公开(公告)号：US09258467B2

公开(公告)日：2016-02-09

申请号：US14084410

申请日：2013-11-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H04N3/14 ,  H04N5/335 ,  H04N5/225 ,  H01L27/146 ,  B29L31/00

CPC classification number: H04N5/2253 ,  B29L2031/764 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014

Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

Abstract translation: 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。

公开(公告)号：US09257372B2

公开(公告)日：2016-02-09

申请号：US14032075

申请日：2013-09-19

Applicant: STMicroelectronics (Malta) Ltd ,  STMicroelectronics Pte Ltd

Inventor： Roseanne Duca ,  Kim-Yong Goh ,  Xueren Zhang ,  Kevin Formosa

IPC: H01L23/495 ,  H01L21/56 ,  G01P1/02 ,  H01L23/31 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L23/49541 ,  G01P1/023 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/1815 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/09781 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2224/45099

Abstract: A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package.

Abstract translation: 半导体器件的表面贴装封装具有：封装，容纳至少一个包含半导体材料的管芯; 以及电接触引线，从封装凸出以电耦合到电路板的接触焊盘; 封装具有设计成面向电路板的顶表面的主面，该主面具有设计成用于机械耦合到电路板的耦合特征，以增加安装封装的谐振频率。 耦合特征设想至少一个第一耦合凹槽，其限定在从主面开始的封装内，被设计成由固定到电路板的对应耦合元件接合，从而限制安装的封装的移动。

公开(公告)号：US09176089B2

公开(公告)日：2015-11-03

申请号：US13853732

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: H01L31/058 ,  G01N27/22 ,  H01L25/065 ,  H01L25/00 ,  G01L9/12 ,  G01K7/01 ,  H01L27/02 ,  H01L29/78 ,  G01K7/18 ,  G01K7/20

CPC classification number: G01N27/223 ,  G01D21/02 ,  G01K7/01 ,  G01K7/16 ,  G01K7/186 ,  G01K7/20 ,  G01L9/12 ,  G01L19/0092 ,  H01L25/0652 ,  H01L25/50 ,  H01L27/0248 ,  H01L29/7804 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成到单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。

公开(公告)号：US09171823B2

公开(公告)日：2015-10-27

申请号：US13341890

申请日：2011-12-30

Applicant: KahWee Gan ,  Yaohuang Huang

Inventor： KahWee Gan ,  Yaohuang Huang

IPC: H05K1/18 ,  H01L23/12 ,  H01L23/053 ,  H05K1/00 ,  H05K1/11 ,  H01R43/00 ,  H05K3/30 ,  H01L25/03 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/03 ,  H01L21/561 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/24146 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/19103 ,  H01L2924/19104 ,  Y10T29/49117 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: An embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has a first submodule node, and the second submodule is disposed over the first submodule and has a second submodule node. The conductive structure couples the first submodule node to one of the module nodes and couples the second submodule node to one of the module nodes. Another embodiment of a circuit module includes module nodes, a first submodule, a second submodule, and a conductive structure. The first submodule has first submodule nodes, and the second submodule is disposed over the first submodule and has second submodule nodes. The conductive structure couples one of the first and second submodule nodes to one of the module nodes and couples one of the first submodule nodes to one of the second submodule nodes.

Abstract translation: 电路模块的实施例包括模块节点，第一子模块，第二子模块和导电结构。 第一子模块具有第一子模块节点，并且第二子模块设置在第一子模块上并且具有第二子模块节点。 导电结构将第一子模块节点耦合到模块节点之一，并将第二子模块节点耦合到模块节点之一。 电路模块的另一实施例包括模块节点，第一子模块，第二子模块和导电结构。 第一子模块具有第一子模块节点，第二子模块设置在第一子模块上并具有第二子模块节点。 导电结构将第一和第二子模块节点之一耦合到模块节点之一，并将第一子模块节点之一耦合到第二子模块节点之一。

公开(公告)号：US20150237245A1

公开(公告)日：2015-08-20

申请号：US14183937

申请日：2014-02-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loic Pierre Louis Renard ,  Wee Chin Judy Lim

IPC: H04N5/235 ,  H04N5/225

CPC classification number: H04N5/2254 ,  H04N5/217 ,  H04N5/2257 ,  H04N5/3572 ,  H04N17/002 ,  Y10T29/49128

Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.

