公开(公告)号：US06325270B1

公开(公告)日：2001-12-04

申请号：US09598495

申请日：2000-06-22

申请人： Takeshi Kuroda ,  Kaoru Katayama ,  Takeshi Takahashi ,  Naoki Watanabe

发明人： Takeshi Kuroda ,  Kaoru Katayama ,  Takeshi Takahashi ,  Naoki Watanabe

IPC分类号： B23K100

CPC分类号： B23K1/018 ,  B23K2101/40

摘要： A solder removing apparatus comprises a stage and a head portion. A top face of the stage is a flat surface, and the stage can arbitrarily move in a direction parallel to the top face. On the stage are arranged a first member supplying portion on which one or more first members are located, a second member supplying portion on which one or more second members are located, and a heating portion for heating a member located thereon at an arbitrary temperature. The head comprises a first head and a second head. The first head and the second head can move along the same moving axis in a direction vertical to the top face of the stage independently from each other. The first head adsorbs the first member located on the first member supplying portion and locates the first member on the heating portion. The second head adsorbs the second member located on the second member supplying portion and locates the second member on the first member located on the heating portion. The solder adhering to the second member is melted when heated by the heating portion through the first member and adheres to the first member. As a result, the solder is removed from the second member.

摘要翻译： 焊料去除装置包括台和头部。 舞台的顶面是平坦的表面，舞台可以在平行于顶面的方向任意移动。 在台架上布置有一个或多个第一构件所在的第一构件供应部分，一个或多个第二构件所在的第二构件供应部分和用于在任意温度下加热位于其上的构件的加热部分。 头部包括第一头部和第二头部。 第一头部和第二头部可以在垂直于台面的顶面的方向上沿着相同的移动轴线彼此独立地移动。 第一头吸附位于第一构件供应部分上的第一构件，并将第一构件定位在加热部分上。 第二头部吸附位于第二构件供应部分上的第二构件，并将第二构件定位在位于加热部分上的第一构件上。 当加热部分通过第一部件加热时，附着在第二部件上的焊料熔化，并附着在第一部件上。 结果，从第二构件去除焊料。

公开(公告)号：US06207652B1

公开(公告)日：2001-03-27

申请号：US09051284

申请日：1998-04-09

申请人： Takeshi Sakai ,  Hideo Kitano ,  Fu-Gong Yu ,  Shinji Nakayama ,  Kaoru Kojima ,  Hitomi Kimura ,  Yoshikuni Nakanishi ,  Kaoru Katayama ,  Takanari Tominaga ,  Kazuo Shimanaka ,  Katsushige Ikai ,  Ikunoshin Kato

发明人： Takeshi Sakai ,  Hideo Kitano ,  Fu-Gong Yu ,  Shinji Nakayama ,  Kaoru Kojima ,  Hitomi Kimura ,  Yoshikuni Nakanishi ,  Kaoru Katayama ,  Takanari Tominaga ,  Kazuo Shimanaka ,  Katsushige Ikai ,  Ikunoshin Kato

IPC分类号： A61K31715

CPC分类号： C12Y302/01078 ,  A61K31/737 ,  C12N9/2494 ,  C12P19/14 ,  C12Y302/01044

摘要： Apoptosis inducers, anticancer drugs and carcinostatic drugs containing sulfated-fucose-containing polysaccharide(s) and/or degradation product(s) thereof, and a method for inducing apoptosis by using sulfated-fucose-containing polysaccharide(s) and/or degradation product(s) thereof as the active ingredient. A degrading enzyme which is useful in the production of the degradation products of sulfated-fucose-containing polysaccharides.

公开(公告)号：US5940728A

公开(公告)日：1999-08-17

申请号：US647672

申请日：1996-05-15

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K1/005 ,  H01L21/60 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L24/75 ,  H01L24/81 ,  H05K3/3489 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174

摘要： A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.

摘要翻译： 一种用于制造电子电路的方法，根据该方法，可以通过施加允许在金属表面上的氧化物膜，有机物质，碳等的金属表面处理方法而不使用复合物来进行焊接，而不使用焊剂 过程也不利于影响电子设备或电路基板。 通过焊料连接电子设备和电路基板的过程包括以下步骤：用激光束照射焊料以清洁焊料，将电子器件对准和安装在电路基板上，并将所述焊料热熔化成 低氧含量的气氛来粘合电子器件和电路基板。

公开(公告)号：US5832595A

公开(公告)日：1998-11-10

申请号：US260382

申请日：1994-06-14

申请人： Shigenobu Maruyama ,  Mikio Hongo ,  Haruhisa Sakamoto ,  Tateoki Miyauchi ,  Ryohei Satoh ,  Kiyoshi Matsui ,  Shinichi Kazui ,  Kaoru Katayama ,  Hiroshi Fukuda

