公开(公告)号：US5506494A

公开(公告)日：1996-04-09

申请号：US95410

申请日：1993-09-13

申请人： Hajime Ito ,  Takashi Nagasaka

发明人： Hajime Ito ,  Takashi Nagasaka

IPC分类号： G05F1/56 ,  H01C7/00 ,  G05F1/567

CPC分类号： G05F1/56 ,  H01C7/008 ,  Y10S323/907

摘要： A resistor circuit includes a pair of linear conductive films and a resistive film. The resistive film is formed on an area between the conductive films and electrically connected to the conductive films. A pair of terminals are electrically connected to portions of the conductive films respectively. A current source is electrically connected between the terminals to deliver an electrical current thereto. A pair of voltage output terminals are electrically connected to portions of the conductive films respectively. At least one of the voltage output terminals is disposed at a portion of the conductive films other than a portion at which the terminals are formed. An output voltage from the voltage output terminals is exactly proportional to a current flowing between them independent of changes in an ambient temperature. The circuit may be implemented in an integrated circuit environment using, e.g., multiple thin film resistors.

摘要翻译： 电阻电路包括一对线性导电膜和电阻膜。 电阻膜形成在导电膜之间并与导电膜电连接的区域上。 一对端子分别电连接到导电膜的一部分。 电流源电连接在端子之间以将电流传送到其上。 一对电压输出端子分别与导电膜的部分电连接。 电压输出端子中的至少一个设置在除了形成端子的部分之外的导电膜的一部分。 来自电压输出端子的输出电压与其间流过的电流成正比，与环境温度的变化无关。 电路可以在使用例如多个薄膜电阻器的集成电路环境中实现。

公开(公告)号：US5483217A

公开(公告)日：1996-01-09

申请号：US91718

申请日：1993-07-15

申请人： Takashi Nagasaka ,  Mitsuhiro Saitou ,  Takahisa Koyasu ,  Hiroyuki Ban ,  Yuji Otani ,  Kengo Oka ,  Kyoko Nagaoka

发明人： Takashi Nagasaka ,  Mitsuhiro Saitou ,  Takahisa Koyasu ,  Hiroyuki Ban ,  Yuji Otani ,  Kengo Oka ,  Kyoko Nagaoka

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K1/14 ,  H05K1/16 ,  H05K3/28 ,  H01C1/02

CPC分类号： H05K3/284 ,  H05K1/167 ,  H05K1/0271 ,  H05K1/095 ,  H05K1/141 ,  H05K2201/0317 ,  H05K2201/09236 ,  H05K2201/10386 ,  H05K2201/10545

摘要： An electronic circuit device decreases dispersion in the output of the circuit caused by changes in the resistance of the resistors resulting from stress. Resistor positions are selected on the circuit board so that a change in the circuit output caused by a change in resistance of a first resistor group becomes equal to a change caused by a change in resistance caused by a second resistor group, these changes being in opposite directions so as to cancel each other. Alternately, a plurality of resistors are connected to form a composite resistor such that the effect upon resistance of the composite resistor caused by the resistor having decreased resistance is cancelled by the effect upon resistance of the composite resistor caused by a resistor having an increased resistance.

摘要翻译： 电子电路装置减少由于应力引起的电阻电阻变化引起的电路输出中的色散。 在电路板上选择电阻器位置，使得由第一电阻器组的电阻变化引起的电路输出的变化等于由第二电阻器组造成的电阻变化引起的变化，这些变化是相反的 方向相互抵消。 或者，连接多个电阻器以形成复合电阻器，使得由具有降低的电阻的电阻器引起的复合电阻器的电阻的影响由于由具有增加的电阻的电阻器引起的复合电阻器的电阻的影响而被抵消。

公开(公告)号：US07551053B2

公开(公告)日：2009-06-23

申请号：US10575470

申请日：2004-11-05

申请人： Mitsuhiro Yamashita ,  Takashi Nagasaka ,  Hideki Miura ,  Yasuhiro Matsukawa ,  Kazuo Sato ,  Akira Sato ,  Hironori Sato ,  Takayuki Ito ,  Yasuhiko Kitajima

发明人： Mitsuhiro Yamashita ,  Takashi Nagasaka ,  Hideki Miura ,  Yasuhiro Matsukawa ,  Kazuo Sato ,  Akira Sato ,  Hironori Sato ,  Takayuki Ito ,  Yasuhiko Kitajima

IPC分类号： H01F27/29

CPC分类号： H01F17/045 ,  H01F27/027 ,  H01F27/292 ,  H01F41/082 ,  H01F41/10

摘要： A coil apparatus that can increase mechanical strength of terminal portions and assure sufficient impact resistant properties and vibration resistant properties even in an application in a severe use environment such as an in-vehicle coil apparatus. Terminals are formed of one metal sheet, and include an attachment portion, an intermediate portion, and a bottom portion. One end of the attachment portion is fixed at each terminal attachment portion of a core. One end of the intermediate portion is continuous with the other end of the attachment portion at a first bent portion. The bottom portion has a first end continuous with the other end of the intermediate portion at a second bent portion, facing the attachment portion, and a second free end. The intermediate portion has a hole in a plane thereof. In each hole, both inner edges that are opposed to each other in at least one direction have an arc shape.

