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公开(公告)号:US5940728A
公开(公告)日:1999-08-17
申请号:US647672
申请日:1996-05-15
申请人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
发明人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
CPC分类号: H01L24/75 , H01L24/81 , H05K3/3489 , H01L2224/1181 , H01L2224/13111 , H01L2224/16 , H01L2224/45144 , H01L2224/75 , H01L2224/7501 , H01L2224/81014 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/166 , H05K3/3457 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49174
摘要: A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.
摘要翻译: 一种用于制造电子电路的方法,根据该方法,可以通过施加允许在金属表面上的氧化物膜,有机物质,碳等的金属表面处理方法而不使用复合物来进行焊接,而不使用焊剂 过程也不利于影响电子设备或电路基板。 通过焊料连接电子设备和电路基板的过程包括以下步骤:用激光束照射焊料以清洁焊料,将电子器件对准和安装在电路基板上,并将所述焊料热熔化成 低氧含量的气氛来粘合电子器件和电路基板。
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公开(公告)号:US06410881B1
公开(公告)日:2002-06-25
申请号:US09882019
申请日:2001-06-18
申请人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
发明人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
IPC分类号: B23K2600
摘要: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
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公开(公告)号:US06269998B1
公开(公告)日:2001-08-07
申请号:US09704784
申请日:2000-11-03
申请人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
发明人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
IPC分类号: B23K3102
CPC分类号: H01L24/75 , H01L24/81 , H01L2224/1181 , H01L2224/13111 , H01L2224/16 , H01L2224/45144 , H01L2224/75 , H01L2224/7501 , H01L2224/81014 , H01L2224/81022 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/166 , H05K3/3457 , H05K3/3489 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49174 , H01L2924/00
摘要: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
摘要翻译: 电子电路的制造方法包括将电子器件设置在电路基板上,对形成在电子器件或电路基板上的焊料进行热熔融,使电子器件和电路基板接合。 该方法包括以下步骤:将液体供给到电路基板上的焊盘上,将电子设备对准和安装在焊盘上,将电路基板放置在处理容器中并加热电路基板。 加热步骤包括控制处理容器中的气氛的压力,热熔焊料以防止液体的至少一部分蒸发直到电子器件和电路基板接合,并允许液体在 电子器件和电路基板结合。
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公开(公告)号:US6161748A
公开(公告)日:2000-12-19
申请号:US538515
申请日:2000-03-30
申请人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
发明人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
CPC分类号: H01L24/75 , H01L24/81 , H01L2224/1181 , H01L2224/13111 , H01L2224/16 , H01L2224/45144 , H01L2224/75 , H01L2224/7501 , H01L2224/81014 , H01L2224/81022 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/166 , H05K3/3457 , H05K3/3489 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49174 , H01L2924/00
摘要: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
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公开(公告)号:US06133135A
公开(公告)日:2000-10-17
申请号:US322998
申请日:1999-06-01
申请人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
发明人: Kaoru Katayama , Hiroshi Fukuda , Shinichi Kazui , Toshihiko Ohta , Yasuhiro Iwata , Mitsugu Shirai , Mitsunori Tamura
CPC分类号: H01L24/75 , H01L24/81 , H05K3/3489 , H01L2224/1181 , H01L2224/13111 , H01L2224/16 , H01L2224/45144 , H01L2224/75 , H01L2224/7501 , H01L2224/81014 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/166 , H05K3/3457 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49174
摘要: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
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公开(公告)号:US5499668A
公开(公告)日:1996-03-19
申请号:US330380
申请日:1994-10-27
IPC分类号: B08B7/00 , B23K1/00 , B23K1/20 , B23K26/00 , B23K26/40 , C23G5/00 , H01L21/306 , H01L21/60 , H01L23/10 , H05K3/34 , B08B3/12
CPC分类号: H01L21/02046 , B08B7/0042 , B23K1/206 , B23K26/40 , H01L23/10 , H01L24/81 , H05K3/3489 , B23K2201/36 , B23K2203/14 , B23K2203/26 , H01L2224/13111 , H01L2224/16 , H01L2224/45144 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/166
摘要: Oxide films, and residues of organic matters, carbons, if any, are removed from a metal surface simply without using complicated steps and without giving adverse effects on electronic parts or electronic devices by irradiating the metal surface with a laser beam of lower energy level than energy capable of changing the metal surface structure, thereby cleaning the metal surface.
