公开(公告)号：US20070158833A1

公开(公告)日：2007-07-12

申请号：US11306627

申请日：2006-01-04

Applicant: Soo-San Park ,  Hyeog Kwon ,  Sang-Ho Lee ,  Jong-Woo Ha

Inventor： Soo-San Park ,  Hyeog Kwon ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3128 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.

Abstract translation: 提供了一种集成电路封装系统，其包括在晶片上提供形成有接合焊盘的晶片。 焊料凸块沉积在一个或多个焊盘上。 接合焊盘和焊料凸块嵌入在晶片上形成的模具化合物中。 在模具化合物中形成凹槽以暴露焊料凸块的一部分。 将晶片在凹槽处分成单独的模具结构。

公开(公告)号：US20070153685A1

公开(公告)日：2007-07-05

申请号：US11636784

申请日：2006-12-11

Applicant: Jung-Mo Moon ,  Sang-Ho Lee

Inventor： Jung-Mo Moon ,  Sang-Ho Lee

IPC: H04L12/26 ,  H04Q7/00

CPC classification number: H04W8/26 ,  H04W36/08

Abstract: The present invention relates to a wireless communication system and a service flow identifier method of the system. The wireless communication system includes a plurality of PARs that provides wireless communication services to a plurality of access terminals through a plurality of access points for separate management of service flow identifiers. The PARs include a service flow identifier controller for managing a service flow identifier used for identifying a connection service of each access terminal. The service flow identifier controller manages a service flow identifier generated by a home PAR and a service flow identifier generated by another PAR among service flow identifiers of an access terminal that has performed handoff from the other PAR to the home PAR. The wireless communication system manages service flow identifiers by using a separate control method, thereby preventing interruption of the entire system network operation due to a signal system error.

Abstract translation: 本发明涉及一种系统的无线通信系统和服务流识别方法。 无线通信系统包括多个PAR，其通过多个接入点向多个接入终端提供无线通信服务，用于单独管理业务流标识符。 PAR包括用于管理用于识别每个接入终端的连接服务的服务流标识符的服务流标识符控制器。 服务流标识符控制器管理由家庭PAR产生的服务流标识符和由另一个PAR生成的服务流标识符，该服务流标识符已经执行了从其他PAR到家庭PAR的切换的接入终端的服务流标识符。 无线通信系统通过使用单独的控制方法来管理服务流标识符，从而防止由于信号系统错误而导致的整个系统网络操作的中断。

公开(公告)号：US07220863B2

公开(公告)日：2007-05-22

申请号：US11209919

申请日：2005-08-23

Applicant: Tae-Ho Park ,  Long-Xuan Zhao ,  Sang-Ho Lee

Inventor： Tae-Ho Park ,  Long-Xuan Zhao ,  Sang-Ho Lee

IPC: C07D211/72

CPC classification number: C07D213/73 ,  C07D213/77

Abstract: A method for preparing 2-aminopyridine derivatives, which comprises substituting of fluorine for hydrazine moiety and reducing with hydrogen using 3-substituted-2,5,6-trifluoropyridine as a starting material, provides 2-aminopyridine derivatives having a purity over 98% under a mild reaction condition.

Abstract translation: 制备2-氨基吡啶衍生物的方法，其包括用氟取代肼部分并用3-取代-2,5,6-三氟吡啶作为起始原料用氢还原，得到纯度为98％以上的2-氨基吡啶衍生物， 反应条件温和。

公开(公告)号：US20070015314A1

公开(公告)日：2007-01-18

申请号：US11530841

申请日：2006-09-11

Applicant: Sang Ho Lee ,  Jong Ju ,  Hyeog Kwon

Inventor： Sang Ho Lee ,  Jong Ju ,  Hyeog Kwon

IPC: H01L21/00

CPC classification number: H01L24/48 ,  H01L24/45 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An adhesive/spacer structure (52, 52A, 60) is used to adhere first and second die (14, 18) to one another at a chosen separation in a multiple-die semiconductor chip package (56). The first and second die define a die bonding region (38) therebetween. The adhesive/spacer structure may comprise a plurality of spaced-apart adhesive/spacer islands (52, 52A) securing the first and second die to one another at a chosen separation (53). The adhesive/spacer structure may also secure the first and second die to one another to occupy about 1-50% of the die bonding region.

