摘要:
An insulated-gate semiconductor device comprises a P type emitter layer, an N.sup.- high-resistive base layer formed on the P type emitter layer, and a P type base layer contacting the N.sup.- high-resistive base layer. A plurality of trenches are formed having a depth to reach into the N.sup.- high-resistive base layer from the P type base layer. A gate electrode covered with a gate insulation film is buried in each trench. An N type source layer to be connected to a cathode electrode is formed in the surface of the P type base layer in a channel region between some trenches, thereby forming an N channel MOS transistor for turn-on operation. A P channel MOS transistor connected to the P base layer is formed in a channel region between other trenches so as to discharge the holes outside the device upon turn-off operation.
摘要:
A solid-state imaging device is provided and has: three photoelectric conversion layers stacked above a semiconductor substrate 1, each detecting a different color; three signal charge accumulators in a semiconductor substrate for accumulating signal charges generated in each of the three photoelectric conversion layers: and a signal readout circuit in the semiconductor substrate for reading out signals corresponding to the signal charges accumulated in the signal charge accumulators. The three signal charge accumulators are arranged in a direction in the surface of the semiconductor substrate as a pixel and a plurality of the pixels are arranged in a square lattice pattern both in the direction and a direction perpendicular thereto. The three signal charge accumulators arranged in each pixel in an odd row are arranged such that an array of the signal charge accumulators in the first sub-row of each pixel has all of the three signal charge accumulators.
摘要:
According to an embodiment of the invention, there is provided a semiconductor device comprising: a semiconductor element having a first main electrode, a second main electrode and a control electrode, a current flowing between the first and second main electrodes being controlled by a control signal which is input between the control electrode and the second main electrode; and a capacitor formed by providing an insulating layer between the second main electrode and the control electrode of the semiconductor element.
摘要:
Piping unit for transporting a fuel is constructed by connecting a resin tube and a connector for connecting the resin tube to a mating pipe. The connector has a connector body including a retainer holding portion and a retainer for engaging with the mating pipe. The resin tube has a multilayered construction including an inner fuel barrier layer and an outer layer covered with a protective layer. The outer layer has a small outer diameter (od) up to 6 mm, the fuel barrier layer and the outer layer have a wall-thickness (t), and a ratio of the outer diameter (od)/the wall thickness (t) is in a range of 4 to 8.
摘要:
In a hose having a resin layer as an inner layer, a plasma treatment is performed on the inner surface of the inner layer and a connecting portion of an end part of the hose to thereby perform surface modification. Then, a sealing layer made of an elastic material is coated on and bonded to the inner surface of the connecting portion.
摘要:
A semiconductor device comprises a first base layer of a first conductive type which has a first surface and a second surface; a second base layer of a second conductive type which is formed on the first surface; first and second gate electrodes which are formed by embedding an electrically conductive material into a plurality of trenches via gate insulating films, the plurality of trenches being formed such that bottoms of the trenches reach the first base layer; source layers of the first conductive type which are formed on a surface area of the second base layer so as to be adjacent to both side walls of the trench provided with the first gate electrode and one side wall of the trench provided with the second gate electrode, respectively; an emitter layer of the second conductive type which is formed on the second surface; emitter electrodes which are formed on the second base layer and the source layers; a collector electrode which is formed on the emitter layer; and first and second terminals which are electrically connected to the first and second gate electrodes, respectively.
摘要:
A semiconductor device comprises a first base layer of a first conductivity type; a plurality of second base layers of a second conductivity type, provided on a part of a first surface of the first base layer; trenches formed on each side of the second base layers, and formed to be deeper than the second base layers; an emitter layer formed along the trench on a surface of the second base layers; a collector layer of the second conductivity type, provided on a second surface of the first base layer opposite to the first surface; an insulating film formed on an inner wall of the trench, the insulating film being thicker on a bottom of the trench than on a side surface of the trench; a gate electrode formed within the trench, and isolated from the second base layers and the emitter layer by the insulating film; and a space section provided between the second base layers adjacent to each other, the space section being deeper than the second base layers and being electrically isolated from the emitter layer and the second base layers.
摘要:
In a photoelectric converting film stack type solid-state image pickup device, a plurality of photoelectric converting film are stacked on a semiconductor substrate in which a signal readout circuit is formed, each of the photoelectric converting films is sandwiched between a common electrode film and pixel electrode films corresponding to respective pixels, and photo-charges generated in the photoelectric converting films are taken out through the pixel electrode films. In the solid-state image pickup device, a common electrode film for a first photoelectric converting film is used also as a common electrode film for a second photoelectric converting film, the first photoelectric converting film is stacked below the common electrode film, and the second photoelectric converting film is stacked above the common electrode film.
摘要:
A solid-state imaging device is provided and has; three photoelectric conversion layers stacked above a semiconductor substrate 1, each detecting a different color; three signal charge accumulators in a semiconductor substrate for accumulating signal charges generated in each of the three photoelectric conversion layers: and a signal readout circuit in the semiconductor substrate for reading out signals corresponding to the signal charges accumulated in the signal charge accumulators. The three signal charge accumulators are arranged in a direction in the surface of the semiconductor substrate as a pixel and a plurality of the pixels are arranged in a square lattice pattern both in the direction and a direction perpendicular thereto. The three signal charge accumulators arranged in each pixel in an odd row are arranged such that an array of the signal charge accumulators in the first sub-row of each pixel has all of the three signal charge accumulators.
摘要:
A semiconductor device includes a base layer of a first conductivity type, a barrier layer of a first conductivity type formed on the base layer, a trench formed from the surface of the barrier layer to such a depth as to reach a region in the vicinity of an interface between the barrier layer and the base layer, a gate electrode formed in the trench via a gate insulating film, a contact layer of a second conductivity type selectively formed in a surface portion of the barrier layer, a source layer of the first conductivity type selectively formed in the surface portion of the barrier layer so as to contact the contact layer and a side wall of the gate insulating film in the trench, and a first main electrode formed so as to contact the contact layer and the source layer.