公开(公告)号：US20130049180A1

公开(公告)日：2013-02-28

申请号：US13549517

申请日：2012-07-15

申请人： Nan XU ,  Xingshou PANG ,  Bin TIAN ,  Shufeng ZHAO

发明人： Nan XU ,  Xingshou PANG ,  Bin TIAN ,  Shufeng ZHAO

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49541 ,  H01L21/4828 ,  H01L21/4842 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame for a quad flat no-lead (QFN) type semiconductor device package includes a die pad, a plurality of leads that surround the die pad. The outer edge of leads includes a channel that extends from a lower surface to an upper surface of the leads. A semiconductor die is attached to the die pad. An inner edge of each lead is electrically connected to a corresponding bonding pad on the semiconductor die. The assembly is covered with an encapsulation material except that the outer edge of each lead and the corresponding channel are exposed. The channel allows solder to flow up the outer edge of a lead when the QFN device is soldered to a substrate, which improves the ability to perform visual inspection of the solder-lead connection.

摘要翻译： 用于四边形无引线（QFN）型半导体器件封装的引线框架包括管芯焊盘，围绕管芯焊盘的多个引线。 引线的外缘包括从引线的下表面延伸到上表面的通道。 半导体管芯附接到管芯焊盘。 每个引线的内边缘电连接到半导体管芯上相应的焊盘。 该组件被封装材料覆盖，除了每个引线的外边缘和相应的通道被暴露外。 当QFN器件焊接到衬底时，该通道允许焊料向上流过引线的外边缘，这提高了对焊锡引线连接进行目视检查的能力。

公开(公告)号：US20120238058A1

公开(公告)日：2012-09-20

申请号：US13398816

申请日：2012-02-16

申请人： Junhua LUO ,  Zhigang BAI ,  Nan XU ,  Jinzhong YAO

发明人： Junhua LUO ,  Zhigang BAI ,  Nan XU ,  Jinzhong YAO

IPC分类号： H01L21/50

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of assembling semiconductor devices includes placing an array of semiconductor dies on a die support. A cap array structure is provided that has a corresponding array of caps supported by a cap frame structure. The cap array structure and the array of semiconductor dies on the die support are aligned, with the caps extending over corresponding semiconductor dies, in a mold chase. The array of semiconductor dies and the array of caps are encapsulated with a molding compound in the mold chase. The encapsulated units of the semiconductor dies with the corresponding caps are removed from the mold chase and singulated. Singulating the encapsulated units may include removing the cap frame structure from the encapsulated units.

摘要翻译： 一种组装半导体器件的方法包括将半导体管芯的阵列放置在管芯支撑件上。 提供一种帽阵列结构，其具有由帽框架结构支撑的相应的帽阵列。 在模具追逐中，盖阵列结构和模具支撑件上的半导体管芯阵列与盖延伸在对应的半导体管芯上对齐。 半导体管芯阵列和盖阵列通过模具化合物封装在模具追逐中。 将具有相应盖的半导体管芯的封装单元从模具中取出并分离。 编码封装的单元可以包括从封装单元去除盖框架结构。

公开(公告)号：US08115288B2

公开(公告)日：2012-02-14

申请号：US13021716

申请日：2011-02-05

申请人： Yongsheng Lu ,  Bin Tian ,  Nan Xu ,  Jinzhong Yao ,  Shufeng Zhao

发明人： Yongsheng Lu ,  Bin Tian ,  Nan Xu ,  Jinzhong Yao ,  Shufeng Zhao

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A lead frame for reducing detrimental effects of burr formation includes a lead frame that has leads where a portion of a top surface is removed from a first lead and a portion of a bottom surface is removed from a second lead adjacent to the first lead to reduce spacing between leads while reducing the detrimental effects of burr formation, such as shorting and the like, caused during singulation of a semiconductor device manufactured with the lead frame.

