公开(公告)号：US5015719A

公开(公告)日：1991-05-14

申请号：US380195

申请日：1989-07-14

申请人： Kostas I. Papathomas ,  William J. Summa ,  David W. Wang

发明人： Kostas I. Papathomas ,  William J. Summa ,  David W. Wang

IPC分类号： C07C261/02 ,  H05K1/03

CPC分类号： C08L63/00 ,  H05K1/034 ,  Y10T428/30 ,  Y10T428/31551

摘要： Dicyanato diphenyl fluorinated alkane resin precursor compositions are modified by the addition of minor predetermined amounts of aromatic diepoxides having high epoxide equivalent weights in order to reduce the curing temperature of prepregs and laminates, such as circuit boards, while retaining low dielectric constants, heat stability and high flame retardance.

摘要翻译： 通过添加少量预定量的具有高环氧当量重量的芳族二环氧化物来改性二氰基二苯基氟化烷烃树脂前体组合物，以便降低预浸料和层压材料如电路板的固化温度，同时保持低介电常数，热稳定性和 高阻燃性

公开(公告)号：US5089440A

公开(公告)日：1992-02-18

申请号：US624973

申请日：1990-12-10

申请人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

发明人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H05K3/28 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01092 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/285 ,  H05K3/3431 ,  Y10T29/49146

摘要： Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

摘要翻译： 焊接互连，由此通过固化含有脂环族聚环氧化物和/或可固化的氰酸酯或其预聚物的制剂获得的组合物填充由载体基底和半导体器件之间的焊料连接所产生的间隙; 填料的最大粒度为31微米，至少基本上不含α粒子的排放。

公开(公告)号：US5471096A

公开(公告)日：1995-11-28

申请号：US145678

申请日：1993-11-04

申请人： Kostas I. Papathomas ,  Frederick R. Christie ,  David W. Wang

发明人： Kostas I. Papathomas ,  Frederick R. Christie ,  David W. Wang

IPC分类号： C08G18/76 ,  C08G73/06 ,  C08L79/04 ,  C09J175/00 ,  C09J175/04 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12044

摘要： Compositions containing bisphenol M dicyanate, prepolymer thereof, or mixtures thereof, and 4,4'-ethylidene bisphenol dicyanate, prepolymer thereof or mixtures thereof; and filler having maximum particle size of 20 microns and being substantially free of alpha particle emissions. The compositions are useful in forming interconnection structures for forming an integrated semiconductor device to a carrier substrate.

摘要翻译： 含有双酚M二氰酸酯，其预聚物或其混合物，4,4'-亚乙基双酚双氰酸酯，其预聚物或其混合物的组合物; 和填料，其最大粒度为20微米，并且基本上不含α粒子排放。 所述组合物可用于形成用于将集成半导体器件形成到载体衬底的互连结构。

公开(公告)号：US5250848A

公开(公告)日：1993-10-05

申请号：US737473

申请日：1991-07-30

申请人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

发明人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H05K3/28 ,  H05K3/34 ,  H01L23/48 ,  H01L29/40 ,  H01L29/64 ,  H01L39/02

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01092 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/285 ,  H05K3/3431 ,  Y10T428/31504 ,  Y10T428/31547

摘要： Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

摘要翻译： 焊接互连，由此通过固化含有脂环族聚环氧化物和/或可固化的氰酸酯或其预聚物的制剂获得的组合物填充由载体基底和半导体器件之间的焊料连接所产生的间隙; 填料的最大粒度为31微米，至少基本上不含α粒子的排放。

公开(公告)号：US4999699A

公开(公告)日：1991-03-12

申请号：US493126

申请日：1990-03-14

申请人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

发明人： Frederick R. Christie ,  Kostas I. Papathomas ,  David W. Wang

IPC分类号： H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H05K3/28 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01092 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/285 ,  H05K3/3431 ,  Y10T428/31504 ,  Y10T428/31547

摘要： Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

公开(公告)号：US07416972B2

公开(公告)日：2008-08-26

申请号：US11730942

申请日：2007-04-05

申请人： Robert M. Japp ,  Irving Memis ,  Kostas I. Papathomas

发明人： Robert M. Japp ,  Irving Memis ,  Kostas I. Papathomas

IPC分类号： H01L21/4763

CPC分类号： H01L23/3735 ,  H01L23/145 ,  H01L23/3733 ,  H01L23/4922 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/564 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/068

摘要： A method of making a circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof.

