公开(公告)号：US11351631B2

公开(公告)日：2022-06-07

申请号：US16910655

申请日：2020-06-24

申请人： DISCO CORPORATION

发明人： Atsushi Ueki ,  Yutaka Kobayashi

IPC分类号： B23K26/08 ,  B23K26/06 ,  B23K26/364 ,  B23K26/50 ,  H01L21/67 ,  H01L21/683 ,  H01L21/78 ,  B23K103/00 ,  H01L21/268

摘要： A calculating section of a control unit calculates a vertical position Defocus for a condensing lens using a height value H1 of a modified layer in a wafer that is set by a setting section according to the equation (1) below. Defocus=(thickness T1 of wafer−height value H1−b)/a  (1) The calculating section calculates an appropriate vertical position for the condensing lens according to the equation (1) depending on the height value H1 of the modified layer that is set by the setting section. Therefore, the vertical position of the condensing lens in laser processing operation can be determined more easily, and a time-consuming and tedious experiment for fine adjustment of the vertical position of the condensing lens does not need to be conducted.

公开(公告)号：US20210300011A1

公开(公告)日：2021-09-30

申请号：US17228082

申请日：2021-04-12

申请人： IPG Photonics Corporation

发明人： Cristian Porneala ,  Mathew Hannon ,  Marco Mendes ,  Jeffrey P. Sercel

IPC分类号： B32B43/00 ,  B23K26/50 ,  B23K26/40

摘要： Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.

公开(公告)号：US10942458B2

公开(公告)日：2021-03-09

申请号：US15999783

申请日：2017-02-17

申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.

发明人： Ke Lan ,  Yaping Ge ,  Yonghui Chen

IPC分类号： G03F7/20 ,  B23K26/00 ,  B23K26/402 ,  B23K26/073 ,  B23K26/36 ,  B23K26/046 ,  B23K26/042 ,  B23K26/352 ,  B23K26/50 ,  B23K26/08 ,  B23K103/00 ,  B23K101/40

摘要： An exposure system (10), an exposure apparatus and an exposure method are disclosed. The exposure system (10) includes: a laser unit (11), a light spot switching unit (12) and a lens unit (13); the laser unit (11) is configured for producing a laser beam; the light spot switching unit (12) is configured to direct the laser beam to travel along one of different optical paths based on a desired size of a light spot for a workpiece to be exposed so that a laser beam in correspondence with the desired size of the light spot is obtained; and the lens unit (13) is configured for altering a direction in which the laser beam is incident on the workpiece. The light spot switching unit (12) enables the laser beam to be switched between the different optical paths so as to form light spots sized in different ranges, which can satisfy different needs of workpieces with various critical dimensions. As a result, an improvement in processing adaptability to different workpieces and a significant reduction in cost can be achieved.

公开(公告)号：US20200269366A1

公开(公告)日：2020-08-27

申请号：US16800261

申请日：2020-02-25

申请人： NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY ,  NAGOYA INSTITUTE OF TECHNOLOGY

发明人： Eiji SHAMOTO ,  Fumihiro ITOIGAWA

IPC分类号： B23P15/24 ,  B23B27/14 ,  B23K26/38 ,  B23K26/50

摘要： A controller performs a first process of scanning a cylindrical irradiation region including a focused spot of laser light emitted from a laser light emitter to machine a flank face side of a workpiece to manufacture a cutting tool having a plurality of cutting edges arranged in line. In the first process, the controller scans the cylindrical irradiation region along a scanning path that has periodicity and changes a machining depth to form the plurality of cutting edges. The controller further performs a second process of scanning the cylindrical irradiation region including the focused spot of the laser light emitted in a direction different from an irradiation direction of the laser light in the first process to machine a rake face side of the workpiece.

公开(公告)号：US20200206841A1

公开(公告)日：2020-07-02

申请号：US16643641

申请日：2018-09-03

申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. ,  Friedrich-Schiller-Universität Jena

发明人： Klaus Bergner ,  Stefan Nolte

IPC分类号： B23K26/00 ,  B23K26/03 ,  B23K26/062 ,  B23K26/50 ,  B23K26/0622 ,  B23K26/53 ,  B23K26/064 ,  B23K26/06 ,  G01N21/39 ,  C03C15/00

摘要： The invention relates to a method for machining a transparent workpiece (4) by generating non-linear absorption of laser radiation in a laser beam focus located in a volume of the workpiece (4). The object of the invention is that of providing a method of improved precision and quality, and a corresponding device, for laser machining of workpieces. In particular, it is also intended for it to be possible for workpieces made of composite materials or of other special materials, such as filter glass, to be machined at an improved level of quality. For this purpose, the method according to the invention comprises the following steps: spectroscopic measurement of the linear absorption of the laser radiation in the workpiece (4), selecting a working wavelength at which the linear absorption is low, and machining the workpiece (4) by means of application of laser radiation at the working wavelength. The invention furthermore relates to a corresponding device for machining a transparent workpiece (4).

