公开(公告)号：US20100126765A1

公开(公告)日：2010-05-27

申请号：US12569104

申请日：2009-09-29

Applicant: Ki-Hwan KIM ,  Jin-Yong An ,  Jae-Joon Lee

Inventor： Ki-Hwan KIM ,  Jin-Yong An ,  Jae-Joon Lee

IPC: H05K1/11 ,  B32B38/00 ,  B32B38/10 ,  C23F1/00

CPC classification number: H05K3/4007 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/054 ,  Y10T156/1168

Abstract: A method of manufacturing a multi-layer PCB having external contact pads formed on one side can include: forming an outermost insulation layer, in which openings are formed corresponding with the external contact pads; forming a mask, in which openings are formed corresponding with the external contact pad and with a circuit pattern, on the outermost insulation layer; forming the external contact pads and the circuit pattern in the openings of the outermost insulation layer and the openings of the mask; removing the mask; forming a build-up layer by stacking layers over the outermost insulation layer such that the external contact pads and the circuit pattern are covered; forming a first solder resist layer on the build-up layer; and forming a second solder resist layer on an opposite side of the outermost insulation layer; and forming openings in the second solder resist layer such that the external contact pads are exposed.

Abstract translation: 一种制造具有形成在一侧上的外部接触焊盘的多层PCB的方法可以包括：形成最外绝缘层，其中形成对应于外部接触焊盘的开口; 形成掩模，其中在最外绝缘层上形成对应于外部接触焊盘和电路图案的开口; 在外绝缘层的开口和掩模的开口中形成外部接触焊盘和电路图案; 去除面膜; 通过在最外层绝缘层上层叠层来形成堆积层，使得覆盖外部接触焊盘和电路图案; 在积层上形成第一阻焊层; 以及在最外绝缘层的相对侧上形成第二阻焊层; 以及在所述第二阻焊层中形成开口，使得所述外部接触焊盘露出。

公开(公告)号：US20090236125A1

公开(公告)日：2009-09-24

申请号：US12232820

申请日：2008-09-24

Applicant: Ki-Hwan Kim ,  Jong-Kuk Hong ,  Jin-Yong An

Inventor： Ki-Hwan Kim ,  Jong-Kuk Hong ,  Jin-Yong An

IPC: H05K3/06 ,  H05K1/00

CPC classification number: H05K3/4682 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/28 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.

Abstract translation: 公开了制造多层板的方法。 该方法可以包括在载体上形成可分离的分离层; 在所述分离层上形成第一阻焊层; 在第一阻焊层上堆叠金属箔; 在金属箔上形成电路图案; 在所述第一阻焊层上形成绝缘部分，使得所述电路图案被覆盖; 在所述绝缘部分上形成第二阻焊层; 以及通过断开分离层和支撑体从支撑件分离包括第一阻焊层，金属箔，电路图案，绝缘部分和第二阻焊层的电路堆叠单元。 该方法采用简单的方法降低制造成本，缩短制造时间。

公开(公告)号：US20080263860A1

公开(公告)日：2008-10-30

申请号：US12007242

申请日：2008-01-08

Applicant: Jee-Soo Mok ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Yong Kim

Inventor： Jee-Soo Mok ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC: H05K3/02

CPC classification number: H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49171 ,  Y10T29/49176

Abstract: A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.

Abstract translation: 公开了一种具有嵌入式部件的印刷电路板的制造方法。 该方法包括：在基底基板的一侧上形成至少一个接触凸块和至少一个电极凸块; 安装所述部件使得所述电极凸起与所述部件的接触端子相对应; 在所述基底基板的一侧上层叠形成有与所述部件对应的开口的绝缘层，使得所述接触凸块穿过所述绝缘层; 在开口填充填料; 并在绝缘层上层叠金属层。 使用该方法，可以提高部件和电路图案之间的电路连接的可靠性，并且可以减少将部件嵌入印刷电路板中的制造工艺。

公开(公告)号：US20080088396A1

公开(公告)日：2008-04-17

申请号：US11870704

申请日：2007-10-11

Applicant: Kil-Young AHN ,  Hong-Ik YANG ,  Sang-Chul LEE ,  Ki-Hwan KIM

Inventor： Kil-Young AHN ,  Hong-Ik YANG ,  Sang-Chul LEE ,  Ki-Hwan KIM

IPC: H01H9/20

CPC classification number: H01H3/30 ,  H01H3/3015

Abstract: A switching mechanism of an air circuit breaker that allows the overall size of the air circuit breaker to be minimal by making the width of the switching mechanism relatively small. The switching mechanism of the air circuit breaker includes both side plates, a main shaft, a main shaft lever, a first link, a closing spring unit, a charging cam, a rotational shaft of the charging cam, a third link, a driving lever, a spring support pin and an end portion supported by the spring support pin, and a third link elastic bias spring having an end portion supported by the spring support pin and an operation portion for providing elastic force onto one surface of the third link to bias the third link to be rotated in one direction. A third link elastic bias spring directly provides the elastic force onto the third link in order to minimize the distance between a pair of driving levers and thus minimize the width of the switching mechanism.