Abstract translation: 粘合/间隔结构（52,52A，60）用于在多芯片半导体芯片封装（56）中以选定的间隔将第一和第二裸片（14,18）彼此粘合。 第一和第二模具在它们之间限定了芯片接合区域（38）。 粘合剂/间隔物结构可以包括多个间隔开的粘合剂/隔离物岛（52,52A），其以选定的间隔（53）将第一和第二管芯彼此固定。 粘合剂/间隔件结构还可以将第一和第二管芯彼此固定，以占据管芯接合区域的约1-50％。

公开(公告)号：US07146106B2

公开(公告)日：2006-12-05

申请号：US10227051

申请日：2002-08-23

Applicant: Jun Young Yang ,  Sang Ho Lee ,  Chul Woo Park

Inventor： Jun Young Yang ,  Sang Ho Lee ,  Chul Woo Park

IPC: H04B17/00

CPC classification number: G02B6/4239 ,  G02B6/423 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01S5/02248 ,  H01S5/02284 ,  H01L2924/00014

Abstract: An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main board. The package portion includes a base, a laser diode and a photo detector electrically coupled to the board metal patterns of the main board and bonded to the base. An optical fiber is inserted into the aperture of the main board and disposed adjacent the package portion. The position and tilt of the optical fiber may be adjusted to achieve optimum optical coupling between the optical fiber and the laser diode and the optical fiber and the photo detector. The optical fiber is stably attached to the main board by an adhesive.

Abstract translation: 光学半导体封装包括基本上平板状的主板。 主板包括穿过其中的孔和形成在孔周边的多个板金属图案。 封装部分耦合到主板。 封装部分包括基极，激光二极管和光电检测器，电耦合到主板的板金属图案并结合到基板。 将光纤插入到主板的孔中并邻近封装部分设置。 可以调节光纤的位置和倾斜度，以实现光纤和激光二极管以及光纤和光电检测器之间的最佳光耦合。 光纤通过粘合剂稳定地附着在主板上。

公开(公告)号：US20060190940A1

公开(公告)日：2006-08-24

申请号：US11358003

申请日：2006-02-22

Applicant: Kyle Kim ,  In-ho Park ,  Sang-ho Lee

Inventor： Kyle Kim ,  In-ho Park ,  Sang-ho Lee

IPC: G06F9/44

CPC classification number: H04L12/281 ,  H04L12/2803 ,  H04L12/2832

Abstract: A service framework which can control devices to be controlled according to a device/service profile by creating the device/service profile to control a plurality of the controlled devices. Accordingly without using a middleware with a complicated structure, it is possible to control home devices.

公开(公告)号：US06995459B2

公开(公告)日：2006-02-07

申请号：US11063299

申请日：2005-02-22

Applicant: Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

Inventor： Choon Heung Lee ,  Donald C. Foster ,  Jeoung Kyu Choi ,  Wan Jong Kim ,  Kyong Hoon Youn ,  Sang Ho Lee ,  Sun Goo Lee

IPC: H01L23/495

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least two slots formed therein and extending along respective ones of a pair of the peripheral edge segments thereof. The semiconductor package further comprises a plurality of first leads which are segregated into at least two sets disposed within respective ones of the slots included in the die paddle. In addition to the first leads, the semiconductor package includes a plurality of second leads which are also segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the die paddle in spaced relation thereto. Electrically connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of each of the first and second leads. At least portions of the die paddle, the first and second leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the first leads being exposed in a common exterior surface of the package body.

Abstract translation: 根据本发明，提供了一种半导体封装，其包括限定多个外围边缘段的大致平坦的管芯片，并且包括形成在其中的至少两个槽，并沿其一对周边边缘段中的相应的一个延伸。 半导体封装还包括多个第一引线，它们分离成设置在包括在管芯焊盘中的各个槽中的至少两个组。 除了第一引线之外，半导体封装还包括多个第二引线，它们也分隔成至少两组，其间隔开的关系相对于管芯焊盘的至少两个周边边缘段的相应延伸。 电连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到第一和第二引线中的每一个的至少一些。 裸片，第一和第二引线和半导体管芯的至少一部分被封装主体封装，裸片焊盘的底表面和第一引线暴露在封装体的公共外表面中。

