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    PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT
    32.
    发明申请
    PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT 审中-公开

    公开(公告)号：US20200152467A1

    公开(公告)日：2020-05-14

    申请号：US16739569

    申请日：2020-01-10

    申请人： Applied Materials, Inc.

    发明人： Cameron Law ,  Daniel Durado ,  Thomas Oberlitner ,  Richard W. Plavidal

    IPC分类号： H01L21/288 ,  C25D7/12 ,  H01L21/67 ,  H01L21/768 ,  C25D17/02 ,  C25D17/00 ,  C25D21/12

    摘要： Electroplating processing systems according to the present technology may include a recirculating tank containing a first volume of processing fluid. The recirculating tank may be fluidly coupled with a delivery pump. The systems may include a vessel configured to receive the processing fluid from the pump. The vessel may include an inner chamber and an outer chamber, and the inner chamber may be sized to hold a second volume of processing fluid less than the first volume of processing fluid. A liquid level sensor may be associated with the vessel to provide a liquid level indication in the outer chamber. The systems may include a return line coupled with an outlet of the vessel and coupled with an inlet of the recirculating tank. The systems may also include a return pump fluidly coupled with the return line. The return pump may be electrically coupled with the liquid level sensor.

    Multipurpose electrolytic device (MPED) for forced or spontaneous electrolytic processes, with independent electrolytes
    33.
    发明授权
    Multipurpose electrolytic device (MPED) for forced or spontaneous electrolytic processes, with independent electrolytes 有权

    公开(公告)号：US10480086B2

    公开(公告)日：2019-11-19

    申请号：US15525778

    申请日：2015-11-23

    申请人： Jaime Roberto Simpson Alvarez

    发明人： Jaime Roberto Simpson Alvarez

    IPC分类号： C25B9/02 ,  C25C1/00 ,  C25C7/00 ,  C25D17/12 ,  C25B9/08 ,  C25B9/10 ,  C25C7/04 ,  C25B15/08 ,  H01M8/18 ,  C25D17/02 ,  C25D21/18 ,  H01M8/08

    摘要： Multipurpose electrolytic device (EMPD) for forced or spontaneous electrolytic processes, which incorporates selective and unidirectional ion exchange membranes in order to separate between two or more compartments and allow electrical conductivity therebetween, with independent electrolytes for controlled electrolytic ion transformation, regardless of the chemical composition of the electrolyte containing the element of interest, with high faradaic efficiency and high energy performance. The invention also relates to a method. The device can be used for processes such as metal electrowinning (EW), metal electrorefining, electrooxidation (EOXI) and electroreduction (ERED) of ionic species. The device uses two independent, energetically suitable electrolytes, which allow controlled electrolytic ion transformation, with high faradaic efficiency and high energy performance, unlike current forced electrolysis methods, which operate with a common electrolyte. The device can be used in any aqueous medium, for example an acid environment, such as sulphuric, hydrochloric or other acid, a caustic-soda-based alkaline, or ammonium, thiocyanate or thiosulfate salts, with or without the presence of organic reactants.

    PROCESSING LIQUID SUPPLYING APPARATUS, SUBSTRATE PROCESSING APPARATUS AND PROCESSING LIQUID SUPPLYING METHOD
    36.
    发明申请
    PROCESSING LIQUID SUPPLYING APPARATUS, SUBSTRATE PROCESSING APPARATUS AND PROCESSING LIQUID SUPPLYING METHOD 审中-公开

    公开(公告)号：US20190131144A1

    公开(公告)日：2019-05-02

    申请号：US16168949

    申请日：2018-10-24

    申请人： SCREEN Holdings Co., Ltd.

    发明人： Shota IWAHATA ,  Ayumi HIGUCHI ,  Eri FUJITA ,  Yoshiyuki FUJITANI ,  Masako MANO ,  Yusuke TAKEMATSU ,  Yosuke OKUYA

    IPC分类号： H01L21/67 ,  C25D17/02 ,  B08B3/14

    摘要： A processing liquid supplying apparatus supplies a processing liquid to a processing unit which processes a substrate. The processing liquid supplying apparatus includes a supply pipe to which a processing liquid inside a processing liquid tank that stores the processing liquid is fed and which supplies the processing liquid, which is fed from the processing liquid tank, to the processing unit, a return pipe which is branched and connected to the supply pipe to return a processing liquid inside the supply pipe to the processing liquid tank, a first heating unit which heats a processing liquid inside an upstream-side portion to be heated that is set in the supply pipe upstream from a branched position to which the return pipe is connected, a second heating unit which heats a processing liquid inside a downstream-side portion to be heated that is set in the supply pipe downstream from the branched position, a cooling unit which cools a processing liquid inside a portion to be cooled that is set in the return pipe, and a first filter which is interposed in the supply pipe upstream from the upstream-side portion to be heated and removes particles in a processing liquid.

    Cross flow manifold for electroplating apparatus
    37.
    发明授权
    Cross flow manifold for electroplating apparatus 有权

    公开(公告)号：US10190230B2

    公开(公告)日：2019-01-29

    申请号：US15448472

    申请日：2017-03-02

    申请人： Novellus Systems, Inc.

    发明人： Richard Abraham ,  Steven T. Mayer ,  Bryan L. Buckalew ,  Robert Rash

    IPC分类号： C25D17/06 ,  C25D17/00 ,  C25D5/18 ,  C25D5/04 ,  C25D3/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/02 ,  C25D21/10 ,  C25D17/08 ,  H01L21/288 ,  H01L21/768 ,  H01L23/00

    摘要： The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a channeled plate positioned near the substrate, creating a cross flow manifold defined on the bottom by the channeled plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through the channels in the channeled plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.