COATED STEEL SHEET AND PAINTED MEMBER
    35.
    发明申请

    公开(公告)号:US20190330478A1

    公开(公告)日:2019-10-31

    申请号:US16461736

    申请日:2016-11-17

    Abstract: A coated steel sheet has a coating film on at least one side of a plated steel sheet. The coating film contains a binder resin, non-oxide ceramic particles containing V (excluding VC particles), and doped zinc oxide particles. The respective contents of the non-oxide ceramic particles containing V and the doped zinc oxide particles relative to the coating film satisfy the expressions: [(1) CZn≥10.0, (2) CV≤0.5·CZn, (3) CV≤70−CZn, (4) CV≥0.125·CZn, and (5) CV≥2.0], where CV represents the content (mass %) of the non-oxide ceramic particles containing V, and CZn represents the content (mass %) of the doped zinc oxide particles. The coated steel sheet is excellent in both corrosion resistance before electrodeposition coating, and weldability.

    Oligoesters compositions and methods of making and using same

    公开(公告)号:US10407593B2

    公开(公告)日:2019-09-10

    申请号:US15713644

    申请日:2017-09-23

    Abstract: An Oligoester composition obtained from a reactant mixture comprising one or more rosin; one or more polyhydric alcohol selected from the group of polyhydric alcohols having from 2 to 30 carbon atoms, and from 0.5 wt. % to 15 wt. %, based on the weight of all reactants, of one or more polyfunctional carboxylic acids selected from cycloaliphatic dicarboxylic polyfunctional carboxylic acids, and wherein the one or more polyhydric alcohol is present in the mixture for preparation of the Oligoester an amount of from 5 wt. % to 35 wt. %, based on the weight of all reactants. Oligoester composition has a hydroxyl value of from 7 mg KOH/g to 40 mg KOH/g and suitable for use in road marking, adhesives or tire tread.

    Waterproof electronic packaging structure and method for making the same

    公开(公告)号:US10374104B2

    公开(公告)日:2019-08-06

    申请号:US15634404

    申请日:2017-06-27

    Abstract: A waterproof electronic packaging structure includes a carrier plate, a chip, an encapsulating member and a waterproof member. The carrier plate includes a substrate, and a leadframe partly embedded in the substrate and including a chip bonding portion exposed from the substrate. The chip is mounted to the substrate and is electrically connected to the chip bonding portion. The encapsulating member is formed on the carrier plate, and encapsulates the chip and the chip bonding portion. The waterproof member is formed on the encapsulating member, and covers an outer surface of the encapsulating member and an interface between the encapsulating member and the substrate. A method for making a waterproof electronic packaging structure is also disclosed.

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