摘要翻译： 即使在诸如车载线圈装置的严苛使用环境中的应用中，也能够提高端子部的机械强度并确保充分的耐冲击性和抗振性的线圈装置。 端子由一个金属板形成，并且包括附接部分，中间部分和底部。 连接部的一端固定在芯的各端子安装部。 中间部分的一端在第一弯曲部分与连接部分的另一端连续。 底部具有与第二弯曲部分相对的中间部分的另一端与第一自由端相对的第一端和第二自由端。 中间部分在其平面中具有孔。 在每个孔中，在至少一个方向上彼此相对的两个内边缘都具有弧形。

公开(公告)号：US20070063803A1

公开(公告)日：2007-03-22

申请号：US10575470

申请日：2004-11-05

申请人： Mitsuhiro Yamashita ,  Takashi Nagasaka ,  Hideki Miura ,  Yasuhiro Matsukawa ,  Kazuo Sato ,  Akira Sato ,  Hironori Sato ,  Takayuki Ito ,  Yasuhiko Kitajima

发明人： Mitsuhiro Yamashita ,  Takashi Nagasaka ,  Hideki Miura ,  Yasuhiro Matsukawa ,  Kazuo Sato ,  Akira Sato ,  Hironori Sato ,  Takayuki Ito ,  Yasuhiko Kitajima

IPC分类号： H01F27/02

CPC分类号： H01F17/045 ,  H01F27/027 ,  H01F27/292 ,  H01F41/082 ,  H01F41/10

摘要： A coil apparatus that can increase mechanical strength of terminal portions and assure sufficient impact resistant properties and vibration resistant properties even in an application in a severe use environment such as an in-vehicle coil apparatus. Terminals are formed of one metal sheet, and include an attachment portion, an intermediate portion, and a bottom portion. One end of the attachment portion is fixed at each terminal attachment portion of a core. One end of the intermediate portion is continuous with the other end of the attachment portion at a first bent portion. The bottom portion has a first end continuous with the other end of the intermediate portion at a second bent portion, facing the attachment portion, and a second free end. The intermediate portion has a hole in a plane thereof. In each hole, both inner edges that are opposed to each other in at least one direction have an arc shape.

摘要翻译： 即使在诸如车载线圈装置的严苛使用环境中的应用中，也能够提高端子部的机械强度并确保充分的耐冲击性和抗振性的线圈装置。 端子由一个金属板形成，并且包括附接部分，中间部分和底部。 连接部的一端固定在芯的各端子安装部。 中间部分的一端在第一弯曲部分与连接部分的另一端连续。 底部具有与第二弯曲部分相对的中间部分的另一端与第一自由端相对的第一端和第二自由端。 中间部分在其平面中具有孔。 在每个孔中，在至少一个方向上彼此相对的两个内边缘都具有弧形。

公开(公告)号：US20070046413A1

公开(公告)日：2007-03-01

申请号：US10571771

申请日：2004-11-05

申请人： Mitsuhiro Yamashita ,  Takashi Nagasaka ,  Hideki Miura ,  Yasuhiro Matsukawa ,  Kazuo Sato ,  Akira Sato ,  Hironori Sato ,  Takayuki Ito ,  Yasuhiko Kitajima

发明人： Mitsuhiro Yamashita ,  Takashi Nagasaka ,  Hideki Miura ,  Yasuhiro Matsukawa ,  Kazuo Sato ,  Akira Sato ,  Hironori Sato ,  Takayuki Ito ,  Yasuhiko Kitajima

IPC分类号： H01F27/02

CPC分类号： H01F27/292 ,  H01F17/045 ,  H01F27/027 ,  H01F27/33 ,  H01F41/082

摘要： A coil apparatus having a divided winding conformation and a manufacturing method of the coil apparatus which can prevent a winding from collapsing while achieving a reduction in size of a core and simplification of a structure. A coil apparatus includes a ferrite core and a coil provided around the core. The coil includes at least a first coil portion and a second coil portion, and a boundary end surface of the first coil portion on the second coil portion side is inclined in such a manner that its inner peripheral side is closer to the second coil portion than its outer peripheral side. Further, a boundary end surface of the second coil portion on the first coil portion side is inclined in such a manner that its outer peripheral side is closer to the first coil portion than its inner peripheral side.

