公开(公告)号：US06410881B1

公开(公告)日：2002-06-25

申请号：US09882019

申请日：2001-06-18

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K2600

摘要： The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

公开(公告)号：US06269998B1

公开(公告)日：2001-08-07

申请号：US09704784

申请日：2000-11-03

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K3102

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81022 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  H05K3/3489 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174 ,  H01L2924/00

摘要： The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

摘要翻译： 电子电路的制造方法包括将电子器件设置在电路基板上，对形成在电子器件或电路基板上的焊料进行热熔融，使电子器件和电路基板接合。 该方法包括以下步骤：将液体供给到电路基板上的焊盘上，将电子设备对准和安装在焊盘上，将电路基板放置在处理容器中并加热电路基板。 加热步骤包括控制处理容器中的气氛的压力，热熔焊料以防止液体的至少一部分蒸发直到电子器件和电路基板接合，并允许液体在 电子器件和电路基板结合。

公开(公告)号：US6161748A

公开(公告)日：2000-12-19

申请号：US538515

申请日：2000-03-30

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K1/005 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00 ,  B23K31/02

CPC分类号： H01L24/75 ,  H01L24/81 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81022 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  H05K3/3489 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174 ,  H01L2924/00

摘要： The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

公开(公告)号：US06133135A

公开(公告)日：2000-10-17

申请号：US322998

申请日：1999-06-01

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K1/005 ,  H01L21/60 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L24/75 ,  H01L24/81 ,  H05K3/3489 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174

摘要： The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

公开(公告)号：US5940728A

公开(公告)日：1999-08-17

申请号：US647672

申请日：1996-05-15

申请人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

发明人： Kaoru Katayama ,  Hiroshi Fukuda ,  Shinichi Kazui ,  Toshihiko Ohta ,  Yasuhiro Iwata ,  Mitsugu Shirai ,  Mitsunori Tamura

IPC分类号： B23K1/005 ,  H01L21/60 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L24/75 ,  H01L24/81 ,  H05K3/3489 ,  H01L2224/1181 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/81014 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166 ,  H05K3/3457 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49174

摘要： A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.

摘要翻译： 一种用于制造电子电路的方法，根据该方法，可以通过施加允许在金属表面上的氧化物膜，有机物质，碳等的金属表面处理方法而不使用复合物来进行焊接，而不使用焊剂 过程也不利于影响电子设备或电路基板。 通过焊料连接电子设备和电路基板的过程包括以下步骤：用激光束照射焊料以清洁焊料，将电子器件对准和安装在电路基板上，并将所述焊料热熔化成 低氧含量的气氛来粘合电子器件和电路基板。

公开(公告)号：US5499668A

公开(公告)日：1996-03-19

申请号：US330380

申请日：1994-10-27

申请人： Kaoru Katayama ,  Shinichi Kazui ,  Yasuhiro Iwata ,  Hiroshi Fukuda ,  Toshihiko Ohta

发明人： Kaoru Katayama ,  Shinichi Kazui ,  Yasuhiro Iwata ,  Hiroshi Fukuda ,  Toshihiko Ohta

IPC分类号： B08B7/00 ,  B23K1/00 ,  B23K1/20 ,  B23K26/00 ,  B23K26/40 ,  C23G5/00 ,  H01L21/306 ,  H01L21/60 ,  H01L23/10 ,  H05K3/34 ,  B08B3/12

CPC分类号： H01L21/02046 ,  B08B7/0042 ,  B23K1/206 ,  B23K26/40 ,  H01L23/10 ,  H01L24/81 ,  H05K3/3489 ,  B23K2201/36 ,  B23K2203/14 ,  B23K2203/26 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/166

摘要： Oxide films, and residues of organic matters, carbons, if any, are removed from a metal surface simply without using complicated steps and without giving adverse effects on electronic parts or electronic devices by irradiating the metal surface with a laser beam of lower energy level than energy capable of changing the metal surface structure, thereby cleaning the metal surface.

摘要翻译： 氧化膜和有机物残留物（如果有的话）从金属表面除去，而不用复杂的步骤，并且通过用较低能级的激光束照射金属表面而不会对电子部件或电子器件产生不利影响 能够改变金属表面结构的能量，从而清洁金属表面。

公开(公告)号：US06423405B1

公开(公告)日：2002-07-23

申请号：US09384105

申请日：1999-08-27

申请人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

发明人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

IPC分类号： B32B712

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/22 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0783 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/2809 ,  H01L2924/00

摘要： There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.

