Semiconductor device and method for manufacturing the semiconductor device

    公开(公告)号:US11817507B2

    公开(公告)日:2023-11-14

    申请号:US17667655

    申请日:2022-02-09

    CPC classification number: H01L29/7869

    Abstract: A semiconductor device having a high on-state current is provided.
    The semiconductor device includes a first oxide; a first conductor and a second conductor provided over the first oxide to be separated from each other; and a second oxide provided over the first oxide and between the first conductor and the second conductor. Each of the first oxide and the second oxide has crystallinity, the first oxide includes a region where a c-axis is aligned substantially perpendicularly to a top surface of the first oxide, and the second oxide includes a region where the c-axis is aligned substantially perpendicularly to the top surface of the first oxide, a region where the c-axis is aligned substantially perpendicularly to a side surface of the first conductor, and a region where the c-axis is aligned substantially perpendicularly to a side surface of the second conductor.

    Semiconductor device and manufacturing method of semiconductor device

    公开(公告)号:US11031403B2

    公开(公告)日:2021-06-08

    申请号:US16605548

    申请日:2018-04-19

    Abstract: A semiconductor device that can be highly integrated is provided. The semiconductor device includes a first transistor, a second transistor, a first capacitor, and a second capacitor. The first transistor includes an oxide over a first insulator, a second insulator over the oxide, a first conductor over the second insulator, a third insulator over the first conductor, a fourth insulator in contact with the second insulator, the first conductor, and the third insulator, and a fifth insulator in contact with the fourth insulator. The second transistor includes an oxide over the first insulator, a sixth insulator over the oxide, a second conductor over the sixth insulator, a seventh insulator over the second conductor, an eighth insulator in contact with the sixth insulator, the second conductor, and the seventh insulator, and a ninth insulator in contact with the eighth insulator. The first capacitor includes an oxide, a tenth insulator over the oxide, and a third conductor over the tenth insulator. The second capacitor includes an oxide, an eleventh insulator over the oxide, and a fourth conductor over the eleventh insulator.

    Semiconductor device and method for manufacturing semiconductor device

    公开(公告)号:US10978563B2

    公开(公告)日:2021-04-13

    申请号:US16698476

    申请日:2019-11-27

    Abstract: A semiconductor device having favorable electrical characteristics is provided. The semiconductor device includes a first insulator; a first conductor over the first insulator; a second insulator over the first conductor; a first oxide over the second insulator; second and third conductors over the first oxide; a third insulator over the second and third conductors; a second oxide over the first oxide and between the second and third conductors; a fourth insulator over the second oxide; a fourth conductor over the fourth insulator; a fifth insulator in contact with the third insulator and the second oxide; a sixth insulator in contact with the first, second, third, and fifth insulators, and the second oxide; and a seventh insulator in contact with the fourth and sixth insulators, the second oxide, and the fourth conductor. The first, sixth, and seventh insulators each contain a silicon nitride. The fifth insulator contains an aluminum oxide.

    Semiconductor device and method for manufacturing the same
    39.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US09570622B2

    公开(公告)日:2017-02-14

    申请号:US14476921

    申请日:2014-09-04

    Abstract: To provide a highly reliable semiconductor device using an oxide semiconductor. The semiconductor device includes a first electrode layer; a second electrode layer positioned over the first electrode layer and including a stacked-layer structure of a first conductive layer and a second conductive layer; and an oxide semiconductor film and an insulating film positioned between the first electrode layer and the second electrode layer in a thickness direction. The first conductive layer and the insulating film have a first opening portion in a region overlapping with the first electrode layer. The oxide semiconductor film has a second opening portion in a region overlapping with the first opening portion. The second conductive layer is in contact with the first electrode layer exposed in the first opening portion and the second opening portion.

    Abstract translation: 提供使用氧化物半导体的高度可靠的半导体器件。 半导体器件包括第一电极层; 位于所述第一电极层上并包括第一导电层和第二导电层的层叠结构的第二电极层; 以及在厚度方向上位于第一电极层和第二电极层之间的氧化物半导体膜和绝缘膜。 第一导电层和绝缘膜在与第一电极层重叠的区域中具有第一开口部。 氧化物半导体膜在与第一开口部重叠的区域中具有第二开口部。 第二导电层与暴露在第一开口部分和第二开口部分中的第一电极层接触。

    Semiconductor device and manufacturing method thereof
    40.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US09391095B2

    公开(公告)日:2016-07-12

    申请号:US14104264

    申请日:2013-12-12

    Abstract: An oxide semiconductor layer with excellent crystallinity is formed to enable manufacture of transistors with excellent electrical characteristics for practical application of a large display device, a high-performance semiconductor device, etc. By first heat treatment, a first oxide semiconductor layer is crystallized. A second oxide semiconductor layer is formed over the first oxide semiconductor layer. By second heat treatment, an oxide semiconductor layer including a crystal region having the c-axis oriented substantially perpendicular to a surface is efficiently formed and oxygen vacancies are efficiently filled. An oxide insulating layer is formed over and in contact with the oxide semiconductor layer. By third heat treatment, oxygen is supplied again to the oxide semiconductor layer. A nitride insulating layer containing hydrogen is formed over the oxide insulating layer. By fourth heat treatment, hydrogen is supplied at least to an interface between the second oxide semiconductor layer and the oxide insulating layer.

    Abstract translation: 形成具有优异结晶度的氧化物半导体层,以便能够制造具有优异电特性的晶体管,用于实际应用大型显示装置,高性能半导体器件等。通过第一热处理,第一氧化物半导体层结晶。 在第一氧化物半导体层上形成第二氧化物半导体层。 通过第二热处理,有效地形成包括具有取向为基本上垂直于表面的c轴的晶体区域的氧化物半导体层,并且有效地填充氧空位。 氧化物绝缘层形成在氧化物半导体层上并与氧化物半导体层接触。 通过第三次热处理,再次向氧化物半导体层供给氧。 在氧化物绝缘层上形成含有氢的氮化物绝缘层。 通过第四热处理,至少向第二氧化物半导体层和氧化物绝缘层之间的界面供应氢。

Patent Agency Ranking