Abstract translation: 一种空气断路器的切换机构，其通过使开关机构的宽度相对较小而允许空气断路器的整体尺寸最小化。 空气断路器的切换机构包括两个侧板，主轴，主轴杆，第一连杆，闭合弹簧单元，充电凸轮，充电凸轮的旋转轴，第三连杆，驱动杆 ，弹簧支撑销和由弹簧支撑销支撑的端部，以及具有由弹簧支撑销支撑的端部的第三连杆弹性偏置弹簧和用于在第三连杆的一个表面上提供弹性力的操作部分以偏置 第三个链接将沿一个方向旋转。 第三连杆弹性偏置弹簧直接在第三连杆上提供弹性力，以便最小化一对驱动杆之间的距离，从而最小化切换机构的宽度。

公开(公告)号：US20070075873A1

公开(公告)日：2007-04-05

申请号：US11537201

申请日：2006-09-29

Applicant: Chang Soo Yang ,  Jeong Suk Lee ,  Sang Do Cho ,  Kwang Du Lee ,  Wan Chul Yang ,  Kyu Hwan An ,  Jong In Na ,  Ki Hwan Kim ,  Sang Gyu Park ,  Sang Yub Lee

Inventor： Chang Soo Yang ,  Jeong Suk Lee ,  Sang Do Cho ,  Kwang Du Lee ,  Wan Chul Yang ,  Kyu Hwan An ,  Jong In Na ,  Ki Hwan Kim ,  Sang Gyu Park ,  Sang Yub Lee

IPC: G08B5/22

CPC classification number: H04W64/00 ,  G01S5/0081 ,  G01S5/0226 ,  G01S5/14 ,  G01S13/878 ,  G07C5/008 ,  H04W24/00 ,  H04W48/16

Abstract: A location awareness system using RFID and a wireless communication apparatus for the location awareness are provided. The location awareness system includes a RFID tag, a wireless communication apparatus for location awareness, more than three anchors, a coordinator, and a server. The wireless communication apparatus identifies the target object with the RFID attached through communicating with the RFID tag. The anchors receive information about the identified target object and measuring a distance by communication with the wireless communication apparatus using a predetermined wireless communication scheme. The coordinator collects the measure distance and the information from each of the anchors. The server calculates a location of the target object by receiving information about the measured distances and the target objects from the coordinator and calculating the location of the wireless communication apparatus using the received information.

Abstract translation: 提供了使用RFID的位置感知系统和用于位置感知的无线通信装置。 位置感知系统包括RFID标签，用于位置感知的无线通信装置，三个以上的锚点，协调器和服务器。 无线通信装置通过与RFID标签通信来附着RFID来识别目标对象。 锚点通过使用预定的无线通信方案与无线通信装置进行通信来接收关于所识别的目标对象的信息并测量距离。 协调员从每个锚收集测量距离和信息。 服务器通过从协调器接收关于测量距离的信息和目标对象并使用接收到的信息来计算无线通信装置的位置来计算目标对象的位置。

公开(公告)号：US20070059917A1

公开(公告)日：2007-03-15

申请号：US11520729

申请日：2006-09-14

Applicant: Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

Inventor： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC: H01L21/44 ,  H01L21/4763

CPC classification number: H05K3/4664 ,  H05K3/0023 ,  H05K3/1216 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09536 ,  H05K2203/0143 ,  H05K2203/0568

Abstract: A manufacturing method for a printed circuit board having a fine pattern is disclosed, comprising: providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

Abstract translation: 公开了一种具有精细图案的印刷电路板的制造方法，包括：提供载板; 用感光材料涂覆载体板; 在感光材料上形成第一电路图案; 通过干燥印刷在形成有第一电路图案的感光材料之间的空间中的导电浆料形成第一电路层; 在第一电路层上沉积绝缘层; 通过贯穿绝缘层的孔加工; 用感光材料涂覆绝缘层，然后在感光材料中形成第二电路图案; 形成第二电路层，并通过干燥印刷在其中形成第二电路图案的感光材料之间的空间中的导电浆料和通孔来填充通孔; 并移除载体板。

