公开(公告)号：US20180118558A1

公开(公告)日：2018-05-03

申请号：US15636380

申请日：2017-06-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Mikel AZPEITIA URQUIA ,  Lorenzo BALDO

IPC: B81B3/00 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81B3/0021 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00158 ,  B81C1/00269 ,  H04R19/005 ,  H04R19/04

Abstract: Method of manufacturing a transducer module, comprising the steps of: forming, on a substrate, a first MEMS transducer, in particular a gyroscope, and a second MEMS transducer, in particular an accelerometer, having a suspended membrane; forming, on the substrate, a conductive layer and defining the conductive layer in order to provide, simultaneously, at least one conductive strip electrically coupled to the first MEMS transducer and the membrane of the second MEMS transducer.

公开(公告)号：US20230348258A1

公开(公告)日：2023-11-02

申请号：US18302610

申请日：2023-04-18

Applicant: STMicroelectronics S.r.l.

Inventor： Mikel AZPEITIA URQUIA ,  Enri DUQI ,  Silvia NICOLI ,  Roberto CAMPEDELLI ,  Igor VARISCO ,  Lorenzo TENTORI

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81C1/00158 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/033 ,  B81B2203/0361 ,  B81B2207/11 ,  B81C2201/014 ,  B81C2201/0156 ,  B81C2201/0177 ,  B81C2201/0169

Abstract: MEMS structure, comprising: a semiconductor body; a cavity buried in the semiconductor body; a membrane suspended on the cavity; and at least one antistiction bump completely contained in the cavity with the function of preventing the side of the membrane internal to the cavity from sticking to the opposite side, which delimits the cavity downwardly.

公开(公告)号：US20230064114A1

公开(公告)日：2023-03-02

申请号：US17821717

申请日：2022-08-23

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Paolo FERRARI ,  Flavio Francesco VILLA ,  Roberto CAMPEDELLI ,  Luca LAMAGNA ,  Enri DUQI ,  Mikel AZPEITIA URQUIA ,  Silvia NICOLI ,  Maria Carolina TURI

IPC: B81C1/00 ,  G01L9/00

Abstract: The present disclosure is directed to a method for manufacturing a micro-electro-mechanical device. The method includes the steps of forming, on a substrate, a first protection layer of crystallized aluminum oxide, impermeable to HF; forming, on the first protection layer, a sacrificial layer of silicon oxide removable with HF; forming, on the sacrificial layer, a second protection layer of crystallized aluminum oxide; exposing a sacrificial portion of the sacrificial layer; forming, on the sacrificial portion, a first membrane layer of a porous material, permeable to HF; forming a cavity by removing the sacrificial portion through the first membrane layer; and sealing pores of the first membrane layer by forming a second membrane layer on the first membrane layer.

公开(公告)号：US20220373785A1

公开(公告)日：2022-11-24

申请号：US17745186

申请日：2022-05-16

Applicant: STMicroelectronics S.r.l.

Inventor： Nicolo' BONI ,  Gianluca MENDICINO ,  Enri DUQI ,  Roberto CARMINATI ,  Massimiliano MERLI

IPC: G02B26/08 ,  G01L1/18

Abstract: A microelectromechanical mirror device has, in a die of semiconductor material: a fixed structure defining a cavity; a tiltable structure carrying a reflecting region elastically suspended above the cavity; at least a first pair of driving arms coupled to the tiltable structure and carrying respective piezoelectric material regions which may be biased to cause a rotation thereof around at least one rotation axis; elastic suspension elements coupling the tiltable structure elastically to the fixed structure and which are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion; and a piezoresistive sensor configured to provide a detection signal indicative of the rotation of the tiltable structure. At least one test structure is integrated in the die to provide a calibration signal indicative of a sensitivity variation of the piezoresistive sensor in order to calibrate the detection signal.

公开(公告)号：US20220301789A1

公开(公告)日：2022-09-22

申请号：US17690869

申请日：2022-03-09

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Enri DUQI ,  Gabriele GATTERE ,  Carlo VALZASINA

IPC: H01H13/14 ,  G01L1/16 ,  H01H13/06 ,  H01L41/113 ,  B81B3/00

Abstract: Button device comprising: a fixed support structure; a movable structure, laterally surrounded by said support structure and configured to deform at least in part under the action of an external force; and a fluid-tight protection cap. The movable structure includes a piston element, deformable elements having piezoelectric transducers arranged thereon, and anchor elements that couple the piston element to the deformable elements. When an external force acts on the piston element, the anchor elements transfer this force to the deformable elements and to the piezoelectric transducers, so as to sense the extent of this force.