摘要翻译： 具有分割绕组结构的线圈装置和线圈装置的制造方法，其可以防止绕组塌陷同时实现芯的尺寸的减小并且简化结构。 线圈装置包括铁氧体磁芯和设置在磁芯周围的线圈。 线圈至少包括第一线圈部分和第二线圈部分，并且第二线圈部分侧的第一线圈部分的边界端面以其内周侧比第二线圈部分更靠近第二线圈部分的方式倾斜， 其外围边。 此外，第一线圈部分侧的第二线圈部分的边界端面以其外周侧比其内周侧更靠近第一线圈部分的方式倾斜。

公开(公告)号：US06791445B2

公开(公告)日：2004-09-14

申请号：US10078947

申请日：2002-02-19

申请人： Kazuhiko Shibata ,  Takashi Nagasaka ,  Junetsu Tamura ,  Yasuhiko Kitajima ,  Hideharu Moro ,  Tsutomu Chou ,  Tsuneo Suzuki

发明人： Kazuhiko Shibata ,  Takashi Nagasaka ,  Junetsu Tamura ,  Yasuhiko Kitajima ,  Hideharu Moro ,  Tsutomu Chou ,  Tsuneo Suzuki

IPC分类号： H01F2702

CPC分类号： H01F17/04 ,  H01F27/027 ,  H01F41/0246 ,  H01F41/127 ,  H01F2017/046 ,  Y10T29/4902 ,  Y10T29/49071

摘要： A coil-embedded dust core and a method for manufacturing the coil-embedded dust core are provided. The coil-embedded dust core comprises a coil formed from a flat conductor wound in a coil configuration, and a green body consisting of insulating material-coated ferromagnetic metal particles. This results in a coil-embedded dust core more compact in size but with larger inductance. A rectangular wire can be used as the flat conductor. In addition, parts of the coil may function as terminal sections. In this case, the terminal sections of the coil may be formed wider than other part of the coil. The coil-embedded dust core is less prone to joint failures between a coil and terminal sections and to insulation failures of the coil and the terminal section with respect to the magnetic powder. The coil-embedded dust core is more compact while achieving larger inductance.

公开(公告)号：US5627344A

公开(公告)日：1997-05-06

申请号：US362129

申请日：1994-12-22

申请人： Nozomi Tanifuji ,  Akihiko Naito ,  Koji Sawada ,  Tohru Nomura ,  Yoshiyuki Miyase ,  Takashi Nagasaka

发明人： Nozomi Tanifuji ,  Akihiko Naito ,  Koji Sawada ,  Tohru Nomura ,  Yoshiyuki Miyase ,  Takashi Nagasaka

IPC分类号： H05K1/09 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/248 ,  H01L23/49883 ,  H01L23/5384 ,  H05K3/4061 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/113 ,  H05K2201/035 ,  H05K3/245 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49163 ,  Y10T29/49165

摘要： A multilayer ceramic circuit substrate having therein internal conductor patterns comprising W and/or Mo as a main component and surface conductor patterns comprising Cu as a main component formed onto a surface layer of the multilayer ceramic circuit substrate, wherein an intermediate metal layer comprising 40 to 90 wt. % of W and/or Mo and 10 to 60 wt. % of at least one element selected from the group consisting of Ir, Pt, Ti, and Cr is formed in through-holes of the surface layer and on parts of the surface layer in the vicinity of the through holes on the surface layer, whereby the internal conductor patterns and the surface conductor patterns are electrically connected through the intermediate metal layer. The alumina multilayer ceramic circuit substrate provides an excellent bonding strength and electrical conductivity between the internal conductors and the surface conductors and enables high precision wiring and miniaturization of an electronic circuit part.

摘要翻译： 一种多层陶瓷电路基板，其中具有包含W和/或Mo作为主要成分的内部导体图案和形成在所述多层陶瓷电路基板的表面层上的以Cu为主要成分的表面导体图案，其中， 90重量％ W和/或Mo的％，和10〜60wt。 在表面层的通孔和表面层的通孔附近的表面层的一部分的通孔中形成选自由Ir，Pt，Ti和Cr组成的组中的至少一种元素的％，由此 内部导体图案和表面导体图案通过中间金属层电连接。 氧化铝多层陶瓷电路基板在内部导体和表面导体之间提供优异的接合强度和导电性，并且能够实现电子电路部件的高精度布线和小型化。

公开(公告)号：US5593722A

公开(公告)日：1997-01-14

申请号：US599112

申请日：1996-02-09

申请人： Yuji Otani ,  Takashi Nagasaka ,  Mitsuhiro Saitou

发明人： Yuji Otani ,  Takashi Nagasaka ,  Mitsuhiro Saitou

IPC分类号： H01C17/242 ,  H01C17/30 ,  H01L21/70 ,  H05K1/09 ,  H05K1/16 ,  H05K3/46 ,  B05D5/12

CPC分类号： H05K1/167 ,  H01C17/242 ,  H01C17/30 ,  H01L21/705 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/092 ,  H05K2201/0195 ,  H05K2203/171 ,  H05K3/4664