发明人： Shigenobu Maruyama ,  Mikio Hongo ,  Haruhisa Sakamoto ,  Tateoki Miyauchi ,  Ryohei Satoh ,  Kiyoshi Matsui ,  Shinichi Kazui ,  Kaoru Katayama ,  Hiroshi Fukuda

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L23/12 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/22

CPC分类号： H01L21/485 ,  H05K3/225 ,  H05K1/095 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/121 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/102 ,  Y10T29/49124 ,  Y10T29/49718 ,  Y10T29/49732

摘要： A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of completely modifying an open pattern defect of the conductive lines or an insulator layer, and its device, wherein a first energy beam is irradiated to portions of repair terminals 9 and 9' which are intended to connect or disconnect, of conductive lines 5 and 5' in the electronic circuit board thereby removing a protection layer, making windows and exposing the terminals 9 and 9' for connection; a second energy beam is irradiated thereby disconnecting the repair terminals 9 and 9', or a metal piece for connecting is supplied to between the repair terminals 9 and 9' and applying an energy thereto thereby electrically connecting them; and the disconnected or connected windowed portion is locally coated with the insulator layer thereby modifying the conductive lines of the electronic circuit board. Further, windows 311 or 311' is formed in an insulating protection layer 310 on a conductive line connecting portion 308 formed in a couple or a conductive line disconnecting portion 309, a conductive line of the conductive line disconnecting portion is disconnected or a liquid material 312 for connecting conductive lines is supplied to the conductive line connecting portion 308, a metal layer 313 is precipitated by heating the liquid material 312 thereby connecting the conductive line connecting portion 308, and the window 311 or 311' is coated with an organic insulator layer.

摘要翻译： 通过在电子电路板的导线的指定或任意位置执行导线的断开或连接来改变电子电路板的方法，从而改变电路并完全改变导电线的开路图案缺陷，或 绝缘体层及其装置，其中第一能量束照射到旨在连接或断开电子电路板中的导线5和5'的修复端子9和9'的部分，从而去除保护层， 制造窗户并露出端子9和9'用于连接; 照射第二能量束，从而断开维修端子9和9'，或者用于连接的金属片供应到修理端子9和9'之间并向其施加能量，从而电连接它们; 并且断开或连接的窗口部分局部地涂覆有绝缘体层，从而修改电子电路板的导线。 此外，窗311或311'形成在形成在耦合或导线断路部分309中的导线连接部分308上的绝缘保护层310中，导线断开部分的导线被断开或液体材料312 用于连接导线的导线被提供给导线连接部分308，金属层313通过加热液体材料312而沉淀，从而连接导线连接部分308，并且窗311或311'被涂覆有机绝缘体层。

公开(公告)号：US5262614A

公开(公告)日：1993-11-16

申请号：US714373

申请日：1991-05-31

申请人： Kaoru Katayama ,  Hidetaka Shigi

发明人： Kaoru Katayama ,  Hidetaka Shigi

IPC分类号： H05K3/28 ,  H01L21/48 ,  H01L23/02 ,  H01L23/10 ,  H05K1/03 ,  H05K3/00 ,  H05K3/24 ,  B23K26/02 ,  B23K26/08

CPC分类号： H01L21/4846 ,  H01L21/481 ,  H05K3/0032 ,  H05K1/0306 ,  H05K2203/1383 ,  H05K3/0052 ,  H05K3/243

摘要： A circuit board is manufactured by a method having the steps of depositing a metal pattern on a ceramic board, depositing a thin layer of a high polymer material on the ceramic board formed with the metal pattern, depositing a protective layer of a high polymer material on the thin layer of the high polymer material, and directing a laser beam toward and onto the protective layer and the thin layer deposited on a plating region of the metal pattern and a cutting region of the ceramic board thereby selectively removing part of those layers. The laser beam has a wavelength range of from 150 nm to 400 nm, an energy density range of from 0.5 J/cm.sup.2 to 5.0 J/cm.sup.2, and a pulse width range of from 100 ps to 1 .mu.s.

摘要翻译： 电路板通过以下步骤制造：具有以下步骤的方法：在陶瓷板上沉积金属图案，在形成有金属图案的陶瓷板上沉积高分子材料薄层，将高分子材料的保护层沉积在 高分子材料的薄层，并且将激光束导向保护层和沉积在金属图案的镀覆区域上的薄层和陶瓷板的切割区域，从而选择性地去除这些层的一部分。 激光束的波长范围为150nm〜400nm，能量密度范围为0.5J / cm 2〜5.0J / cm 2，脉冲宽度范围为100ps〜1μs。