公开(公告)号：US20080211872A1

公开(公告)日：2008-09-04

申请号：US12058139

申请日：2008-03-28

申请人： Paul A. Hoisington ,  Steven H. Barss ,  Andreas Bibl ,  John A. Higginson ,  David A. Swett ,  Daniel Cote ,  Edward R. Moynihan ,  Robert Wells

发明人： Paul A. Hoisington ,  Steven H. Barss ,  Andreas Bibl ,  John A. Higginson ,  David A. Swett ,  Daniel Cote ,  Edward R. Moynihan ,  Robert Wells

IPC分类号： B41J2/145

CPC分类号： B41J2/155 ,  B41J2/2103 ,  B41J2/2135 ,  B41J25/34 ,  B41J2202/14 ,  B41J2202/20 ,  B41J2202/21

摘要： In one aspect, the invention features assemblies for depositing droplets on a substrate during relative motion of the assembly and the substrate along a process direction. The assemblies include a first printhead module and a second printhead module contacting the first printhead module, each of the printhead modules including a surface that includes an array of nozzles through which the printhead modules can eject fluid droplets, wherein each nozzle in the first printhead module's nozzle array is offset with respect to a corresponding nozzle in the second printhead module's nozzle array in a direction orthogonal to the process direction.

摘要翻译： 在一个方面，本发明的特征在于用于在组件和衬底沿着工艺方向的相对运动期间将液滴沉积在衬底上的组件。 所述组件包括第一打印头模块和与第一打印头模块接触的第二打印头模块，每个打印头模块包括包括喷嘴阵列的表面，打印头模块可以通过喷嘴阵列喷射液滴，其中第一打印头模块的每个喷嘴 喷嘴阵列相对于第二打印头模块的喷嘴阵列中的相应喷嘴在与处理方向正交的方向上偏移。

公开(公告)号：US07213901B2

公开(公告)日：2007-05-08

申请号：US10982746

申请日：2004-11-04

申请人： Andreas Bibl ,  John A. Higginson

发明人： Andreas Bibl ,  John A. Higginson

IPC分类号： B41J2/165

CPC分类号： B41J2/16588 ,  B41J2/155 ,  B41J2202/20

摘要： A cleaning member is pivotally fixed to a support member to clean ink-jet print heads that are positioned on a print-head receptor module. The cleaning member pivots from a cleaning position to an idle position and the print-head receptor module is pivotally fixed to a support member to allow the module to pivot from a printing position to a cleaning position. The pivotal supports are positioned such that, when the module and the cleaning member are each in their respective cleaning positions, the cleaning member is positioned to clean ink jets inserted into the receptors.

摘要翻译： 清洁构件枢转地固定到支撑构件以清洁位于打印头接收器模块上的喷墨打印头。 清洁构件从清洁位置枢转到空闲位置，并且打印头接收器模块可枢转地固定到支撑构件，以允许模块从打印位置枢转到清洁位置。 枢转支撑的位置使得当模块和清洁构件各自处于其相应的清洁位置时，清洁构件被定位成清洁插入到受体中的喷墨。

公开(公告)号：US09162880B2

公开(公告)日：2015-10-20

申请号：US13607031

申请日：2012-09-07

申请人： John A. Higginson ,  Andreas Bibl ,  David Albertalli

发明人： John A. Higginson ,  Andreas Bibl ,  David Albertalli

IPC分类号： H01L21/683 ,  H01T23/00 ,  B81C99/00

CPC分类号： B25J15/0085 ,  B81C99/002 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67259 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75753 ,  H01L2224/7598 ,  H02N13/00

摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

摘要翻译： 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，传质工具包括铰接传送头组件，载体衬底保持器和致动器组件，以调节关节式传送头组件和载体衬底保持器之间的空间关系。 铰接传送头组件可以包括静电电压源连接和支撑静电转印头阵列的基片。

公开(公告)号：US09105492B2

公开(公告)日：2015-08-11

申请号：US13466966

申请日：2012-05-08

申请人： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC分类号： G01P15/125 ,  H01L25/075 ,  H01L21/67 ,  H01L33/00