摘要： A method is provided for easily producing thick multi-layer substrates maintaining highly accurate resistances with little variation. A thick-film resistor 6 on a ceramic substrate 1 is fired at a temperature higher than the temperature of firing a glass insulating layer 2 that is formed thereon in contact therewith. This makes it possible to decrease the change in the resistance in a subsequent high-temperature step of firing the glass insulating layers 2 to 4. Moreover, after the glass insulating layer 2 is formed on the thick-film resistor 6 on the ceramic substrate 1, laser trimming is effected through a window or the glass insulating layer 2 and, thereafter, the glass insulating layers 3 and 4 are formed. This makes it possible to decrease the change in the resistance of the thick-film resistor 6 after laser trimming and to reduce the laser output.

摘要翻译： 提供了一种容易地生产具有很小变化的保持高精度电阻的厚多层基板的方法。 陶瓷基板1上的厚膜电阻6在比与其形成的玻璃绝缘层2的烧成温度高的温度下烧成。 这使得可以减少烧结玻璃绝缘层2至4的后续高温步骤中的电阻变化。此外，在玻璃绝缘层2形成在陶瓷基板1上的厚膜电阻器6上之后 通过窗口或玻璃绝缘层2进行激光修整，然后形成玻璃绝缘层3和4。 这使得可以减少激光微调后厚膜电阻6的电阻变化并减少激光输出。

公开(公告)号：US5439732A

公开(公告)日：1995-08-08

申请号：US184104

申请日：1994-01-21

申请人： Takashi Nagasaka ,  Yuji Ontani ,  Mitsuhiro Saitou

发明人： Takashi Nagasaka ,  Yuji Ontani ,  Mitsuhiro Saitou

IPC分类号： H05K1/09 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B32B9/00

CPC分类号： H01L23/49883 ,  H01L21/4867 ,  H01L23/5383 ,  H05K3/4061 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/035 ,  H05K2201/0352 ,  H05K2201/096 ,  H05K3/248 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4667 ,  Y10S428/901 ,  Y10T428/12507 ,  Y10T428/12514 ,  Y10T428/1284 ,  Y10T428/12896 ,  Y10T428/24917 ,  Y10T428/24926

摘要： In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multilayer is a non-copper metal having a melting point higher than a temperature at which the ceramic multilayer is fired, typically Ag. Cu and Ag form eutectic crystals when firing the surface conductor layer of Cu. This can be prevented by connecting the surface conductor layer and the inner conductor with Ag-Pd or a metal which is different from the materials of the surface wiring layer and the inner conductor and which does not form eutectic crystals with the material of the surface wiring layer at the temperature at which the surface wiring layer is fired.

摘要翻译： 在陶瓷多层布线板中，表面导体层由铜基材料制成，并且陶瓷多层中的内部导体是熔点高于陶瓷多层烧制温度的非铜金属 ，通常为Ag。 Cu和Ag在烧制Cu的表面导体层时形成共晶晶体。 这可以通过用与表面布线层和内部导体的材料不同的Ag-Pd或金属连接表面导体层和内部导体，并且不与表面布线的材料形成共晶体 在表面布线层被烧制的温度下。

公开(公告)号：US5308686A

公开(公告)日：1994-05-03

申请号：US802229

申请日：1991-12-04

申请人： Takashi Nagasaka ,  Hideki Nakagawara

发明人： Takashi Nagasaka ,  Hideki Nakagawara

IPC分类号： H05K1/09 ,  H01L21/60 ,  H01L23/14 ,  H01L23/498 ,  H05K3/06 ,  H05K3/24 ,  B32B9/00

CPC分类号： H01L24/85 ,  H01L23/142 ,  H01L23/49866 ,  H05K3/24 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/85 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/09 ,  H05K2201/0338 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A substrate on which a protected conductive layer is formed. The conductive layer is formed by laminating together different kinds of conductive metal layers. A lowermost conductive metal layer of the conductive metal layers is formed on an insulating surface of a substrate body. A restraining structure contacts at least two conductive metal layers of the conductive metal layers. The restraining structure restrains elution of the conductive metal to prevent parts of the conductive metal from being eroded.

摘要翻译： 形成有被保护的导电层的基板。 导电层通过将不同种类的导电金属层层压在一起而形成。 在衬底主体的绝缘表面上形成导电金属层的最下面的导电金属层。 抑制结构与导电金属层的至少两个导电金属层接触。 约束结构抑制导电金属的溶出，以防止导电金属的一部分被侵蚀。