摘要翻译： 一种制造电路化基板的方法，所述电路化基板包括复合层，所述复合层包括具有低热膨胀系数的多个纤维的第一介电子层和低吸湿性树脂的第二介电子层，所述第二介电子层 不包括连续或半连续纤维等作为其一部分。 衬底还包括至少一个作为其一部分的导电层。

公开(公告)号：US20080191353A1

公开(公告)日：2008-08-14

申请号：US12081042

申请日：2008-04-10

申请人： Robert M. Japp ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Mark D. Poliks

发明人： Robert M. Japp ,  Voya R. Markovich ,  Kostas I. Papathomas ,  Mark D. Poliks

IPC分类号： H01L23/485 ,  H05K3/30

CPC分类号： H01L23/145 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/4922 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/564 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T29/4913 ,  Y10T156/10 ,  H01L2924/00

摘要： A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.

摘要翻译： 一种多层电路化基板，包括多个介电层，每个电介质层由浸渍有不含卤素的低吸湿性树脂的对芳族聚酰胺纸构成，所述不含卤素的低吸湿性树脂包括无机填料，但不包括连续或半连续的玻璃纤维作为其一部分， 电路层位于第一介电层上。 还提供了制造该基板的方法。

公开(公告)号：US06199751B1

公开(公告)日：2001-03-13

申请号：US09533196

申请日：2000-03-23

申请人： Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

发明人： Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

IPC分类号： B23K2000

CPC分类号： H01L24/31 ,  B23K35/0244 ,  B23K35/26 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/12014 ,  Y10T428/12181 ,  Y10T428/12569 ,  Y10T428/12646 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014

摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.

摘要翻译： 提供了在两个表面上的焊盘之间形成冶金结合的技术。 放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。 第一和第二种金属包括低熔点成分。 两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。 基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。 提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。 核心金属和涂覆金属一起包括低熔点成分。 以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。 含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。 将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相 材料和贱金属进入涂料。

公开(公告)号：US5656862A

公开(公告)日：1997-08-12

申请号：US59003

申请日：1993-05-06

申请人： Kostas I. Papathomas ,  David Wei Wang

发明人： Kostas I. Papathomas ,  David Wei Wang

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H05K3/28 ,  H05K3/34 ,  H01L23/48 ,  H01L29/40 ,  H01L39/02

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/284 ,  H05K3/285 ,  H05K3/3431 ,  Y10T428/31504 ,  Y10T428/31547

摘要： Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.

摘要翻译： 焊接互连密封剂，封装结构及其制造和使用方法，由此通过固化含有脂环族聚环氧化物和/或可固化氰酸酯的制剂获得的组合物填充载体基底和半导体器件之间的焊料连接所产生的间隙，或 其预聚物; 填料，例如氮化铝或氧化铝填料，其最大粒度为31微米。

公开(公告)号：US20110017498A1

公开(公告)日：2011-01-27

申请号：US12460975

申请日：2009-07-27

申请人： John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

发明人： John M. Lauffer ,  Voya R. Markovich ,  Kostas I. Papathomas

IPC分类号： H05K1/09 ,  C08J3/28 ,  B05D5/12

CPC分类号： H05K3/4676 ,  H05K3/0023 ,  H05K2201/0209

摘要： A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured toughener, a photoinitiator in a predetermined amount by weight of the resin component, and a ceramic filler, the photosensitive dielectric composition forming the dielectric film layer having no solvent therein. In an alternative embodiment, a heat activated dielectric composition is provided which is curable by heat and includes an epoxide bearing component including at least one polyepoxide resin curable by heat, a cyanate ester, a flexibilizer, a nanostructured toughener, a heat activated curing agent for accelerating reaction of the cyanate ester and polyepoxide resin components, and a ceramic filler. Methods of making circuitized substrates from the above compositions are also provided.

摘要翻译： 根据本发明的一个实施方案提供一种适用于形成用于电路化基底的电介质膜层的光敏电介质组合物，该组合物包括含环氧化物的组分，该组分包括至少一种可通过电磁辐射固化的聚环氧树脂，氰酸酯， 增韧剂，纳米结构增韧剂，预定量的树脂组分的光引发剂和陶瓷填料，所述光敏介电组合物形成在其中不溶剂的电介质膜层。 在另一个实施方案中，提供热活化电介质组合物，其可通过加热固化，并且包括含环氧化物的组分，其包含至少一种可热固化的聚环氧树脂，氰酸酯，增韧剂，纳米结构增韧剂，热活化固化剂 加速氰酸酯和聚环氧树脂组分的反应，以及陶瓷填料。 还提供了从上述组合物制备电路化基底的方法。