公开(公告)号：US20120092640A1

公开(公告)日：2012-04-19

申请号：US13260017

申请日：2010-02-24

申请人： Richard John Johnson ,  Frits Van Der Meulen ,  Eric Bernard Westphal

发明人： Richard John Johnson ,  Frits Van Der Meulen ,  Eric Bernard Westphal

IPC分类号： G03B27/58

CPC分类号： G03F7/70916 ,  G03F7/70691 ,  G03F7/707 ,  G03F7/70725 ,  G03F7/70733 ,  G03F7/70741 ,  H01L21/67 ,  H01L21/67739 ,  H01L21/67745 ,  Y10S901/45

摘要： Provided is a method to load a patterning device (1010) onto a reticle stage (RS) of a lithography system, a Rapid Exchange Device (RED) configured to load a patterning device (1010) onto a reticle stage (RS) of a lithography system, and a system for manufacturing a semiconductor device lithographically. The method involves sharing compliance among six degree of freedom between the reticle stage (RS) and the RED. The RED complies in only a first three degrees of freedom and the reticle stage (RS) in only a second three degrees of freedom until the reticle stage (RS) and patterning device (1010) are substantially in contact and coplanar.

摘要翻译： 提供了一种将图案形成装置（1010）加载到光刻系统的标线片台（RS）上的方法，快速交换装置（RED）被配置为将图案形成装置（1010）加载到光刻的标线片台（RS）上 系统，以及用于制造半导体器件的系统。 该方法涉及在标线片阶段（RS）和RED之间分享六个自由度之间的一致性。 RED只有前三个自由度，并且只有第二个三自由度的标线片平台（RS），直到标线片平台（RS）和图案形成装置（1010）基本上接触并共面。

公开(公告)号：US20110226419A1

公开(公告)日：2011-09-22

申请号：US13049743

申请日：2011-03-16

申请人： Yong Hyun Lee ,  Myung Jin Lee ,  An Ki Cha

发明人： Yong Hyun Lee ,  Myung Jin Lee ,  An Ki Cha

IPC分类号： H01L21/677 ,  H01L21/306

CPC分类号： H01L21/67739 ,  H01J37/32458 ,  H01J37/32715 ,  H01J37/32899 ,  H01L21/306 ,  H01L21/67742 ,  H01L21/67745

摘要： Disclosed herein is a semiconductor manufacturing apparatus including a transfer chamber provided with a substrate moving device to move substrates, a load lock chamber to align the substrates and to load and unload the substrates into and out of the transfer chamber, and at least one process chamber to process the substrates transferred from the transfer chambers. Each of the at least one process chamber includes a chamber body provided with a substrate entrance formed on a side surface thereof, a substrate support provided within the chamber body such that at least two substrates are disposed on the substrate support, and at least one divider provided within the chamber body to align the at least two substrates.

摘要翻译： 本文公开了一种半导体制造装置，包括：传送室，设置有用于移动基板的基板移动装置;负载锁定室，其对准基板并将基板装载和卸载到输送室中;以及至少一个处理室 以处理从转印室转印的基材。 所述至少一个处理室中的每一个包括室主体，其设置有形成在其侧表面上的基板入口，设置在室主体内的基板支撑件，使得至少两个基板设置在基板支撑件上，并且至少一个分隔件 设置在腔体内以对准至少两个基底。

公开(公告)号：US20110142572A1

公开(公告)日：2011-06-16

申请号：US12965791

申请日：2010-12-10

申请人： Wendell Thomas BLONIGAN ,  Masato Toshima ,  Kam S. Law ,  David Eric Berkstresser ,  Steve Kleinke ,  Craig Lyle Stevens

发明人： Wendell Thomas BLONIGAN ,  Masato Toshima ,  Kam S. Law ,  David Eric Berkstresser ,  Steve Kleinke ,  Craig Lyle Stevens

IPC分类号： H01L21/677 ,  H05B6/64

CPC分类号： H01L21/67745 ,  C23C16/45565 ,  G06T7/0004 ,  H01J37/32733 ,  H01L21/67173 ,  H01L21/67739 ,  H01L21/67748 ,  H01L21/67754 ,  Y10T29/49948

摘要： An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

摘要翻译： 一种并行处理多个基板的装置和方法。 该系统采用一种新颖的架构，其在线性的情况下可以根据需要自主地对处理进行顺序处理和移动基板。 系统同时移动多个基板; 然而，与现有技术不同，它不利用托盘。

