ELECTROSTATIC CHUCK
    33.
    发明申请

    公开(公告)号:US20250119079A1

    公开(公告)日:2025-04-10

    申请号:US18891449

    申请日:2024-09-20

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck (10) includes a dielectric substrate (100), a base plate (200) formed of a metal material, and a bonding layer (300) bonding the dielectric substrate (100) and the base plate (200). At least a portion of the base plate (200) facing the bonding layer (300) is covered with a ceramic film (231), and a surface of the ceramic film (231) is a bonded surface (S). The bonded surface (S) satisfies at least one of a first condition: arithmetic average height (Sa)≤1.5 μm or a second condition: root mean square height (Sq)≤2.0 μm, and at least one of a third condition: maximum valley depth (Sv)≥20.0 μm or a fourth condition: maximum height (Sz)≥20.0 μm.

    ELECTROSTATIC CHUCK
    34.
    发明申请

    公开(公告)号:US20250069933A1

    公开(公告)日:2025-02-27

    申请号:US18806123

    申请日:2024-08-15

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck 10 includes a dielectric substrate 100, a base plate 200, and a joining layer 300 which joins the dielectric substrate 100 and the base plate 200. The joining layer 300 is obtained by containing a plurality of particulate filler materials 320 inside resin 310. The content of the filler materials 320 in the joining layer 300 is equal to or lower than 70% by weight.

    ELECTROSTATIC CHUCK
    35.
    发明公开
    ELECTROSTATIC CHUCK 审中-公开

    公开(公告)号:US20240331985A1

    公开(公告)日:2024-10-03

    申请号:US18610491

    申请日:2024-03-20

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck includes: a dielectric substrate in which a through hole is formed; an RF electrode which is embedded inside the dielectric substrate; and an attracting electrode which is embedded inside the dielectric substrate at a position that is closer to a placement surface than the RF electrode. When viewed from a direction perpendicular to the placement surface, a circular first opening which is concentric with the through hole and which includes the through hole is formed in the attracting electrode and a circular second opening which is concentric with the through hole and which includes the through hole is formed in the RF electrode. A radius of the second opening is larger than a radius of the first opening.

    ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20240279810A1

    公开(公告)日:2024-08-22

    申请号:US18443418

    申请日:2024-02-16

    Applicant: TOTO LTD.

    CPC classification number: C23C16/4583 C23C16/45561

    Abstract: An electrostatic chuck includes: a dielectric substrate on which a plurality of first gas holes are formed; a base plate on which a second gas hole is formed; and a joining layer which is provided between the dielectric substrate and the base plate and which is formed of an insulating material. A first opening being an end of each of the first gas holes is formed in plurality on a surface of the dielectric substrate on a side of the joining layer. A second opening being an end of the second gas hole is formed on a surface of the base plate on a side of the joining layer. The second opening is communicated with the plurality of first openings via a communication groove formed on the surface of the base plate on the side of the joining layer.

    ELECTROSTATIC CHUCK AND PROCESSING APPARATUS

    公开(公告)号:US20230068968A1

    公开(公告)日:2023-03-02

    申请号:US17897445

    申请日:2022-08-29

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck includes a ceramic dielectric substrate, a base plate, a bonding part, a gas inlet path, a counterbore part, and a ceramic porous part. The bonding part is located between the ceramic dielectric substrate and the base plate. The gas inlet path extends through the ceramic dielectric substrate, the base plate, and the bonding part. The gas inlet path includes a first hole part, a second hole part, and a third hole part. The first hole part is positioned at the ceramic dielectric substrate. The second hole part is positioned at the base plate. The third hole part is positioned at the bonding part. The counterbore part is located in at least one of the first hole part or the second hole part. The ceramic porous part is located in the counterbore part. The ceramic porous part includes an exposed surface exposed in the third hole part.

    ELECTROSTATIC CHUCK AND PROCESSING APPARATUS

    公开(公告)号:US20230061208A1

    公开(公告)日:2023-03-02

    申请号:US17897417

    申请日:2022-08-29

    Applicant: TOTO LTD.

    Abstract: An electrostatic chuck includes a ceramic dielectric substrate, a base plate, a bonding part, a gas inlet path, a counterbore part, a ceramic porous part, and an elastic body. The base plate supports the ceramic dielectric substrate. The bonding part is located between the ceramic dielectric substrate and the base plate. The gas inlet path extends through the ceramic dielectric substrate, the base plate, and the bonding part. The gas inlet path includes a first hole part, a second hole part and a third hole part. The first hole part is positioned at the ceramic dielectric substrate. The third hole part is positioned at the bonding part. The counterbore part is located in the first hole part. The ceramic porous part is located in the counterbore part. The elastic body faces an end part of the bonding part at the third hole part side.

    ELECTROSTATIC CHUCK
    39.
    发明申请

    公开(公告)号:US20210074572A1

    公开(公告)日:2021-03-11

    申请号:US17009432

    申请日:2020-09-01

    Applicant: TOTO LTD.

    Abstract: According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate includes first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The first electrode layer includes first and second portions. The first portion is positioned more centrally of the ceramic dielectric substrate than is the second portion. The first portion includes first and second surfaces. The second portion includes third and fourth surfaces. A distance between the third surface and the first major surface is constant. A thickness of the second portion between the third and fourth surfaces varies such that the thickness at a circumferential end portion of the second portion which is less than that at a central portion of the second portion.

    ELECTROSTATIC CHUCK
    40.
    发明申请
    ELECTROSTATIC CHUCK 审中-公开

    公开(公告)号:US20190287838A1

    公开(公告)日:2019-09-19

    申请号:US16352565

    申请日:2019-03-13

    Applicant: TOTO LTD.

    Abstract: According to the embodiment, the first invention relates to an electrostatic chuck. The electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The first porous part includes sparse portions including pores and a dense portion having a density higher than a density of the sparse portions. Each of the sparse portions extends from the base plate toward the ceramic dielectric substrate. The dense portion is positioned between the sparse portions. The sparse portions include a wall portion provided between the pores and the pores.

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