公开(公告)号：US20220011567A1

公开(公告)日：2022-01-13

申请号：US17369145

申请日：2021-07-07

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto CARMINATI ,  Nicolo' BONI ,  Massimiliano MERLI ,  Enri DUQI

IPC: G02B26/10 ,  G02B26/08 ,  G02B1/00 ,  G02B27/42

Abstract: A MEMS micromirror device is formed in a package including a containment body and a lid transparent to a light radiation. The package forms a cavity housing a tiltable platform having a reflecting surface. A metastructure is formed on the lid and/or on the reflecting surface and includes a plurality of diffractive optical elements.

公开(公告)号：US20210229984A1

公开(公告)日：2021-07-29

申请号：US17155429

申请日：2021-01-22

Applicant: STMicroelectronics S.r.l.

Inventor： Enri DUQI ,  Nicolo' BONI ,  Lorenzo BALDO ,  Massimiliano MERLI ,  Roberto CARMINATI

IPC: B81C1/00 ,  H01L41/35

Abstract: To manufacture an oscillating structure, a wafer is processed by: forming torsional elastic elements; forming a mobile element connected to the torsional elastic elements; processing the first side of the wafer to form a mechanical reinforcement structure; and processing the second side of said wafer by steps of chemical etching, deposition of metal material, and/or deposition of piezoelectric material. Processing of the first side of the wafer is carried out prior to processing of the second side of the wafer so as not to damage possible sensitive structures formed on the first side of the wafer.

公开(公告)号：US20200326530A1

公开(公告)日：2020-10-15

申请号：US16847514

申请日：2020-04-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Dario PACI ,  Lorenzo BALDO ,  Domenico GIUSTI

IPC: G02B26/08 ,  B81B3/00 ,  H01L27/146

Abstract: A MEMS optical device including: a semiconductor body; a main cavity, which extends within the semiconductor body; a membrane suspended over the main cavity; a piezoelectric actuator, which is mechanically coupled to the membrane and can be electronically controlled so as to deform the membrane; a micro-lens, mechanically coupled to the membrane so as to undergo deformation following the deformation of the membrane; and a rigid optical element, which contacts the micro-lens and is arranged so that the micro-lens is interposed between the rigid optical element and the membrane. The micro-lens and the main cavity are arranged on opposite sides of the membrane.

公开(公告)号：US20200325888A1

公开(公告)日：2020-10-15

申请号：US16847521

申请日：2020-04-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Domenico GIUSTI ,  Lorenzo BALDO ,  Enri DUQI

IPC: F04B43/04 ,  H01L41/09 ,  H01L41/047 ,  H01L27/20 ,  H01L41/31

Abstract: A micropump device is formed in a monolithic semiconductor body integrating a plurality of actuator elements arranged side-by-side. Each actuator element has a first chamber extending at a distance from a first face of the monolithic body; a membrane arranged between the first face and the first chamber; a piezoelectric element extending on the first face over the membrane; a second chamber, arranged between the first chamber and a second face of the monolithic body; a fluidic inlet path fluidically connecting the second chamber with the outside of the monolithic body; and a fluid outlet opening extending in a transverse direction in the monolithic body from the second face as far as the second chamber, through the first chamber. The monolithic formation of the actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

公开(公告)号：US20200236470A1

公开(公告)日：2020-07-23

申请号：US16749579

申请日：2020-01-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Fabrizio CERINI ,  Enri DUQI ,  Silvia ADORNO ,  Lorenzo BALDO

IPC: H04R19/02 ,  B81B3/00 ,  B81C1/00 ,  H04R17/00 ,  H04R19/00 ,  H04R31/00 ,  H04R1/02

Abstract: An actuation structure of a MEMS electroacoustic transducer is formed in a die of semiconductor material having a monolithic body with a front surface and a rear surface extending in a horizontal plane x-y plane and defined in which are: a frame; an actuator element arranged in a central opening defined by the frame; cantilever elements, coupled at the front surface between the actuator element and the frame; and piezoelectric regions arranged on the cantilever elements and configured to be biased to cause a deformation of the cantilever elements by the piezoelectric effect. A first stopper arrangement is integrated in the die and configured to interact with the cantilever elements to limit a movement thereof in a first direction of a vertical axis orthogonal to the horizontal plane, x-y plane towards the underlying central opening.