所产生的间隙，或 其预聚物; 填料，例如氮化铝或氧化铝填料，其最大粒度为31微米。

公开(公告)号：US5471096A

公开(公告)日：1995-11-28

申请号：US145678

申请日：1993-11-04

申请人： Kostas I. Papathomas ,  Frederick R. Christie ,  David W. Wang

发明人： Kostas I. Papathomas ,  Frederick R. Christie ,  David W. Wang

IPC分类号： C08G18/76 ,  C08G73/06 ,  C08L79/04 ,  C09J175/00 ,  C09J175/04 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12044

摘要： Compositions containing bisphenol M dicyanate, prepolymer thereof, or mixtures thereof, and 4,4'-ethylidene bisphenol dicyanate, prepolymer thereof or mixtures thereof; and filler having maximum particle size of 20 microns and being substantially free of alpha particle emissions. The compositions are useful in forming interconnection structures for forming an integrated semiconductor device to a carrier substrate.

摘要翻译： 含有双酚M二氰酸酯，其预聚物或其混合物，4,4'-亚乙基双酚双氰酸酯，其预聚物或其混合物的组合物; 和填料，其最大粒度为20微米，并且基本上不含α粒子排放。 所述组合物可用于形成用于将集成半导体器件形成到载体衬底的互连结构。

公开(公告)号：US5015719A

公开(公告)日：1991-05-14

申请号：US380195

申请日：1989-07-14

申请人： Kostas I. Papathomas ,  William J. Summa ,  David W. Wang

发明人： Kostas I. Papathomas ,  William J. Summa ,  David W. Wang

IPC分类号： C07C261/02 ,  H05K1/03

CPC分类号： C08L63/00 ,  H05K1/034 ,  Y10T428/30 ,  Y10T428/31551

摘要： Dicyanato diphenyl fluorinated alkane resin precursor compositions are modified by the addition of minor predetermined amounts of aromatic diepoxides having high epoxide equivalent weights in order to reduce the curing temperature of prepregs and laminates, such as circuit boards, while retaining low dielectric constants, heat stability and high flame retardance.

摘要翻译： 通过添加少量预定量的具有高环氧当量重量的芳族二环氧化物来改性二氰基二苯基氟化烷烃树脂前体组合物，以便降低预浸料和层压材料如电路板的固化温度，同时保持低介电常数，热稳定性和 高阻燃性

公开(公告)号：US5571417A

公开(公告)日：1996-11-05

申请号：US365088

申请日：1994-12-28

申请人： Anilkumar C. Bhatt ,  Gary S. Ksenak ,  Kostas I. Papathomas ,  James A. Shurtleff ,  Jerome J. Wagner

发明人： Anilkumar C. Bhatt ,  Gary S. Ksenak ,  Kostas I. Papathomas ,  James A. Shurtleff ,  Jerome J. Wagner

IPC分类号： G03F7/32 ,  G03F7/42 ,  C02F3/02

CPC分类号： G03F7/422 ,  G03F7/325 ,  G03F7/425 ,  Y10S210/908 ,  Y10S210/909

摘要： A method is disclosed for using the simple, environmentally-friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers. Following removal of the developers and strippers, any residual monomers or polymers of the resist or solder mask as well as residual developing solution and stripping solution are rinsed from the printed circuit package. A method is also disclosed for treating the combined developer and stripper rinse effluents in an activated biomass to reduce the biological oxygen demand of the developer/stripper/resist/solder mask waste streams.

摘要翻译： 公开了一种使用简单的，环境友好的有机化合物γ-丁内酯和苄醇来开发和剥离自由基引发的可加成聚合抗蚀剂，阳离子固化的抗蚀剂和焊接掩模和Vacrel光致抗蚀剂的方法。 在所有情况下，显影剂和脱模剂包括γ-丁内酯或苄醇。 显影剂和脱模剂任选地还包括少量甲醇，乙醇，异丙醇，丙二醇单甲基乙酸酯，乙二醇单甲醚，甲酰胺，硝基甲烷，环氧丙烷或甲基乙基酮，丙酮和水。 在光刻图案的抗蚀剂或焊接掩模的显影期间，未聚合的区域溶解在所公开的显影剂中。 在剥离抗蚀剂或焊接掩模期间，聚合区域从公开的剥离器中的电路板脱粘。 在除去显影剂和剥离剂之后，从印刷电路封装中冲洗抗蚀剂或焊料掩模的任何残留单体或聚合物以及残留的显影溶液和剥离溶液。 还公开了一种用于处理活性生物质中的组合的显影剂和汽提漂洗废液以减少显影剂/汽提器/抗蚀剂/阻燃剂/焊料掩模废物流的生物需氧量的方法。

公开(公告)号：US5250848A

公开(公告)日：1993-10-05

申请号：US737473

申请日：1991-07-30

申请人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

发明人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H05K3/28 ,  H05K3/34 ,  H01L23/48 ,  H01L29/40 ,  H01L29/64 ,  H01L39/02

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01092 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/285 ,  H05K3/3431 ,  Y10T428/31504 ,  Y10T428/31547

摘要： Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

摘要翻译： 焊接互连，由此通过固化含有脂环族聚环氧化物和/或可固化的氰酸酯或其预聚物的制剂获得的组合物填充由载体基底和半导体器件之间的焊料连接所产生的间隙; 填料的最大粒度为31微米，至少基本上不含α粒子的排放。

公开(公告)号：US6114098A

公开(公告)日：2000-09-05

申请号：US154935

申请日：1998-09-17

申请人： Bernd Karl Appelt ,  John Steven Kresge ,  John Matthew Lauffer ,  Kostas I. Papathomas

发明人： Bernd Karl Appelt ,  John Steven Kresge ,  John Matthew Lauffer ,  Kostas I. Papathomas

IPC分类号： H05K3/00 ,  H05K3/40 ,  G03F7/00

CPC分类号： H05K3/4053 ,  H05K2203/0191 ,  H05K3/0082 ,  H05K3/0094 ,  Y10T428/2809

摘要： An aperture in an electronic substrate is filled with a filling material without need for a specially built fill mask. A layer of tape or tentable photosensitive dielectric film is applied to one surface of the substrate covering the aperture. An opening is made in the tape or film by directing radiation through the aperture. Fill material is then forced through the opening to substantially fill the aperture. Protruding nubs may be removed to planarize the substrate surfaces.

摘要翻译： 电子基板中的孔填充有填充材料，而不需要特别构造的填充掩模。 将一层带或暂时的光敏电介质膜施加到覆盖孔的基板的一个表面上。 通过将辐射引导通过孔，在胶带或胶片中形成开口。 填充材料然后被迫穿过开口基本上填充孔。 可以去除凸起的凸块以使基底表面平坦化。

公开(公告)号：US4999699A

公开(公告)日：1991-03-12

申请号：US493126

申请日：1990-03-14

申请人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

发明人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

IPC分类号： H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H05K3/28 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01092 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/285 ,  H05K3/3431 ,  Y10T428/31504 ,  Y10T428/31547

摘要： Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.