公开(公告)号：US20100252845A1

公开(公告)日：2010-10-07

申请号：US12417412

申请日：2009-04-02

Applicant: Chun-Chi Lin ,  Tzu-Han Lin ,  Wei-Hung Kang

Inventor： Chun-Chi Lin ,  Tzu-Han Lin ,  Wei-Hung Kang

IPC: H01L33/00 ,  H01L21/78

CPC classification number: H01L33/508

Abstract: A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.

Abstract translation: 提供了一种白光LED芯片及其制造方法。 白光LED芯片包括蓝光LED芯片和直接设置在蓝光LED芯片的顶表面上的荧光体层。 该方法包括提供附着在基板上的多个蓝光LED芯片，其中至少一个接触焊盘形成在每个蓝光LED芯片的顶表面上。 在接触垫上形成保护层。 通过成型工艺在蓝光LED芯片的顶表面上形成荧光体层，露出接触垫。 最后，从蓝光LED芯片去除保护层和基板，以形成白光LED芯片。

公开(公告)号：US07807484B2

公开(公告)日：2010-10-05

申请号：US12251957

申请日：2008-10-15

Applicant: Wei-Ko Wang ,  Tzu-Han Lin

Inventor： Wei-Ko Wang ,  Tzu-Han Lin

IPC: H01L21/00

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/10253 ,  Y10S438/979 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting diode (LED) device is disclosed. The LED device includes a semiconductor substrate with a light-emitting diode chip disposed thereon. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the light-emitting diode chip. In one embodiment, the lens module comprises a glass substrate having a first cavity formed at a first surface thereof, a fluorescent layer formed over a portion of a first surface exposed by the first cavity, facing the light-emitting diode chip, and a molded lens formed over a second surface of the glass carrier opposing to the first surface.

Abstract translation: 公开了一种发光二极管（LED）装置。 LED装置包括其上设置有发光二极管芯片的半导体衬底。 至少两个隔离的外部布线层设置在半导体衬底的底表面上，并且与用作输入端子的发光二极管芯片电连接。 透镜模块粘附到半导体衬底的顶表面以盖住发光二极管芯片。 在一个实施例中，透镜模块包括玻璃基板，其具有在其第一表面形成的第一空腔，形成在由第一腔暴露的第一表面的暴露于面向发光二极管芯片的部分上的荧光层， 透镜形成在玻璃载体的与第一表面相对的第二表面上。

公开(公告)号：US20100127288A1

公开(公告)日：2010-05-27

申请号：US12323094

申请日：2008-11-25

Applicant: Wu-Cheng KUO ,  Tzu-Han Lin

Inventor： Wu-Cheng KUO ,  Tzu-Han Lin

IPC: H01L33/00

CPC classification number: H01L33/483 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2933/005 ,  H01L2924/00014

Abstract: An LED device including a support structure with at least one LED die mounted thereon, a recess formed in a part of the support structure from a side of the LED die, and a lens formed over the support structure to encapsulate the LED die and the recess, thereby forming a protrusion in the support structure is disclosed.

Abstract translation: 一种LED装置，包括具有安装在其上的至少一个LED管芯的支撑结构，从所述LED管芯的一侧形成在所述支撑结构的一部分中的凹部，以及形成在所述支撑结构上的透镜，以封装所述LED管芯和所述凹部 从而在支撑结构中形成突起。

公开(公告)号：US07688531B1

公开(公告)日：2010-03-30

申请号：US12248723

申请日：2008-10-09

Applicant: Jau-Jan Deng ,  Wei-Chung Chang ,  Min-Chih Liao

Inventor： Jau-Jan Deng ,  Wei-Chung Chang ,  Min-Chih Liao

IPC: G02B7/02 ,  G02B9/34

CPC classification number: G02B7/021 ,  G02B13/006 ,  G02B13/0085

Abstract: A miniature image capture lens is disclosed comprising an aperture diaphragm having an aperture through which an image is captured and a wafer-level lens system, including a first surface disposed on a first substrate, a second substrate with a first side bonded to the first substrate, a second surface disposed on a second side of the second substrate, and a third surface disposed on a third substrate, wherein the first surface, the second surface and the third surface are aspherical and the following conditions are satisfied: L/fe i.7,f1˜/fe=0.5−1.5,f2/fe=−1−−1.5; and −2