公开(公告)号：US20090010748A1

公开(公告)日：2009-01-08

申请号：US11585337

申请日：2006-10-24

申请人： Yuji Kamikawa ,  Koji Egashira

发明人： Yuji Kamikawa ,  Koji Egashira

IPC分类号： B65G59/00

CPC分类号： H01L21/67739 ,  H01L21/67718 ,  H01L21/67763 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138

摘要： A batch forming apparatus forms a batch of substrates by combining a plurality of substrates that have been taken out from a plurality of carriers each containing therein the substrates in a stacked manner. The batch forming apparatus includes: a substrate transfer mechanism that takes out the substrates from each carrier and transfer the substrates; a substrate relative positional relationship changing mechanism that rearranges one or more substrates out of the substrates transferred by the substrate transfer mechanism one by one relative to other substrates to change positional relationships of the substrates relative to each other; and a batch forming mechanism that forms a batch of substrates out of the substrates that have been transferred thereto by the substrate transfer mechanism, with positional relationships of the substrates having been changed relative to each other by the substrate relative positional relationship changing mechanism. A substrate processing system includes such a batch forming apparatus, and a substrate processing apparatus that process the batch of substrates formed by the batch forming apparatus.

摘要翻译： 批量形成装置通过组合从多个载体中取出的多个基板形成一批基板，每个载体以堆叠的方式包含在其中的基板。 批量形成装置包括：基板转印机构，其从每个载体取出基板并转印基板; 基板相对位置关系改变机构，用于相对于其它基板逐一地将由基板传送机构转印的基板中的一个或多个基板重新布置，以改变基板相对于彼此的位置关系; 以及批量形成机构，其通过基板传送机构在已经被转印到基板之外形成一批基板，基板的位置关系通过基板相对位置关系改变机构而相对于彼此改变。 一种基板处理系统包括这样的分批成型装置，以及处理由批量形成装置形成的一批基板的基板处理装置。

公开(公告)号：US07313931B2

公开(公告)日：2008-01-01

申请号：US11211493

申请日：2005-08-26

申请人： Takaaki Matsuoka

发明人： Takaaki Matsuoka

IPC分类号： C03B5/24

CPC分类号： H01L21/67109 ,  C23C16/4557 ,  C23C16/46 ,  C23C16/56 ,  H01L21/324 ,  H01L21/67739

摘要： After carrying an LCD substrate in a reaction container of a heat treatment unit, blowing a previously heated helium gas from a gas supply part, which opposes to the surface of the LCD substrate, over the entire surface of the LCD substrate. The temperature of the LCD substrate is raised by radiation heat of a heater and heat exchange with the helium gas. After performing CVD or annealing in the reaction container, cooling the LCD substrate by blowing a gas for heat exchange having a temperature about a room temperature from the gas supply part over the entire surface of the LCD substrate. Return the cooled LCD substrate to a carrier in the carrier chamber via a conveyance chamber.

摘要翻译： 在将热处理单元的反应容器中携带LCD基板之后，将来自与LCD基板的表面相对的气体供给部分的预先加热的氦气吹入LCD基板的整个表面。 LCD基板的温度由加热器的辐射热量和氦气的热交换而升高。 在反应容器中进行CVD或退火后，通过在LCD基板的整个表面上从气体供给部分吹出温度约为室温的热交换用气体来冷却LCD基板。 通过传送室将冷却的LCD基板返回到载体室中的载体。

公开(公告)号：US07210924B2

公开(公告)日：2007-05-01

申请号：US10939432

申请日：2004-09-14

申请人： Shinya Mochizuki ,  Motoki Akimoto

发明人： Shinya Mochizuki ,  Motoki Akimoto

IPC分类号： F27D5/00

CPC分类号： H01L21/67373 ,  F27B5/04 ,  F27B17/0025 ,  F27D3/0084 ,  F27D5/0037 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/67393 ,  H01L21/67739 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/68707 ,  Y10S269/903 ,  Y10S414/135 ,  Y10S414/137