公开(公告)号：US20060001852A1

公开(公告)日：2006-01-05

申请号：US11168527

申请日：2005-06-29

Applicant: Sang-Ho Lee ,  Jin-Phil Choi ,  Dong-Hwa Shin ,  Seung-Ki Chae ,  Byong-Cheol Park

Inventor： Sang-Ho Lee ,  Jin-Phil Choi ,  Dong-Hwa Shin ,  Seung-Ki Chae ,  Byong-Cheol Park

IPC: G03B27/42

CPC classification number: G03B27/42 ,  G03F7/70275

Abstract: Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.

Abstract translation: 提供了用于仅使用单个光源在单个曝光设备中曝光多个基板的方法和设备，其中第一基板以一系列步骤或照射曝光，在此期间沿主要光学路径传输的光被引导到 衬底，其中衬底在连续镜头之间重新定位。 第二衬底在一段时间期间被曝光，同时通过改变光路来重新定位第一衬底，以将来自光源的光转移到将暴露第二衬底上的区域的次级光路。 当第一衬底被重新定位时，光的转向被终止，使得光将再次沿着主光路传播，以便暴露第一衬底的主表面上的下一个顺序射击。

公开(公告)号：US06927483B1

公开(公告)日：2005-08-09

申请号：US10383504

申请日：2003-03-07

Applicant: Sun Goo Lee ,  Choon Heung Lee ,  Sang Ho Lee

Inventor： Sun Goo Lee ,  Choon Heung Lee ,  Sang Ho Lee

IPC: H01L23/04 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/85191 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48227

Abstract: A semiconductor package exhibiting efficient placement of semiconductor leads in a micro lead frame design is provided. An integrated circuit die is bonded to the top surfaces of leads, thereby allowing the leads to partially reside under the die. As a result, surface area on the bottom surface of the semiconductor package is recaptured. The die can be further bonded a die paddle if so desired. One or more channels can be cut into the bottom surface of the package in order to separate first and second leads. Such channels allow separate leads to be fabricated from a single lead member which is subsequently cut.

Abstract translation: 提供了一种在微引线框架设计中显示出半导体引线的有效放置的半导体封装。 集成电路管芯结合到引线的顶表面，从而允许引线部分地位于管芯下方。 结果，重新获得半导体封装的底表面上的表面积。 如果需要，模具可以进一步粘合模片。 可以将一个或多个通道切割到包装的底表面中，以分离第一和第二引线。 这样的通道允许单独的引线由随后切割的单个引线构件制造。

公开(公告)号：US20050142439A1

公开(公告)日：2005-06-30

申请号：US11020697

申请日：2004-12-27

Applicant: Sang-Ho Lee ,  Sang-Do Heo

Inventor： Sang-Ho Lee ,  Sang-Do Heo

IPC: H01M2/02 ,  H01M2/06 ,  H01M2/08 ,  H01M2/10 ,  H01M10/38

CPC classification number: H01M2/0275 ,  H01M2/021 ,  H01M2/0217 ,  H01M2/0267 ,  H01M2/0287 ,  H01M2/08 ,  H01M10/425 ,  H01M2200/106

Abstract: The present invention is related to a pouch type lithium secondary battery. The pouch type lithium secondary battery according to the present invention may comprise an electrode assembly including a positive electrode, a separator and a negative electrode, and a pouch having a groove for receiving the electrode assembly and upper and lower portions of which are fused to each other around the groove to form flange-shaped edges. In particular, the edges may be at least partially covered at ends thereof with insulating material. As a result, a short circuit between a metal foil of the pouch and the negative electrode of the battery can be prevented, and corrosion of the battery may be also prevented.

Abstract translation: 本发明涉及袋型锂二次电池。 根据本发明的袋型锂二次电池可以包括包括正电极，隔膜和负电极的电极组件和具有用于容纳电极组件的槽的袋，其上部和下部与每个 其他围绕凹槽形成法兰形边。 特别地，边缘可以在其端部至少部分地用绝缘材料覆盖。 结果，可以防止袋的金属箔与电池的负极之间的短路，并且还可以防止电池的腐蚀。