Abstract translation: 公开了一种用于微型照相机的低成本树脂透镜。 树脂透镜具有低外形，特别适用于诸如智能手机的消费产品。 树脂透镜安装到附接到标准四层基板的集成电路管芯上。 集成电路管芯包括用于支持数字图像捕获，传输和处理的电子和/或光电子电路。 图像校正软件调整图像以校正由树脂透镜引入的失真。

公开(公告)号：US20150145137A1

公开(公告)日：2015-05-28

申请号：US14090673

申请日：2013-11-26

Applicant: STMicroelectronics Pte. Ltd

Inventor： Calvin Leung ,  Olivier Le Neel

IPC: H01L23/31 ,  H01L27/06 ,  H01L23/528 ,  H01L21/768 ,  H01L21/56

CPC classification number: H01L21/6835 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/76895 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/20 ,  H01L27/0629 ,  H01L27/1052 ,  H01L28/60 ,  H01L29/6675 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.

Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成电子器件。 导电材料沉积在聚酰亚胺上并图案化以形成电极和信号迹线。 电子器件的剩余部分形成在聚酰亚胺上。 然后在第一聚酰亚胺层上形成第二聚酰亚胺层。 然后去除玻璃基板，暴露电极和电子设备的顶表面。

公开(公告)号：US20150138436A1

公开(公告)日：2015-05-21

申请号：US14084410

申请日：2013-11-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H04N5/225 ,  B29D11/00 ,  B29C65/48

CPC classification number: H04N5/2253 ,  B29L2031/764 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H04N5/2257 ,  H01L2924/00014

Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.

Abstract translation: 一个或多个实施例涉及光学模块组件，例如相机模块组件，以及形成它们的方法。 一个实施例涉及包括具有第一表面的基板的光学模块组件。 光学装置被固定到基板的第一表面并电耦合到基板。 成型体位于基板的第一表面上，位于光学装置的外侧。 成型体包括第一凹部。 透镜组件通过位于第一凹部中的粘合剂材料固定到模制主体上方的第一凹部上。 在一些实施例中，光学模块组件的成型体还包括与第一凹部间隔开的第二凹部。 透明材料通过位于第二凹部中的粘合剂材料固定在第二凹部上的成型体上。

公开(公告)号：US20150138420A1

公开(公告)日：2015-05-21

申请号：US14086507

申请日：2013-11-21

Applicant: STMicroelectronics Pte Ltd.

Inventor： Hk Looi ,  David Gani ,  Wee Chin Judy Lim ,  Bs Aw ,  Cheng-Hai Cheh

IPC: H04N5/225 ,  G02F1/1341 ,  G02F1/1345 ,  G02F1/1333 ,  G02F1/1343

CPC classification number: H04N5/2257 ,  G02F1/13452 ,  G03B3/10 ,  G03B5/00 ,  G03B17/02 ,  G03B2205/0046 ,  Y10T29/49117

Abstract: Electronics modules and methods of making electronics modules are provided. An electronics module includes a substrate having an electronic circuit mounted thereon, a lens mount affixed to the substrate, the lens mount having a lens assembly mounted therein, and a liquid crystal cell affixed to the lens mount over the lens assembly, the liquid crystal cell having electrical terminals, wherein the lens mount includes adhesive containment pockets that are filled with a conductive adhesive so as to contact the electrical terminals of the liquid crystal cell, wherein the adhesive containment pockets include contacts that are electrically connected to the substrate. In some embodiments, the electronics module is a camera module.