摘要： There is provided a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer transfer area), and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment.In a vertical heat treatment system for carrying an object W to be treated, which is housed in a treating-object housing box 2 closed by an opening/closing lid 10, in a treating-object transfer area 46 via an opening 28, which is formed in a partition wall 26 separating a housing-box transfer area 44 for transferring the treating-object housing box from the treating-object transfer area 46 in an atmosphere of an inert gas, to carry out a predetermined treatment, a standby box transfer means 60 is provided in the housing-box transfer area for holding a treating-object housing box, which houses therein the next object to be carried in the treating-object transfer area, in the vicinity of the opening to cause the treating-object housing box to stand by. Thus, when the object to be treated is carried in via the opening of the partition wall, which separates the housing-box transfer area from the treating-object transfer area (wafer transfer area), to carry out a predetermined treatment, the structure of various mechanisms in the vicinity of the opening is simplified, and the space is saved.

摘要翻译： 提供了一种垂直式热处理系统，其能够简化形成在将箱体搬送区域从处理对象搬送区域（晶片转移区域）分离的分隔壁的开口附近的各种机构的结构， 并且当通过开口在垂直热处理系统中承载待处理物体时，有助于节省空间，以进行预定处理。 在用于承载被打开/关闭盖10封闭的处理对象收纳箱2中的待处理对象物W的立式热处理系统经由开口28在处理对象转移区域46中 形成在隔离壁26中，隔离箱26分离用于在惰性气体气氛中将处理对象收纳箱从处理对象转移区域46传送的收纳箱传送区域44，以执行预定处理;待机箱传送装置 60设置在用于保持处理对象收纳箱的收纳箱传送区域中，处理对象收纳箱在其内容纳有待处理对象转移区域中的下一个物体的开口附近，从而使处理对象收纳箱 待命 因此，当待处理物体经由将箱体转移区域从处理对象转移区域（晶片转移区域）分离的分隔壁的开口进行预定处理时，结构 简化了开口附近的各种机构，节省了空间。

公开(公告)号：US20070086881A1

公开(公告)日：2007-04-19

申请号：US11613556

申请日：2006-12-20

申请人： Shinichi Kurita ,  Wendell Blonigan ,  Akihiro Hosokawa

发明人： Shinichi Kurita ,  Wendell Blonigan ,  Akihiro Hosokawa

IPC分类号： H01L21/677 ,  H01L21/306 ,  C23C16/00 ,  B65H1/00

CPC分类号： H01L21/68742 ,  B65G49/068 ,  B65G2249/02 ,  B65G2249/04 ,  C23C14/566 ,  C23C14/568 ,  C23C16/54 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/67745 ,  H01L21/67748

摘要： One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

摘要翻译： 一个实施例涉及一种其中具有第一支撑结构的负载锁，用于支撑一个未处理的基板和其中的第二支撑结构以支撑一个处理的基板。 第一支撑结构位于第二支撑结构的上方。 负载锁包括用于控制支撑结构的垂直位置的电梯。 负载锁还包括第一孔，以允许将未处理的衬底插入到装载锁中并从加载锁中移除经处理的衬底，以及第二孔，以允许将未处理的衬底从负载锁上移除并将经处理的衬底插入 负载锁。 一个冷却板也位于负载锁中。 冷却板包括适于在其上支撑经处理的基板的表面。 加热装置可以位于第一支撑结构上方的装载锁中。

公开(公告)号：US07205742B2

公开(公告)日：2007-04-17

申请号：US11403831

申请日：2006-04-14

申请人： Masaru Adachi ,  Mitsunori Kawabe

发明人： Masaru Adachi ,  Mitsunori Kawabe

IPC分类号： G05B19/10

CPC分类号： H01L21/67259 ,  H01L21/67739 ,  H01L21/681

摘要： In some preferred embodiments of the present invention, a method of performing calibration of an optical axis of a sensor installed on a hand of an arm of a robot by obtaining misalignment of the optical axis of the sensor relative to the hand or by obtaining misalignment of the hand relative to the arm is provided. A method of performing calibration by detecting a teaching tool 11 disposed at a semiconductor wafer placing position of a storage container or a carrying device by a sensor 6 installed on a hand 5 of a robot 1 to teach the position of the semiconductor wafer to the robot 1 includes a step of placing the teaching tool 11 at specified position with the robot 1, a step of predicting the position of the teaching tool 11 detecting the teaching tool 11 with the sensor 6, and a step of obtaining a difference between the position of the teaching tool 11 and the predicted value.