摘要翻译: 氧化膜和有机物残留物(如果有的话)从金属表面除去,而不用复杂的步骤,并且通过用较低能级的激光束照射金属表面而不会对电子部件或电子器件产生不利影响 能够改变金属表面结构的能量,从而清洁金属表面。
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公开(公告)号:US5801350A
公开(公告)日:1998-09-01
申请号:US619186
申请日:1996-03-21
申请人: Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
发明人: Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
CPC分类号: H01L21/6835 , H01L21/563 , H01L24/81 , H05K3/305 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H05K2201/0154 , H05K2201/10674 , H05K2201/10734 , H05K2203/0783 , H05K2203/107 , H05K3/22 , H05K3/303 , H05K3/3436 , H05K3/3452 , Y02P70/613 , Y10T29/49144 , Y10T428/24917 , Y10T428/2809
摘要: A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.
摘要翻译: 高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。 仅用于临时固定的液体相对于预定面积的润湿性提高。 通过使用该方法将电子部件临时固定在基板上之后,可以通过无流动回流焊接耐久地焊接电子部件。
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公开(公告)号:US06423405B1
公开(公告)日:2002-07-23
申请号:US09384105
申请日:1999-08-27
申请人: Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
发明人: Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
IPC分类号: B32B712
CPC分类号: H01L21/6835 , H01L21/563 , H01L24/81 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H05K3/22 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3452 , H05K2201/0154 , H05K2201/10674 , H05K2201/10734 , H05K2203/0783 , H05K2203/107 , Y02P70/613 , Y10T29/49144 , Y10T428/24917 , Y10T428/2809 , H01L2924/00
摘要: There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.
摘要翻译: 公开了一种高分子材料的表面改性方法,使得通过仅在其上将电子部件等暂时固定在预定区域上的预定区域照射和准分子激光束,所述预定区域通过液体在具有高聚合物层的基底上 仅用于临时固定的液体的表面润湿性相对于预定面积得到改善。 在通过使用该方法将电子部件暂时固定在基板上之后,可以通过无电流回流焊接将电子部件焊接在优选的耐久性上。
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公开(公告)号:US6017424A
公开(公告)日:2000-01-25
申请号:US028095
申请日:1998-02-23
申请人: Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
发明人: Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
IPC分类号: C08J7/00 , H01L21/56 , H01L21/60 , H01L21/68 , H05K3/22 , H05K3/30 , H05K3/34 , C07C1/00 , C07C2/00 , C07C4/00 , C07C5/00 , C07C6/00
CPC分类号: H01L21/6835 , H01L21/563 , H01L24/81 , H05K3/305 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H05K2201/0154 , H05K2201/10674 , H05K2201/10734 , H05K2203/0783 , H05K2203/107 , H05K3/22 , H05K3/303 , H05K3/3436 , H05K3/3452 , Y02P70/613 , Y10T29/49144 , Y10T428/24917 , Y10T428/2809
摘要: A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.
摘要翻译: 高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。 仅用于临时固定的液体相对于预定面积的润湿性提高。 通过使用该方法将电子部件临时固定在基板上之后,可以通过无流动回流焊接耐久地焊接电子部件。
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公开(公告)号:US5865365A
公开(公告)日:1999-02-02
申请号:US761430
申请日:1996-12-06
申请人: Toru Nishikawa , Ryohei Satoh , Masahide Hara , Tetsuya Hayashida , Mitugu Shirai , Osamu Yamada , Hiroko Takehara , Yasuhiro Iwata , Mitsunori Tamura , Masahito Ijuin
发明人: Toru Nishikawa , Ryohei Satoh , Masahide Hara , Tetsuya Hayashida , Mitugu Shirai , Osamu Yamada , Hiroko Takehara , Yasuhiro Iwata , Mitsunori Tamura , Masahito Ijuin
CPC分类号: H01L24/12 , B23K1/0016 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/11 , H01L24/29 , H01L24/81 , H01L24/83 , H05K3/3489 , B23K2201/40 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/29109 , H01L2224/29111 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/83192 , H01L2224/83805 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H05K2203/0278 , H05K2203/041 , H05K2203/0435 , H05K2203/086 , H05K2203/087 , H05K2203/095 , H05K2203/1157 , H05K3/3426
摘要: A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.
摘要翻译: 用于制造电子电路器件的焊接方法使用供应至待接合的至少一个连接部件的有机材料。 连接构件位于氧化气氛中,并在非氧化气氛中加热以除去存在于预制部分或金属化粘合部分的表面上的氧化物和/或污染层。 通过该方法,进行无焊剂焊接,位移偏移降低,并且获得了在回流之后具有减少残留物的焊接连接的高可靠性。
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