SILICON WAFER HORIZONTAL GROWTH APPARATUS AND METHOD

    公开(公告)号:US20200040481A1

    公开(公告)日:2020-02-06

    申请号:US16600859

    申请日:2019-10-14

    摘要: A silicon wafer horizontal growth apparatus comprises a casing forming a cavity; a crucible within the cavity and having a melting zone, an overflow port, a first and a second overflow surface; a feeding assembly for adding raw material to the melting zone at an adjustable rate; a heating assembly comprising two movable heaters disposed on the upper and lower sides of the crucible at an interval; a thermal insulation component for maintaining a temperature in the cavity; a gas flow assembly comprising a jet located above the second overflow surface, a gas conductive graphite member mounted on the bottom of the crucible, a quartz exhaust tube connected with the gas conductive graphite member, and a quartz cooling tube outside the exhaust tube; and a heat insulating baffle located above the second overflow surface for isolating the heating assembly from the jet, dividing the cavity into hot and cold zones.

    Epitaxial silicon wafer and method for producing the epitaxial silicon wafer

    公开(公告)号:US10192754B2

    公开(公告)日:2019-01-29

    申请号:US15311307

    申请日:2015-04-21

    申请人: SUMCO CORPORATION

    摘要: A method for producing an epitaxial silicon wafer, including a preliminary thermal treatment step of subjecting a silicon wafer to thermal treatment for increasing a density of oxygen precipitates, the silicon wafer being one that has an oxygen concentration in a range of 9×1017 atoms/cm3 to 16×1017 atoms/cm3, contains no dislocation cluster and no COP, and contains an oxygen precipitation suppression region, and an epitaxial layer forming step of forming an epitaxial layer on a surface of the silicon wafer after the preliminary thermal treatment step. The production method further includes a thermal treatment condition determining step of determining a thermal treatment condition in the preliminary thermal treatment step, based on a ratio of the oxygen precipitation suppression region of the silicon wafer before the preliminary thermal treatment step is carried out.

    RECHARGE TUBE STOCKER
    34.
    发明申请

    公开(公告)号:US20180273299A1

    公开(公告)日:2018-09-27

    申请号:US15781505

    申请日:2016-12-12

    发明人: Wataru YAJIMA

    IPC分类号: B65G1/16 C30B15/00 C30B29/06

    摘要: A recharge tube stocker for storing and managing a recharge tube used for a single crystal pulling apparatus, including an inlet-outlet section for taking the recharge tube in the recharge tube stocker and taking the recharge tube out of the recharge tube stocker, a storage for storing the recharge tube, a raw-material charging device for charging the recharge tube with a raw material, a weighing device for weighing a weight of the raw material charged into the recharge tube, a transferring device for enabling a transfer of the recharge tube, being taken in through the inlet-outlet section, among the inlet-outlet section, the raw-material charging device, and the storage, and a managing device for collectively managing storage information on the recharge tube stored in the storage. This recharge tube stocker stores and manages tubes in a space saving manner without taking time for searching and without causing mix-up of recharge tubes.