摘要翻译： 用于减少毛刺形成的有害影响的引线框架包括引线框架，其具有引线，其中顶表面的一部分从第一引线移除，并且底表面的一部分从邻近第一引线的第二引线移除以减少 导线之间的间隔，同时减少了由引线框制造的半导体器件的分割期间引起的毛刺形成的不利影响，例如短路等。

公开(公告)号：US08056422B2

公开(公告)日：2011-11-15

申请号：US11814450

申请日：2006-01-11

申请人： Koji Hyodo ,  Chao-Nan Xu

发明人： Koji Hyodo ,  Chao-Nan Xu

IPC分类号： G01L1/24

CPC分类号： A61F2/4657 ,  A61B5/4504 ,  A61B5/4528 ,  A61F2/36 ,  A61F2/3662 ,  A61F2002/3631 ,  A61F2002/4632 ,  A61F2002/4666 ,  G01L1/241 ,  G09B23/30 ,  G09B23/32

摘要： When visualizing the stress distribution of natural bone, synthetic bone, or a member attached to either thereof without omitted points, in order to measure accurately in a variety of modes using an inexpensive system, a mechanoluminescence material thin film 6 is formed in advance on a bone material peripheral surface 5 in an appropriate area thereof including the portion where an insertion support portion 4 of an artificial hip prosthesis 2 is inserted into a hollow inside 3 of a damaged femur 1 or a synthetic bone simulating the damaged femur. The mechanoluminescence material thin film 6 portion is photographed over its entire circumference with an IICCD camera 7 from the external peripheral side thereof as or after the artificial hip prosthesis 2 is inserted. The obtained image is fed to a computer 11 to obtain a luminescence image 8. The computer 11 outputs the intensities of the received light in the form of an image as is, so that the luminescence image 8 can be obtained easily. Particularly, the data about the intensities of the received light can be used as stress/strain data virtually as is. Such method is also suitable for dynamic analysis.

摘要翻译： 当可视化天然骨骼，合成骨骼或附着于其中的部件的应力分布而不省略时，为了使用廉价的系统以各种模式精确地测量，机械发光材料薄膜6预先形成在 骨材料周边表面5在其适当的区域中，包括将人造髋假体2的插入支撑部分4插入损伤股骨1的中空内侧3中的部分或模拟受损股骨的合成骨。 机械发光材料薄膜6部分在其人造髋假体2插入之后或之后，利用来自其外周侧的IICCD照相机7在其整个圆周上进行拍照。 所获得的图像被馈送到计算机11以获得发光图像8.计算机11原样输出图像形式的接收光的强度，使得可以容易地获得发光图像8。 特别地，关于接收光的强度的数据可以被虚拟地用作应力/应变数据。 这种方法也适用于动态分析。

公开(公告)号：US20100045554A1

公开(公告)日：2010-02-25

申请号：US12536422

申请日：2009-08-05

申请人： Nan Xu ,  Wei Huang

发明人： Nan Xu ,  Wei Huang

IPC分类号： H01Q19/06 ,  H01Q1/38

CPC分类号： H01Q15/0086

摘要： Metamaterial antennas provide spatially varying electromagnetic coupling that enables impedance matching conditions for different operating frequencies of the MTM antennas so that such antennas can operate at different frequencies for wideband applications, including ultra wideband applications.

摘要翻译： 超材料天线提供空间变化的电磁耦合，其使能针对MTM天线的不同工作频率的阻抗匹配条件，使得这样的天线可以在包括超宽带应用在内的宽带应用的不同频率下工作。

公开(公告)号：US20090295660A1

公开(公告)日：2009-12-03

申请号：US12465571

申请日：2009-05-13

申请人： Nan Xu ,  Sunil Kumar Rajgopal ,  Norberto Lopez ,  Vaneet Pathak ,  Ajay Gummalla ,  Gregory Poilasne ,  Maha Achour

发明人： Nan Xu ,  Sunil Kumar Rajgopal ,  Norberto Lopez ,  Vaneet Pathak ,  Ajay Gummalla ,  Gregory Poilasne ,  Maha Achour

IPC分类号： H01Q19/06

CPC分类号： H01Q1/243 ,  H01Q9/0407 ,  H01Q15/0086

摘要： Antennas for wireless communications based on metamaterial (MTM) structures to arrange one or more antenna sections of an MTM antenna away from one or more other antenna sections of the same MTM antenna so that the antenna sections of the MTM antenna are spatially distributed in a non-planar configuration to provide a compact structure adapted to fit to an allocated space or volume of a wireless communication device, such as a portable wireless communication device.

