Abstract:
Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.
Abstract:
In a method of manufacturing an offset printing substrate and a method of manufacturing a display substrate, the method includes forming a first coating layer on a base substrate on which is formed a first concave pattern having a first width. An intermediate substrate is also formed upon the first coating layer of the base substrate, the intermediate substrate having a pattern corresponding to the first concave pattern. An offset printing substrate is also formed upon the pattern of the intermediate substrate, the offset printing substrate having a second concave pattern is formed to correspond to the pattern of the intermediate substrate, and the second concave pattern has a second width smaller than the first width.
Abstract:
A dehumidifying element includes a super absorbing polymer (SAP), and a hygroscopic base, thereby maintaining hygroscopic characteristics regardless of aging and a high humidity absorbing rate and needing a smaller amount of energy for regeneration.
Abstract:
A sensible heat exchanging rotor includes a rotor body rotatably mounted between a first channel and a second channel, and a heat storage medium disposed in the rotor body and configured to suck thermal energy from a fluid passing through the first channel, and configured to transfer the sucked thermal energy to a fluid passing through the second channel, wherein the heat storage medium is formed of a polymer material.
Abstract:
There is provided a package substrate allowing for enhanced reliability by improving the structure of a solder bump and a method of fabricating the same. The package substrate includes: a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a post terminal provided on the conductive pad inside the opening; and a solder bump provided on the post terminal and having an angle between a bottom surface and a side surface thereof ranging from 80° to 120°.
Abstract:
Disclosed are a heat exchanger for a dehumidifier using a liquid desiccant and a dehumidifier using a liquid desiccant having the same. The heat exchanger for a dehumidifier using a liquid desiccant, comprises: a plurality of plate-type heat exchanger bodies to which a heat transfer medium flows through flow paths formed therein; and a plurality of plates extending between the respective heat exchanger bodies, and inclined with respect to the surfaces of the heat exchanger bodies.
Abstract:
Disclosed is a dehumidifying cooling device for district heating which comprises; a case having a first partition to divide the interior of the case into a wet channel and a dry channel and a second partition to divided the wet channel into a first wet channel and a second wet channel, a sensible heat exchanger to heat exchange the outside air in the first wet channel with the outside air in the second wet channel, a heating coil for raising the temperature of the outside air in the second wet channel, a rotatable de humidifying wheel for adsorbing and removing moisture contained in the circulated air within the dry channel, and a regenerative-evaporative cooler for cooling the circulated air in the dry channel. With this configuration, the device can carry out an air cooling operation by use of hot water supplied by district heating systems and gas or oil boilers installed in individual households, thereby achieving a reduced device size via the implementation of the cooling operation under the atmospheric pressure state and reducing manufacturing costs by virtue of a simplified system configuration.
Abstract:
Disclosed is a package substrate including a solder resist layer having pattern parts and a method of fabricating the same, in which the pattern parts are formed on the solder resist layer, thus increasing heat dissipation efficiency and minimizing the warpage of the substrate.
Abstract:
Disclosed is a louver fin type heat exchanger positioned upright at a certain angle with respect to the ground, wherein lower end portions of louver fins close to the ground are bent toward lower end portions of adjacent louver fins, such that the air passage at the lower end portion close to the ground has cross-section areas that are wide at certain portions and are narrow at other portions thereof. Accordingly, moisture congregates only at a portion where the cross-section of the air passage is great, so that the external air smoothly passes into or out the heat exchanger through the air passage where the moisture congregation does not occur, minimizing the pressure drop, and efficiency in heat exchange of the heat exchanger can be thusly improved.
Abstract:
A touch display panel may include a display unit and a touch unit. The display unit may include a first base substrate having a plurality of pixel electrodes, a second base substrate including a common electrode disposed on a first face of the second base substrate, and an electro optical layer disposed between the pixel electrodes and the common electrode. The first face faces the first base substrate. The touch unit includes a color filter layer including a plurality of color filters and a first electrode part including first electrodes disposed on a second face of the second base substrate, and a third base substrate including a second electrode part extended along a direction crossing the first electrodes. The first electrodes may be disposed on a boundary area of the color filters having different colors from each other, so that mixing of the colors is prevented.