公开(公告)号：US20240258186A1

公开(公告)日：2024-08-01

申请号：US18630486

申请日：2024-04-09

Applicant: Rohm Co., Ltd.

Inventor： Ryotaro KAKIZAKI ,  Koshun SAITO

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/3121 ,  H01L23/49555 ,  H01L24/45 ,  H01L24/48 ,  H01L23/49513 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/46 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/06181 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/46 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49052 ,  H01L2224/49112 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/13055 ,  H01L2924/13091

Abstract: A semiconductor device includes a semiconductor element, a conductor, and a sealing resin. The conductor includes a die pad, a first terminal, and a second terminal. The sealing resin covers a portion of the conductor and the semiconductor element. The sealing resin includes first, second, third and fourth resin surfaces. The die pad includes a first-lead obverse surface with the semiconductor element mounted, and a first-lead reverse surface exposed from the second resin surface. The first terminal is bent in a first sense of z direction and exposed from the third resin surface. The second terminal is bent in the first sense of z direction and exposed from the fourth resin surface. The first resin surface includes a recessed region recessed in z direction toward the second resin surface. As viewed in z direction, the recessed region overlaps with an imaginary line connecting the first terminal and the second terminal.

公开(公告)号：US20230395483A1

公开(公告)日：2023-12-07

申请号：US18454582

申请日：2023-08-23

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Yasufumi MATSUOKA

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/07 ,  H01L23/31

CPC classification number: H01L23/49844 ,  H01L24/49 ,  H01L25/072 ,  H01L23/3121 ,  H01L2924/13091

Abstract: A semiconductor device includes a semiconductor element, a first lead including a mounting portion for the semiconductor element and a first terminal portion connected to the mounting portion, and a sealing resin covering the semiconductor element and a portion of the first lead. The mounting portion has a mounting-portion front surface and a mounting-portion back surface opposite to each other in a thickness direction, with the semiconductor element mounted on the mounting-portion front surface. The sealing resin includes a resin front surface, a resin back surface and a resin side surface connecting the resin front surface and the resin back surface. The mounting-portion back surface of the first lead is flush with the resin back surface. The first terminal portion includes a first-terminal-portion back surface exposed from the resin back surface, in a manner such that the first-terminal-portion back surface extends to the resin side surface.

公开(公告)号：US20230395451A1

公开(公告)日：2023-12-07

申请号：US18452875

申请日：2023-08-21

Applicant: ROHM CO., LTD.

Inventor： Koshun SAITO

IPC: H01L23/31 ,  H01L25/07 ,  H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L21/321

CPC classification number: H01L23/3135 ,  H01L25/072 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/40 ,  H01L24/73 ,  H01L21/565 ,  H01L21/321 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/73213 ,  H01L2224/73263 ,  H01L2924/13091

Abstract: A semiconductor device includes a first lead, a second lead, a third lead, a semiconductor element, a sealing resin and a coating layer. The sealing resin has a bottom surface and an outer side surface. The bottom surface of the sealing resin is formed with a recess having an inner side surface. The second lead includes a reverse surface exposed at the bottom surface and a side surface exposed at the outer side surface. The coating layer contains a metal element and covers the reverse surface and the side surface. The recess is located between the first lead and the second lead. The second lead and at least one of the first lead and the third lead have inner end surfaces exposed at the inner side surface.

公开(公告)号：US20230343735A1

公开(公告)日：2023-10-26

申请号：US18342449

申请日：2023-06-27

Applicant: ROHM CO., LTD.

Inventor： Koshun SAITO

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/05 ,  H01L24/29 ,  H01L24/46 ,  H01L21/76867 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/29644 ,  H01L23/562 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L24/06 ,  H01L2224/04026 ,  H01L24/32 ,  H01L24/48

Abstract: A semiconductor device includes a predetermined number of leads, a semiconductor element electrically connected to the leads and supported by one of the leads, and a sealing resin that covers the semiconductor element and a part of each lead. Each lead includes some portions exposed from the sealing resin. A surface plating layer is formed on at least one of the exposed portions of the respective leads.

公开(公告)号：US20230282535A1

公开(公告)日：2023-09-07

申请号：US18317699

申请日：2023-05-15

Applicant: ROHM CO., LTD.

Inventor： Koshun SAITO

IPC: H01L23/31

CPC classification number: H01L23/3121 ,  H01L23/49513

Abstract: A semiconductor device includes a semiconductor element, first and second leads, and a sealing resin. The semiconductor element includes first and second electrodes. The first lead includes a mounting base having a main face to which the first electrode is bonded and a back face, and includes a first terminal connected to the first electrode. The second lead includes a second terminal connected to the second electrode. The sealing resin includes a main face and a back face opposite to each other, and includes an end face oriented in the protruding direction of the terminals. The back face of the mounting base is exposed from the back face of the resin. The sealing resin includes a groove formed in its back face and disposed between the back face of the mounting base and a boundary between the second terminal and the end face of the resin.

公开(公告)号：US20230187336A1

公开(公告)日：2023-06-15

申请号：US18164410

申请日：2023-02-03

Applicant: Rohm Co., Ltd.

Inventor： Koshun SAITO ,  Yasufumi MATSUOKA

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/07 ,  H01L23/00

CPC classification number: H01L23/49844 ,  H01L23/3121 ,  H01L25/072 ,  H01L24/49 ,  H01L2924/13091

Abstract: A semiconductor device includes a semiconductor element, a first lead including a mounting portion for the semiconductor element and a first terminal portion connected to the mounting portion, and a sealing resin covering the semiconductor element and a portion of the first lead. The mounting portion has a mounting-portion front surface and a mounting-portion back surface opposite to each other in a thickness direction, with the semiconductor element mounted on the mounting-portion front surface. The sealing resin includes a resin front surface, a resin back surface and a resin side surface connecting the resin front surface and the resin back surface. The mounting-portion back surface of the first lead is flush with the resin back surface. The first terminal portion includes a first-terminal-portion back surface exposed from the resin back surface, in a manner such that the first-terminal-portion back surface extends to the resin side surface.

公开(公告)号：US20200176400A1

公开(公告)日：2020-06-04

申请号：US16780514

申请日：2020-02-03

Applicant: ROHM CO., LTD.

Inventor： Kentaro CHIKAMATSU ,  Koshun SAITO ,  Kenichi YOSHIMOCHI

IPC: H01L23/64 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: A semiconductor device includes a lead frame, a transistor, and an encapsulation resin. The lead frame includes a drain frame, a source frame, and a gate frame. The drain frame includes drain frame fingers. The source frame includes source frame fingers. The drain frame fingers and the source frame fingers are alternately arranged in a first direction and include overlapping portions as viewed from a first direction. In a region where each drain frame finger overlaps the source frame fingers as viewed in the first direction, at least either one of the drain frame fingers and the source frame fingers are not exposed from the back surface of the encapsulation resin.

公开(公告)号：US20200176371A1

公开(公告)日：2020-06-04

申请号：US16694470

申请日：2019-11-25

Applicant: Rohm Co., Ltd.

Inventor： Kota ISE ,  Koshun SAITO

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device includes a semiconductor element, a first lead supporting the semiconductor element, a second lead separated from the first lead, and a connection lead electrically connecting the semiconductor element to the second lead. The connection lead has an end portion soldered to the second lead. This connection-lead end portion has a first surface facing the semiconductor element and a second surface opposite to the first surface. The second lead is formed with a recess that is open toward the semiconductor element. The recess has a side surface facing the second surface of the connection-lead end portion. A solder contact area of the second surface of the connection-lead end portion is larger than a solder contact area of the first surface of the connection-lead end portion.