摘要翻译： 基于超材料（MTM）结构的用于无线通信的天线，用于将MTM天线的一个或多个天线部分远离同一MTM天线的一个或多个其它天线部分，使得MTM天线的天线部分在空间上分布在非 平面配置以提供适于适配于诸如便携式无线通信设备的无线通信设备的分配的空间或卷的紧凑结构。

公开(公告)号：US20090286076A1

公开(公告)日：2009-11-19

申请号：US11989598

申请日：2006-08-02

申请人： Chao-Nan Xu ,  Yusuke Imai ,  Nao Terasaki ,  Yoshio Adachi ,  Hiroshi Yamada ,  Keiko Nishikubo

发明人： Chao-Nan Xu ,  Yusuke Imai ,  Nao Terasaki ,  Yoshio Adachi ,  Hiroshi Yamada ,  Keiko Nishikubo

IPC分类号： C09K11/08 ,  B32B27/00

CPC分类号： G01L1/247 ,  C09D5/22 ,  C09K11/02 ,  C09K11/7734 ,  G01L1/241 ,  G01M11/081 ,  Y10T428/269

摘要： In one embodiment of the present invention, on the surface of a material to be measured for stress analysis which has a stress-induced luminescent material layer formed thereon, a distortion energy is disclosed which is transmitted from a base material of a stress-induced luminescent material to the stress-induced luminescent material with high efficiency. The material to be measured for stress analysis has, on the surface thereof, a coating film layer, which emits light upon exposure to a change in distortion energy. The coating film layer is formed of a synthetic resin layer containing stress-induced luminescent particles, and the modulus of elasticity of a base material is not less than 1.0 GPa. The thickness of the coating film layer is preferably 1 μm to 500 μm.

摘要翻译： 在本发明的一个实施例中，在其上形成有应力诱导的发光材料层的应力分析材料的表面上，公开了从应力诱导发光材料的基底材料传递的变形能量 材料对应力致发光材料的高效率。 用于应力分析的待测量材料在其表面上具有在暴露于变形能量变化时发光的涂膜层。 涂膜层由含有应力诱发的发光粒子的合成树脂层形成，基材的弹性模量不小于1.0GPa。 涂膜层的厚度优选为1〜500μm。

公开(公告)号：US07509872B2

公开(公告)日：2009-03-31

申请号：US11655219

申请日：2007-01-19

申请人： Koji Hyodo ,  Chao-Nan Xu ,  Takashi Yamane ,  Motoyuki Akamatsu ,  Yoshiyuki Yokogawa ,  Tetsuya Kameyama

发明人： Koji Hyodo ,  Chao-Nan Xu ,  Takashi Yamane ,  Motoyuki Akamatsu ,  Yoshiyuki Yokogawa ,  Tetsuya Kameyama

IPC分类号： G01N3/08

CPC分类号： G01N3/068 ,  G01N3/14 ,  G01N2203/0033

摘要： Provided are a stress analysis method and stress analysis equipment that enable a detailed stress measurement, by using both a photoelasticity measurement method and a stress measurement (mechanoluminescence measurement) which utilizes a mechanoluminescent substance to measure a stress state of an object. Physical quantities that are measurable include individual principal stress component and a principal stress direction. The photoelasticity measurement method alone cannot measure individual principal stress component values.

