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41.发明授权公开(公告)号：US11643544B2
公开(公告)日：2023-05-09
申请号：US16133083
申请日：2018-09-17
发明人： Chih-Wei Liao , Ju-Ming Huang , Guan-Syun Tseng
IPC分类号： C08L63/00 , H05K1/03 , C08K5/3492 , C08K3/36 , C08K3/22 , C08K3/28 , C08K5/00 , C08J5/24 , C08K5/42 , C08K5/18
CPC分类号： C08L63/00 , C08J5/244 , C08J5/249 , C08K3/22 , C08K3/28 , C08K3/36 , C08K5/0066 , C08K5/3492 , H05K1/0373 , C08J2363/02 , C08K5/18 , C08K5/42 , C08L2201/02 , C08L2203/20
摘要： A resin composition is provided. The resin composition includes the following constituents:
(A) an epoxy resin;
(B) an amino group-containing hardener; and
(C) a compound of formula (I),
wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).-
公开(公告)号：US11008456B2
公开(公告)日：2021-05-18
申请号：US16447748
申请日：2019-06-20
发明人： Chih-Wei Liao , Guan-Syun Tseng , Chen-Hua Yu
IPC分类号： C08L71/12 , C08K5/00 , C08K3/013 , C08K3/04 , C08K3/36 , H05K1/03 , C08K7/10 , C08K7/20 , C08J5/24 , C08K5/14 , C08L27/18
摘要： A resin composition comprising the following constituents: (A) a polyphenylene ether resin with unsaturated end groups; (B) a constituent with a maleimide structure; (C) a first initiator, which has a first one-minute half-life temperature; and (D) a second initiator, which has a second one-minute half-life temperature, wherein the first one-minute half-life temperature is 20° C. to 50° C. higher than the second one-minute half-life temperature, and the first one-minute half-life temperature is 170° C. to 220° C.
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43.发明授权公开(公告)号：US11001759B2
公开(公告)日：2021-05-11
申请号：US16009627
申请日：2018-06-15
IPC分类号： C09K21/12 , C08K5/5399 , C08K5/521 , C08K5/5313 , C08K3/36 , C08J3/24 , C08J5/24 , H05K1/03 , H05K3/02 , B32B5/02 , C08K5/523
摘要： A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.
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公开(公告)号：US20200377676A1
公开(公告)日：2020-12-03
申请号：US16575810
申请日：2019-09-19
发明人： Shur-Fen LIU , Chin-Hsien HUNG
摘要： A resin composition and uses of the same are provided. The resin composition includes the following components:(A) a cross-linking agent of the following formula (I): (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, R1 in formula (I) is a C6 to C16 alkyl or a C6 to C16 alkenyl, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.
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公开(公告)号：US20200291228A1
公开(公告)日：2020-09-17
申请号：US16447748
申请日：2019-06-20
发明人： Chih-Wei LIAO , Guan-Syun TSENG , Chen-Hua YU
IPC分类号： C08L71/12 , C08K5/00 , C08K3/013 , C08K3/04 , C08K3/36 , C08K5/14 , H05K1/03 , C08K7/10 , C08K7/20 , C08J5/24
摘要： A resin composition comprising the following constituents: (A) a polyphenylene ether resin with unsaturated end groups; (B) a constituent with a maleimide structure; (C) a first initiator, which has a first one-minute half-life temperature; and (D) a second initiator, which has a second one-minute half-life temperature, wherein the first one-minute half-life temperature is 20° C. to 50° C. higher than the second one-minute half-life temperature, and the first one-minute half-life temperature is 170° C. to 220° C.
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公开(公告)号：US20200172786A1
公开(公告)日：2020-06-04
申请号：US16359825
申请日：2019-03-20
发明人： Chih-Wei LIAO , Chen-Hua YU
IPC分类号： C09K5/14 , C08J5/24 , C08J5/08 , H05K1/02 , H05K3/02 , H05K1/03 , B32B5/02 , B32B15/092 , B32B15/20
摘要： A high thermal conductivity prepreg is provided. The high thermal conductivity prepreg includes a high thermal conductivity reinforcing material and a dielectric material layer formed on the surface of the high thermal conductivity reinforcing material, wherein the high thermal conductivity reinforcing material is prepared by a process which includes the following steps: (a) providing a precursor aqueous solution, the precursor aqueous solution includes a precursor selected from the group of organic salts, inorganic salts, and combinations thereof; (b) subjecting the precursor aqueous solution to a hydrolysis reaction to form an intermediate product aqueous solution; (c) subjecting the intermediate product aqueous solution to a condensation polymerization reaction to form a pretreatment solution; (d) impregnating a reinforcing material with the pretreatment solution; and (e) oven-drying the impregnated reinforcing material to obtain the high thermal conductivity reinforcing material.
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47.发明申请公开(公告)号：US20190203123A1
公开(公告)日：2019-07-04
申请号：US16009627
申请日：2018-06-15
IPC分类号： C09K21/12 , C08K5/5399 , C08K5/521 , C08K5/5313 , C08K3/36 , C08J3/24 , C08J5/24 , H05K1/03 , H05K3/02 , B32B5/02
CPC分类号： C09K21/12 , B32B5/02 , B32B2250/02 , B32B2260/00 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/536 , B32B2457/08 , C08J3/24 , C08J5/24 , C08J2363/00 , C08K3/36 , C08K5/521 , C08K5/5313 , C08K5/5399 , C08K2201/014 , H05K1/0373 , H05K3/022 , H05K2201/012
摘要： A resin composition is provided. The resin composition comprises the following constituents:(A) an epoxy resin, which has at least two epoxy functional groups per molecule;(B) a reactive flame retardant with (a DOPO functional group) in structure; and(C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.
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48.发明申请公开(公告)号：US20190071548A1
公开(公告)日：2019-03-07
申请号：US15859829
申请日：2018-01-02
发明人： CHIH-WEI LIAO , Hsien-TE CHEN , TSUNG-HSIEN LIN , JU-MING HUANG
摘要： A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.
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公开(公告)号：US10196502B2
公开(公告)日：2019-02-05
申请号：US15174270
申请日：2016-06-06
发明人： Shur-Fen Liu , Meng-Huei Chen
IPC分类号： C08K5/5399 , C08K3/36 , C08K13/02 , C08K3/00 , C08K5/00 , C08K5/14 , C08K5/3492 , B32B15/04 , B32B27/04 , B32B15/08 , B32B27/06 , B32B33/00 , H05K1/03 , C08J5/24 , C08L25/10 , C08L47/00 , C08L53/02 , C08L71/12 , C08L85/02 , C08J5/10 , C08K3/016 , B32B5/26 , B32B7/04 , B32B15/12 , B32B15/14 , B32B15/20
摘要： A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.004 at 10 GHz; and (b) an alkenyl phenoxy phosphazene component, wherein the amount of the component (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the component (b).
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公开(公告)号：US20180339493A1
公开(公告)日：2018-11-29
申请号：US15812243
申请日：2017-11-14
发明人： Wen-Ren Chen , Shur-Fen Liu
摘要： A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.
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