公开(公告)号：US10350710B2

公开(公告)日：2019-07-16

申请号：US15569062

申请日：2015-04-08

申请人： THE JAPAN STEEL WORKS, LTD.

发明人： Yasuhiro Yamashita ,  Ryosuke Sato ,  Toshio Inami

IPC分类号： B23K26/00 ,  B23K26/402 ,  B23K26/082 ,  B23K26/073 ,  B23K26/50 ,  B23K26/08 ,  B23K26/0622 ,  B23K26/53 ,  H01L51/00 ,  B23K103/00 ,  B23K103/16

摘要： A laser irradiation method sets scan lines in an x direction in parallel, and in a y direction to be separate by an inter-scan-line distance Py corresponding to laser irradiation areas of a processing target object, orients a length direction of a linear laser spot with length Wy and width Wx in the y direction, and irradiates target object with the laser spot in each of irradiation positions arranged at width direction intervals Λ while moving the laser spot relative to the target object along the scan lines. The method includes determining the inter-scan-line distance Py, the width direction interval Λ, and a position shift quantity Δx (where, 0

公开(公告)号：US10276368B2

公开(公告)日：2019-04-30

申请号：US15516266

申请日：2015-09-29

申请人： Nippon Sheet Glass Company, Limited

发明人： Keiji Tsunetomo ,  Hideki Hashizume ,  Kazuya Ohkawa

IPC分类号： H01L21/02 ,  H01L21/768 ,  H01L23/15 ,  C03C15/00 ,  H01L23/498 ,  B23K26/00 ,  C03C17/30 ,  H01L21/48 ,  H05K1/03 ,  H05K3/00 ,  B23K26/0622 ,  B23K26/352 ,  B23K26/50 ,  H05K1/14 ,  B23K103/00 ,  B23K101/40

摘要： A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

公开(公告)号：US20190030650A1

公开(公告)日：2019-01-31

申请号：US16034511

申请日：2018-07-13

申请人： ROLLS-ROYCE plc

发明人： Daniel CLARK ,  Clive GRAFTON-REED

IPC分类号： B23K26/50 ,  B23K26/211 ,  B23K26/26

摘要： A method of welding a first component and a second component together, the method comprising: controlling movement of a first component and/or a second component to form a joint, the first component and the second component defining a first side and a second side; controlling welding of the first component and the second component on the second side using filler to form a seal weld to seal the joint; controlling provision of a vacuum chamber to enclose the joint within a volume; controlling evacuation of the volume defined by the vacuum chamber; and controlling power beam welding of the joint, the power beam being provided from the first side and through the evacuated volume.

公开(公告)号：US20190027687A1

公开(公告)日：2019-01-24

申请号：US15865141

申请日：2018-01-08

申请人： Samsung Display Co., Ltd.

发明人： Youngmin Moon ,  Sungsoon Im ,  Jeongkuk Kim ,  Minho Moon ,  Kyuhwan Hwang

IPC分类号： H01L51/00 ,  H01L27/32 ,  H01L51/56 ,  C25D1/20 ,  C25D1/10 ,  C23C16/04 ,  C23C14/04 ,  B23K26/50 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26

摘要： A mask for thin film deposition of a display apparatus having both end portions coupleable to a frame in a state of tension in a lengthwise direction thereof, the mask including: a first portion having a first thickness and a plurality of pattern holes through which a deposition material may pass; a second portion comprising a welding portion having a second thickness configured to be coupled to a frame; and a third portion connecting the first portion and the third portion, wherein the first thickness is less than the second thickness, and the third portion includes an inclined surface connecting the first portion and the second portion.

公开(公告)号：US10144226B1

公开(公告)日：2018-12-04

申请号：US15802044

申请日：2017-11-02

申请人： GREAT COMPUTER CORP.

发明人： Chen-Chien Tsai ,  Hui-Te Yu

IPC分类号： B41J3/44 ,  B41M5/00 ,  B41J11/66 ,  B41J29/06 ,  B23K26/38 ,  B41C1/00 ,  B41J3/407 ,  B41J3/00 ,  B41J3/413 ,  B23K26/00 ,  B41M5/24 ,  B41C1/10 ,  B41C1/05 ,  G03F7/20 ,  B23K26/50 ,  B41J3/50

摘要： A digital inkjet flatbed printer having a separate laser processing machine includes a laser processing machine and a digital inkjet printer. The laser processing machine is provided with a laser output module and a laser processing platform. The digital inkjet printer includes an inkjet output module and an inkjet operating platform. The inkjet operating platform is capable of movably ascending from and descending onto the digital inkjet printer. Thus, when the inkjet operating platform is descended, the laser processing machine is movably connected to the inkjet operating platform, such that the laser output module of the laser processing machine and the inkjet output module of the digital inkjet printer are on the laser processing platform of the laser processing machine and sequentially used for laser processing and inkjet printing respectively.