公开(公告)号：USD475198S1

公开(公告)日：2003-06-03

申请号：US29153549

申请日：2002-01-09

Applicant: Ki hwan Kim

Designer： Ki hwan Kim

公开(公告)号：US09357636B2

公开(公告)日：2016-05-31

申请号：US13994448

申请日：2012-03-02

Applicant: Jin Hyong Lim ,  Song Ho Jang ,  Jin Woo Park ,  Ki-Hwan Kim ,  In-Seok Hwang ,  Chung Wan Kim ,  Seung Heon Lee ,  Beom Mo Koo ,  Ji Young Hwang

Inventor： Jin Hyong Lim ,  Song Ho Jang ,  Jin Woo Park ,  Ki-Hwan Kim ,  In-Seok Hwang ,  Chung Wan Kim ,  Seung Heon Lee ,  Beom Mo Koo ,  Ji Young Hwang

IPC: H01L31/18 ,  H01L31/0236 ,  H05K1/09 ,  H05K1/02 ,  G06F3/041 ,  H01B1/08 ,  H05K3/10 ,  H05K7/02 ,  G06F3/044 ,  G06F3/045 ,  H01L31/05 ,  H05K3/16 ,  H05K3/46

CPC classification number: H05K1/0274 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/08 ,  H01L31/02366 ,  H01L31/05 ,  H01L31/18 ,  H02S40/38 ,  H03K17/962 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/10 ,  H05K3/16 ,  H05K3/4644 ,  H05K7/02 ,  H05K2201/0317 ,  Y10T29/49155 ,  Y10T428/24802

Abstract: An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

Abstract translation: 本发明的示例性实施例涉及一种导电结构体，其包括具有AlO x N y的变暗图案层及其制造方法。 根据本发明的示例性实施例的导电结构体可以防止导电图案层的反射而不影响导电图案层的导电性，并且通过改善吸光度来改善导电图案层的隐蔽性。 因此，可以通过使用根据本发明的示例性实施例的导电结构体来开发具有改善的可视性的显示面板。

公开(公告)号：US08634366B2

公开(公告)日：2014-01-21

申请号：US13139717

申请日：2009-11-10

Applicant: Ki Hwan Kim ,  Jae Hoon Chung ,  Yeong Hyeon Kwon

Inventor： Ki Hwan Kim ,  Jae Hoon Chung ,  Yeong Hyeon Kwon

IPC: H04W4/00 ,  H04B7/216 ,  H04J3/24 ,  G08C25/02

CPC classification number: H04L1/0042 ,  H04B7/0426 ,  H04B7/0617 ,  H04L1/0057 ,  H04L1/0067 ,  H04L1/1812 ,  H04L27/2601

Abstract: A method for transmitting a transport block includes segmenting the transport block into code blocks corresponding in number to a multiple of the number of layers to be used for the transmission of the transport block, attaching a Cyclic Redundancy Check (CRC) to the segmented code blocks, sequentially mapping the code blocks to which the CRC has been attached to at least one layer according to a predetermined mapping rule, and transmitting the code blocks.

Abstract translation: 一种用于发送传输块的方法包括：将传输块分割为与要用于传输块的传输的层数的倍数相对应的码块，将循环冗余校验（CRC）附加到分段的码块 根据预定的映射规则顺序地将已经附加了CRC的代码块映射到至少一个层，并且发送代码块。

公开(公告)号：US08586978B2

公开(公告)日：2013-11-19

申请号：US12216529

申请日：2008-07-07

Applicant: Ki-hwan Kim ,  Young-soo Park ,  Bo-soo Kang ,  Myoung-jae Lee ,  Chang-bum Lee

Inventor： Ki-hwan Kim ,  Young-soo Park ,  Bo-soo Kang ,  Myoung-jae Lee ,  Chang-bum Lee

IPC: H01L29/12 ,  H01L21/00

CPC classification number: G11C11/36 ,  G11C11/14 ,  G11C11/5685 ,  G11C13/0007 ,  G11C13/003 ,  G11C13/0069 ,  G11C2013/0073 ,  G11C2013/009 ,  G11C2013/0092 ,  G11C2213/32 ,  G11C2213/71 ,  G11C2213/72 ,  G11C2213/73 ,  G11C2213/76 ,  H01L27/1021

Abstract: Provided are a non-volatile memory device and a cross-point memory array including the same which have a diode characteristic enabling the non-volatile memory device and the cross-point memory array including the same to operate in a simple structure, without requiring a switching device separately formed so as to embody a high density non-volatile memory device. The non-volatile memory device includes a first electrode; a diode-storage node formed on the first electrode; and a second electrode formed on the diode-storage node.