Abstract translation: 提供电子模块和制造电子模块的方法。 电子模块包括其上安装有电子电路的基板，固定到基板的透镜座，安装有透镜组件的透镜座，以及固定在透镜组件上方的透镜座的液晶单元，液晶盒 具有电端子，其中所述透镜座包括粘合剂容纳袋，其填充有导电粘合剂以便接触所述液晶单元的电端子，其中所述粘合剂容纳袋包括电连接到所述基板的触点。 在一些实施例中，电子模块是相机模块。

公开(公告)号：US09021557B2

公开(公告)日：2015-04-28

申请号：US13283381

申请日：2011-10-27

Applicant: Olivier Leneel

Inventor： Olivier Leneel

IPC: G06F21/00 ,  G06F21/34 ,  H04L29/06 ,  H04L9/08 ,  G06F21/44 ,  G06F21/62 ,  G06F21/60 ,  G06F15/16 ,  H04W12/08 ,  H04W12/00

CPC classification number: G06F21/34 ,  G06F15/16 ,  G06F21/44 ,  G06F21/445 ,  G06F21/60 ,  G06F21/606 ,  G06F21/62 ,  G06F21/6245 ,  H04L9/0816 ,  H04L9/0838 ,  H04L9/0861 ,  H04L9/0869 ,  H04L63/068 ,  H04L63/0853 ,  H04W12/00 ,  H04W12/08

Abstract: A system and method for realizing specific security features for a mobile device that may store sensitive and private data by providing secured communications to a paired remote device. In this respect, both the mobile device (which may be a mobile phone, for example) and the paired remote device (which may be a keychain, for example) include a SIM card that may have identification data stored therein. Once paired, the two devices may communicate encrypted security messages back and forth in order to implement various security measures to protect data and wireless communications. Such messages may be generated from initial information known only to each respective device such as a randomly generated offset number and a common time reference.

Abstract translation: 一种用于实现可通过向成对的远程设备提供安全通信来存储敏感和私有数据的移动设备的特定安全特征的系统和方法。 在这方面，移动设备（例如可以是移动电话）和成对的远程设备（可以是例如钥匙串）都包括可以具有存储在其中的识别数据的SIM卡。 一旦配对，两个设备可以来回传递加密的安全消息，以便实现各种安全措施来保护数据和无线通信。 这样的消息可以从仅对每个相应设备已知的初始信息生成，例如随机生成的偏移号和公共时间参考。

公开(公告)号：US09019688B2

公开(公告)日：2015-04-28

申请号：US13310466

申请日：2011-12-02

Applicant: Olivier Le Neel ,  Ravi Shankar

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: H01G7/04 ,  H01L23/522 ,  H01L49/02 ,  H01L23/34 ,  H01G4/33 ,  H01L27/06

CPC classification number: H01G7/04 ,  H01G4/33 ,  H01L23/345 ,  H01L23/5223 ,  H01L23/5228 ,  H01L27/0688 ,  H01L28/40 ,  H01L28/55 ,  H01L2924/0002 ,  Y10T29/43 ,  H01L2924/00

Abstract: The present disclosure is directed to a device and a method for achieving a precise capacitance of a capacitor. The method includes trimming a first capacitance of the capacitor to a second capacitance, the capacitor having a first conductive layer separated from a second conductive layer by a dielectric layer. Changing a first dielectric constant of the dielectric layer to a second dielectric constant, where the first dielectric constant corresponding to the first capacitance and the second dielectric constant corresponding to the second dielectric constant includes heating the dielectric layer above a threshold temperature for a time period. The heat is provided by either one of the plates of the capacitor or from a separate heater.

Abstract translation: 本公开涉及一种用于实现电容器的精确电容的装置和方法。 该方法包括将电容器的第一电容调整为第二电容，该电容器具有通过电介质层与第二导电层分离的第一导电层。 将电介质层的第一介电常数改变到第二介电常数，其中对应于第一电容的第一介电常数和对应于第二介电常数的第二介电常数包括将电介质层加热到阈值温度一段时间。 热量由电容器的任一个板或从单独的加热器提供。