CPC分类号： B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

摘要： A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

摘要翻译： 公开了一种兼容的微器件传送头和头阵列。 在一个实施例中，微装置转移头包括可偏转到基底基板和弹簧部分之间的空间中的弹簧部分。

公开(公告)号：US08809875B2

公开(公告)日：2014-08-19

申请号：US13372222

申请日：2012-02-13

申请人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC分类号： H01L27/15 ,  H01L29/18 ,  H01L33/00

CPC分类号： H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

摘要： A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

摘要翻译： 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

公开(公告)号：US20140071580A1

公开(公告)日：2014-03-13

申请号：US13607031

申请日：2012-09-07

申请人： John A. Higginson ,  Andreas Bibl ,  David Albertalli

发明人： John A. Higginson ,  Andreas Bibl ,  David Albertalli

IPC分类号： H02N13/00

CPC分类号： B25J15/0085 ,  B81C99/002 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67259 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75753 ,  H01L2224/7598 ,  H02N13/00

摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

摘要翻译： 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，传质工具包括铰接传送头组件，载体衬底保持器和致动器组件，以调节关节式传送头组件和载体衬底保持器之间的空间关系。 铰接传送头组件可以包括静电电压源连接和支撑静电转印头阵列的基片。

公开(公告)号：US20130300812A1

公开(公告)日：2013-11-14

申请号：US13466966

申请日：2012-05-08

申请人： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC分类号： B41J2/385

CPC分类号： B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

摘要： A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：US08573469B2

公开(公告)日：2013-11-05

申请号：US13436260

申请日：2012-03-30

申请人： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law

发明人： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law

IPC分类号： B23K31/00 ,  B23K101/40 ,  H01L33/46

CPC分类号： H01L33/08 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/405 ,  H01L2224/7598 ,  H01L2224/83 ,  H01L2224/95145 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

摘要： A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

摘要翻译： 描述了将微器件和微器件阵列制造和传送到接收衬底的方法。 在一个实施例中，在蚀刻p-n二极管层以形成多个微p-n二极管期间，电绝缘层被用作蚀刻停止层。 在一个实施例中，在将微器件形成和传送到接收衬底期间，使用导电中间接合层。

公开(公告)号：US20130130416A1

公开(公告)日：2013-05-23

申请号：US13372292

申请日：2012-02-13

申请人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC分类号： H01L21/306

CPC分类号： H01L24/83 ,  B32B37/025 ,  B32B37/06 ,  B32B2457/20 ,  H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  Y10T156/1153 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  H01L2224/83 ,  H01L2924/00

摘要： A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

摘要翻译： 公开了一种微器件转印头和头阵列。 在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构上的电极以及覆盖电极的电介质层。 可以将电压施加到微器件转移头和头阵列以从载体衬底拾取微器件并将微器件释放到接收衬底上。

公开(公告)号：US20110212261A1

公开(公告)日：2011-09-01

申请号：US13106737

申请日：2011-05-12

申请人： Yoshimasa Okamura ,  Jeffrey Birkmeyer ,  John A. Higginson ,  Gregory Debrabander ,  Paul A. Hoisington ,  Andreas Bibl

发明人： Yoshimasa Okamura ,  Jeffrey Birkmeyer ,  John A. Higginson ,  Gregory Debrabander ,  Paul A. Hoisington ,  Andreas Bibl

IPC分类号： C09D5/20

CPC分类号： B41J2/1606 ,  B41J2/1433 ,  B82Y30/00

摘要： A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector.

摘要翻译： 具有允许流体与内表面接触的内表面，外表面和孔的流体喷射器被喷射。 流体喷射器具有覆盖流体喷射器的外表面的至少一部分并且围绕流体喷射器中的孔的非润湿单层。 非润湿单层的制造可以包括从流体喷射器的第二区域去除非润湿单层，同时将非润湿单层留在围绕流体喷射器中的孔口的第一区域上，或保护流体的第二区域 喷射器具有在其上形成的非润湿单层，其中第二区域不包括围绕流体喷射器中的孔口的第一区域。