Abstract translation: 公开了一种小型图像拍摄透镜，其包括具有孔径的孔径光阑，通过该孔径捕获图像，晶片级透镜系统包括设置在第一基板上的第一表面，第二基板，第一侧面接合到第一基板 ，设置在所述第二基板的第二侧上的第二表面和设置在第三基板上的第三表面，其中所述第一表面，所述第二表面和所述第三表面是非球面的，并满足以下条件：L / fe i。 7，f1〜/ fe = 0.5-1.5，f2 / fe = -1--1.5; 和-2

公开(公告)号：US07679167B2

公开(公告)日：2010-03-16

申请号：US11707110

申请日：2007-02-16

Applicant: Teng-Sheng Chen ,  Pai-Chun Peter Zung ,  Tzu-Han Lin ,  Shin-Chang Shiung

Inventor： Teng-Sheng Chen ,  Pai-Chun Peter Zung ,  Tzu-Han Lin ,  Shin-Chang Shiung

IPC: H01L23/552

CPC classification number: H04N5/335 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/10 ,  H01L2924/00014 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A package module for an image sensor device is disclosed. The package module comprises a device chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the device chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The invention also discloses an electronic assembly for an image sensor device and a fabrication method thereof.

Abstract translation: 公开了一种用于图像传感器装置的封装模块。 封装模块包括设置在下基板和上基板之间的器件芯片。 第一导电层在下基板的第一侧壁上方并且与器件芯片绝缘。 第一保护层在第一导电层上，并且将第一导电层的一部分暴露在下基板的第一侧壁上。 第一焊盘在下基板的底表面上并且电连接到第一导电层。 本发明还公开了一种用于图像传感器装置的电子组件及其制造方法。

公开(公告)号：US20090305453A1

公开(公告)日：2009-12-10

申请号：US12136433

申请日：2008-06-10

Applicant: Cheng-Lin YANG ,  Chin-Poh PANG ,  Wu-Chieh LIU ,  Chi-Xiang TSENG

Inventor： Cheng-Lin YANG ,  Chin-Poh PANG ,  Wu-Chieh LIU ,  Chi-Xiang TSENG

IPC: H01L21/00

CPC classification number: H01L27/14685 ,  H01L27/14605 ,  H01L27/14627

Abstract: A method for fabricating an image sensor device is disclosed. A substrate having a sensing area comprising a pixel array therein is provided. A photoresist layer is coated over the substrate. Exposure is performed on at least two regions of the photoresist layer by at least two binary half-tone masks, respectively, in which a first and second binary half-tone masks of the two binary half-tone masks have different optical transparency distributions. Development is performed on the exposed photoresist layer to form a convex microlens array corresponding to the pixel array of the sensing area and comprising at least two microlenses with different convex profiles.

Abstract translation: 公开了一种用于制造图像传感器装置的方法。 提供具有包括其中的像素阵列的感测区域的衬底。 光致抗蚀剂层涂覆在基材上。 分别通过至少两个二进制半色调掩模在光致抗蚀剂层的至少两个区域上进行曝光，其中两个二进制半色调蒙版的第一和第二二进制半色调蒙版具有不同的光学透明度分布。 在暴露的光致抗蚀剂层上进行显影以形成对应于感测区域的像素阵列的凸形微透镜阵列，并且包括具有不同凸形轮廓的至少两个微透镜。

公开(公告)号：US20090261439A1

公开(公告)日：2009-10-22

申请号：US12104941

申请日：2008-04-17

Applicant: Wu-Chieh Liu ,  Chin-Poh Pang ,  Chi-Xiang Tseng ,  Cheng-Lin Yang

Inventor： Wu-Chieh Liu ,  Chin-Poh Pang ,  Chi-Xiang Tseng ,  Cheng-Lin Yang

IPC: H01L31/00

CPC classification number: G02B3/0056 ,  G02B3/0043 ,  G02B27/0025 ,  G02B27/0075 ,  H01L27/14605 ,  H01L27/14627

Abstract: A microlens array is provided, including a base layer with a plurality of first microlenses formed over a first region thereof, wherein the first microlenses are formed with a first height. A plurality of second microlenses are formed over a second region of the base layer, wherein the second region surrounds the first region and the second microlenses are formed with a second height lower than the first height. A plurality of third microlenses are formed over a third region of the base layer, wherein the third region surrounds the second and three regions, and the microlenses are formed with a third height lower than the first and second heights.