摘要翻译： 提供一种通过使用利用机械发光物质测量物体的应力状态的光弹性测量方法和应力测量（机械发光测量）来实现详细的应力测量的应力分析方法和应力分析设备。 可测量的物理量包括单个主应力分量和主应力方向。 单独的光弹性测量方法不能测量单个主应力分量值。

公开(公告)号：US20090061202A1

公开(公告)日：2009-03-05

申请号：US11887902

申请日：2006-04-07

申请人： Chao-Nan Xu ,  Hiroshi Yamada

发明人： Chao-Nan Xu ,  Hiroshi Yamada

IPC分类号： B32B3/26

CPC分类号： F21K2/04 ,  C09K11/666 ,  C09K11/667 ,  C09K11/7721 ,  C09K11/7724 ,  C09K11/7738 ,  C09K11/7774 ,  C09K11/7792 ,  Y10T428/249953

摘要： One embodiment of the present invention provides (i) a luminant having a unique crystal structure so as to exhibit high luminosity and (ii) a manufacturing method thereof. Further, the present invention discloses (I) a luminant which exhibits ultraviolet luminescence and (II) a manufacturing method thereof. The inventors developed a stress-stimulated luminescent material which exhibits high luminosity by using a compound having a structure obtained by inserting alkali metal ions and alkali earth metal ions into a base material structure constituted of polyhedral-structure molecules and partially substituting the alkali metal ions and alkali earth metal ions by rare earth metal ions, transition metal ions, group-III metal ions, or group-IV metal ions. Further, the inventors developed a stress-stimulated luminescent material which exhibits high-luminosity stress-stimulated ultraviolet luminescence by adding specific metal ions such as Ce as a luminescent center to the aforementioned stress-stimulated luminescent material.

摘要翻译： 本发明的一个实施方案提供（i）具有独特晶体结构以发挥高亮度的发光体，和（ii）其制造方法。 此外，本发明公开了（I）显示紫外线发光的发光体和（II）其制造方法。 本发明人开发了通过使用具有通过将碱金属离子和碱土金属离子插入到由多面体结构分子构成的基体结构中并且部分取代碱金属离子获得的结构的化合物而显示高亮度的应力激发的发光材料，以及 碱土金属离子，稀土金属离子，过渡金属离子，III族金属离子或Ⅳ族金属离子。 此外，本发明人开发了通过将诸如Ce作为发光中心的特定金属离子添加到上述应力刺激发光材料中而显示出高亮度应力刺激的紫外线发光的应力刺激发光材料。

公开(公告)号：US20090050847A1

公开(公告)日：2009-02-26

申请号：US11887837

申请日：2006-04-06

申请人： Chao-Nan Xu ,  Hiroshi Yamada

发明人： Chao-Nan Xu ,  Hiroshi Yamada

IPC分类号： C09K11/08

CPC分类号： F21K2/04 ,  C09K11/7706 ,  C09K11/7734 ,  C09K11/7774 ,  C09K11/7792

摘要： One embodiment of the present invention is to provide a stress-stimulated luminescent material which has a unique crystal structure and which emits conventionally unachievable intense light. The stress-stimulated luminescent material of one embodiment of the present invention includes a basic structure in which a plurality of tetrahedral molecules each having an AlO4-like tetrahedral structure or an SiO4-like tetrahedral structure share atoms of apexes of the tetrahedral structures so as to be coupled to one another so that a basic material structure is formed and at least either alkali metal ions or alkali earth metal ions are inserted into the void are partially substituted by at least either rare earth metal ions or transition metal ions.

摘要翻译： 本发明的一个实施方案是提供具有独特晶体结构并且发射常规不可实现的强光的应力激发的发光材料。 本发明的一个实施方案的应力刺激发光材料包括其中各自具有AlO 4样四面体结构或SiO 4样四面体结构的多个四面体分子共享四面体结构的顶点的原子的基本结构，从而 彼此耦合，从而形成基本材料结构，并且至少将碱金属离子或碱土金属离子插入到空隙中，部分被至少一种稀土金属离子或过渡金属离子所取代。