摘要翻译： 在本发明的一些优选实施例中，一种通过获得传感器的光轴相对于手的偏移或者通过获得未对准的方式来执行安装在机器人手臂的手上的光轴的校准的方法 提供了相对于手臂的手。 通过检测安装在机器人1的手5上的传感器6来设置在存储容器或携带装置的半导体晶片放置位置的教具11来进行校准的方法，以将半导体晶片的位置教导到机器人 图1所示的步骤包括将教具11放置在机器人1的指定位置的步骤，利用传感器6预测教具11检测教具11的位置的步骤， 教学工具11和预测值。

公开(公告)号：US07040852B2

公开(公告)日：2006-05-09

申请号：US10421834

申请日：2003-04-24

申请人： Hiroki Mori ,  Tetsuya Watanabe ,  Chohei Okuno

发明人： Hiroki Mori ,  Tetsuya Watanabe ,  Chohei Okuno

IPC分类号： B25J18/00

CPC分类号： B25J9/1065 ,  H01L21/67739 ,  Y10S414/13 ,  Y10T74/20329

摘要： Herein disclosed is a robot arm mechanism comprising: a first handling member for supporting and handling a first object; a second handling member for supporting and handling a second object; a first robot arm including a first arm link and a second arm link, the first end portion of the second arm link being pivotably connected to the second end portion of the first arm link, and the second end portion of the second arm link being connected to the first handling member to allow the first handling member to support the first object in a stable condition; a second robot arm including a first arm link and a second arm link, the first end portion of the second arm link being pivotably connected to the second end portion of the first arm link, the second arm link being inclined with respect to the second arm link of the first robot arm at a preset angle defined between the central line of the second arm link of the second robot arm and the central line of the second arm link of the first robot arm, and the second end portion of the second arm link being connected to the second handling member to allow the second handling member to support the second object in a stable condition; a robot arm moving mechanism for allowing one of the first arm links and of the first and second robot arms to be angularly moved with respect to the other of the first arm links of the first and second robot arms; and an angle keeping mechanism for keeping substantially fixed the preset angle defined between the central line of the second arm link of the second robot arm and the central line of the second arm link of the first robot arm as one of the first arm links of the first and second robot arms is angularly moved with respect to the other of the first arm links of the first and second robot arms.

公开(公告)号：US06849555B2

公开(公告)日：2005-02-01

申请号：US10449522

申请日：2003-05-30

申请人： Jong-myeong Lee ,  Byung-hee Kim ,  Myoung bum Lee ,  Ju-young Yun ,  Gil-heyun Choi

发明人： Jong-myeong Lee ,  Byung-hee Kim ,  Myoung bum Lee ,  Ju-young Yun ,  Gil-heyun Choi

IPC分类号： C23C14/56 ,  C23C16/44 ,  H01L21/00 ,  H01L21/02 ,  H01L21/285 ,  H01L21/302 ,  H01L21/461 ,  H01L21/677 ,  H01L21/768

CPC分类号： H01L21/67167 ,  H01L21/2855 ,  H01L21/28556 ,  H01L21/67017 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/76882 ,  H01L21/76888 ,  Y10S438/974

摘要： An integrated in situ cluster type wafer processing apparatus which can be used for forming metal wiring layers having a multi-layered structure and a wafer processing method using the same are provided. The wafer processing apparatus includes a transfer chamber which can be exhausted and has a plurality of gate valves, a plurality of vacuum processing chambers each of which can be connected to the transfer chamber via one of the gate valves, and a load lock chamber which can be exhausted and is connectable to a first gas feed line for feeding an oxygen-based gas into the load lock chamber. In a wafer processing method, a predetermined layer is formed on a wafer in one of the vacuum processing chambers. The predetermined layer on the wafer is oxidized in the load lock chamber or an oxygen atmosphere chamber.

摘要翻译： 提供了可用于形成具有多层结构的金属布线层和使用其的晶片处理方法的集成的原位簇型晶片处理装置。 晶片处理装置包括可以排出并具有多个闸阀的传送室，多个真空处理室，每个真空处理室可以经由一个闸阀连接到传送室;以及负载锁定室，其可以 被排出并且可连接到用于将氧基气体进料到负载锁定室中的第一气体供给管线。 在晶片处理方法中，在一个真空处理室中的晶片上形成预定层。 晶片上的预定层在负载锁定室或氧气氛室中被氧化。