摘要翻译： 公开了一种高分子材料的表面改性方法，使得通过仅在其上将电子部件等暂时固定在预定区域上的预定区域照射和准分子激光束，所述预定区域通过液体在具有高聚合物层的基底上 仅用于临时固定的液体的表面润湿性相对于预定面积得到改善。 在通过使用该方法将电子部件暂时固定在基板上之后，可以通过无电流回流焊接将电子部件焊接在优选的耐久性上。

公开(公告)号：US6017424A

公开(公告)日：2000-01-25

申请号：US028095

申请日：1998-02-23

申请人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

发明人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

IPC分类号： C08J7/00 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  C07C1/00 ,  C07C2/00 ,  C07C4/00 ,  C07C5/00 ,  C07C6/00

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L24/81 ,  H05K3/305 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K3/22 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3452 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/2809

摘要： A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

摘要翻译： 高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。 仅用于临时固定的液体相对于预定面积的润湿性提高。 通过使用该方法将电子部件临时固定在基板上之后，可以通过无流动回流焊接耐久地焊接电子部件。

公开(公告)号：US5801350A

公开(公告)日：1998-09-01

申请号：US619186

申请日：1996-03-21

申请人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

发明人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

IPC分类号： C08J7/00 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L24/81 ,  H05K3/305 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K3/22 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3452 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/2809

摘要： A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

摘要翻译： 高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。 仅用于临时固定的液体相对于预定面积的润湿性提高。 通过使用该方法将电子部件临时固定在基板上之后，可以通过无流动回流焊接耐久地焊接电子部件。

公开(公告)号：US5832595A

公开(公告)日：1998-11-10

申请号：US260382

申请日：1994-06-14

申请人： Shigenobu Maruyama ,  Mikio Hongo ,  Haruhisa Sakamoto ,  Tateoki Miyauchi ,  Ryohei Satoh ,  Kiyoshi Matsui ,  Shinichi Kazui ,  Kaoru Katayama ,  Hiroshi Fukuda

发明人： Shigenobu Maruyama ,  Mikio Hongo ,  Haruhisa Sakamoto ,  Tateoki Miyauchi ,  Ryohei Satoh ,  Kiyoshi Matsui ,  Shinichi Kazui ,  Kaoru Katayama ,  Hiroshi Fukuda

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L23/12 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/22

CPC分类号： H01L21/485 ,  H05K3/225 ,  H05K1/095 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/121 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/102 ,  Y10T29/49124 ,  Y10T29/49718 ,  Y10T29/49732

摘要： A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of completely modifying an open pattern defect of the conductive lines or an insulator layer, and its device, wherein a first energy beam is irradiated to portions of repair terminals 9 and 9' which are intended to connect or disconnect, of conductive lines 5 and 5' in the electronic circuit board thereby removing a protection layer, making windows and exposing the terminals 9 and 9' for connection; a second energy beam is irradiated thereby disconnecting the repair terminals 9 and 9', or a metal piece for connecting is supplied to between the repair terminals 9 and 9' and applying an energy thereto thereby electrically connecting them; and the disconnected or connected windowed portion is locally coated with the insulator layer thereby modifying the conductive lines of the electronic circuit board. Further, windows 311 or 311' is formed in an insulating protection layer 310 on a conductive line connecting portion 308 formed in a couple or a conductive line disconnecting portion 309, a conductive line of the conductive line disconnecting portion is disconnected or a liquid material 312 for connecting conductive lines is supplied to the conductive line connecting portion 308, a metal layer 313 is precipitated by heating the liquid material 312 thereby connecting the conductive line connecting portion 308, and the window 311 or 311' is coated with an organic insulator layer.

摘要翻译： 通过在电子电路板的导线的指定或任意位置执行导线的断开或连接来改变电子电路板的方法，从而改变电路并完全改变导电线的开路图案缺陷，或 绝缘体层及其装置，其中第一能量束照射到旨在连接或断开电子电路板中的导线5和5'的修复端子9和9'的部分，从而去除保护层， 制造窗户并露出端子9和9'用于连接; 照射第二能量束，从而断开维修端子9和9'，或者用于连接的金属片供应到修理端子9和9'之间并向其施加能量，从而电连接它们; 并且断开或连接的窗口部分局部地涂覆有绝缘体层，从而修改电子电路板的导线。 此外，窗311或311'形成在形成在耦合或导线断路部分309中的导线连接部分308上的绝缘保护层310中，导线断开部分的导线被断开或液体材料312 用于连接导线的导线被提供给导线连接部分308，金属层313通过加热液体材料312而沉淀，从而连接导线连接部分308，并且窗311或311'被涂覆有机绝缘体层。