Abstract translation: 提供了一种微透镜阵列，其包括在其第一区域上形成有多个第一微透镜的基底层，其中第一微透镜形成有第一高度。 多个第二微透镜形成在基底层的第二区域上，其中第二区域包围第一区域，第二微透镜形成有比第一高度低的第二高度。 多个第三微透镜形成在基底层的第三区域上，其中第三区域围绕第二和三个区域，并且微透镜形成有比第一和第二高度低的第三高度。

公开(公告)号：US07601955B2

公开(公告)日：2009-10-13

申请号：US11896622

申请日：2007-09-04

Applicant: Yang-Kuao Kuo ,  Kuo-Hsing Teng

Inventor： Yang-Kuao Kuo ,  Kuo-Hsing Teng

IPC: G01N7/00

CPC classification number: H01J37/28 ,  H01J37/09 ,  H01J2237/045

Abstract: A scanning electron microscope is provided. The scanning electron microscope includes an electron beam source generating a primary electron beam, a condenser lens converging the primary electron beam, a base plate with a diamond film formed on the surface thereof having an aperture for passing of the primary electron beam, and a scanning unit two-dimensionally scanning a specimen with the primary electron beam.

Abstract translation: 提供扫描电子显微镜。 扫描电子显微镜包括产生一次电子束的电子束源，会聚一次电子束的聚光透镜，在其表面上形成有金刚石膜的基板，其具有用于使一次电子束通过的孔，扫描电子显微镜 单元用一次电子束二维扫描样品。

公开(公告)号：US07595631B2

公开(公告)日：2009-09-29

申请号：US11652064

申请日：2007-01-11

Applicant: Sheng-Feng Lu ,  Yu-Kun Hsiao

Inventor： Sheng-Feng Lu ,  Yu-Kun Hsiao

IPC: G01R31/28 ,  G01R31/02 ,  B07C5/344 ,  G01R31/26

CPC classification number: G01R31/2886 ,  G01R31/2834 ,  H01L24/73 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2924/00014

Abstract: A chip test system including a probe card, a chip tray and a cover plate fastened on the chip tray. The chip tray comprises a socket, a chip contact area, an extension contact area, and an alignment contact point. The socket loads the testing chip and is customized for the tested chip. The chip contact area has a plurality of chip contact points to electrically contact the chip. The extension contact area has a plurality of extension contact points corresponding to the chip contact points to direct test signals into the chip and direct feedback signals out of the chip. The alignment point provides an alignment location for the probe card during the chip test.

Abstract translation: 芯片测试系统，包括探针卡，芯片托盘和固定在芯片托盘上的盖板。 芯片托盘包括插座，芯片接触区域，延伸接触区域和对准接触点。 插座加载测试芯片，并为测试芯片定制。 芯片接触区域具有多个芯片接触点以与芯片电接触。 扩展接触区域具有对应于芯片接触点的多个延伸接触点，以将测试信号引导到芯片中并将直接反馈信号引导出芯片。 在芯片测试期间，对准点提供探针卡的对准位置。

公开(公告)号：US07528420B2

公开(公告)日：2009-05-05

申请号：US11752427

申请日：2007-05-23

Applicant: Jui-Peng Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

Inventor： Jui-Peng Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

IPC: H01L29/22 ,  H01L29/227 ,  H01L33/00 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L29/417 ,  H01L29/74 ,  H01L31/111 ,  H01L27/148 ,  H01L29/768 ,  H01L31/0203 ,  H01L31/00

CPC classification number: H01L27/14687 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/10 ,  H01L2924/00014 ,  Y10S257/911 ,  H01L2224/05599

Abstract: Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device includes a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.

Abstract translation: 提供了图像感测装置及其制造方法。 示例性的图像感测装置包括具有相对的第一侧和第二侧的第一基板。 在第一侧的第一基板中形成多个图像感测元件。 通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。 导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。 导电层位于第二侧的导电通孔上，并与导电焊盘电连接。 在导电层的一部分上形成导电凸块。 第二衬底在第一侧与第一衬底结合。