公开(公告)号：US20130189447A1

公开(公告)日：2013-07-25

申请号：US13583755

申请日：2011-03-08

申请人： Bert Braune ,  Christina Keith ,  Ivan Galesic

发明人： Bert Braune ,  Christina Keith ,  Ivan Galesic

IPC分类号： B05D1/00

CPC分类号： B05D1/60 ,  B05D1/62 ,  B05D3/142 ,  H01L51/5253

摘要： A method of producing a parylene coating on at least one surface of at least one component includes providing a first gas containing parylene monomers and depositing the parylene monomers on the at least one surface of the component by supplying the first gas containing the parylene monomers by a first nozzle to the at least one surface, wherein the component is disposed in an environment at atmospheric pressure.

摘要翻译： 在至少一种组分的至少一个表面上生产聚对二甲苯涂层的方法包括提供含有聚对二甲苯单体的第一气体，并通过将含有聚对二甲苯单体的第一气体通过 第一喷嘴到所述至少一个表面，其中所述部件设置在大气压的环境中。

公开(公告)号：US08368101B2

公开(公告)日：2013-02-05

申请号：US12523487

申请日：2008-01-23

申请人： Bert Braune ,  Gertrud Kraeuter

发明人： Bert Braune ,  Gertrud Kraeuter

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/507 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： An arrangement and a method for producing such an arrangement serve for generating mixed light. In this case, a semiconductor chip that emits an electromagnetic primary radiation has a luminescence conversion element in the beam path of the primary radiation. Furthermore, the arrangement includes a connecting element and a carrier element, wherein the carrier element carries and shapes the luminescence conversion element and the connecting element.

摘要翻译： 用于制造这种布置的布置和方法用于产生混合光。 在这种情况下，发射电磁一次辐射的半导体芯片在一次辐射的光束路径中具有发光转换元件。 此外，该装置包括连接元件和载体元件，其中载体元件承载和成形发光转换元件和连接元件。

公开(公告)号：US07824941B2

公开(公告)日：2010-11-02

申请号：US12421814

申请日：2009-04-10

申请人： Bert Braune ,  Herbert Brunner

发明人： Bert Braune ,  Herbert Brunner

IPC分类号： H01L21/56

CPC分类号： H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

摘要： The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to whose surface a luminescence conversion material is applied in the form of a thin layer. Prior to coating, the front-side electrical contact is raised by the application of an electrically conductive material to the electrical contact surface. The method enables specific color coordinates to be adjusted selectively by monitoring the color coordinates (IEC chromaticity diagram) and thinning the layer of luminescence conversion material. In addition, the method is suited in particular for simultaneously producing a plurality of LED light sources from a multiplicity of similar chips in a wafer composite.

摘要翻译： 本发明描述了一种用于制造发光二极管（LED）光源的方法，特别地包括混合彩色LED，其中由芯片发射的初级辐射的至少一部分通过发光转换而变换。 所述芯片包括前表面（即面向辐射方向的一侧）电接触，其表面以薄层的形式施加发光转换材料。 在涂覆之前，通过将导电材料施加到电接触表面来提高前侧电接触。 该方法通过监视颜色坐标（IEC色度图）和稀释发光转换材料层来选择性地调整特定的颜色坐标。 此外，该方法特别适用于从晶片复合材料中的多个类似的芯片同时制造多个LED光源。

公开(公告)号：US07678293B2

公开(公告)日：2010-03-16

申请号：US10544497

申请日：2004-02-20

申请人： Bert Braune ,  Torsten Fries ,  Rainer Schirmer ,  Martin Zachau ,  Franz Zwaschka

发明人： Bert Braune ,  Torsten Fries ,  Rainer Schirmer ,  Martin Zachau ,  Franz Zwaschka

IPC分类号： B32B1/00 ,  H05B33/00 ,  C09K11/08

CPC分类号： C09K11/7734 ,  C09K11/02 ,  H01L33/502 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  Y10S428/917 ,  Y10T428/2991 ,  H01L2924/00014 ,  H01L2924/00

摘要： A coated phosphor, formed by a powder of individual grains of a phosphor as base material, the grains being coated with a coating material. The layer comprises a plurality of individual layers and is particulate in form, the individual primary particles of the layer being at least 5 nm in size. The mean layer thickness is at least 20 nm.

摘要翻译： 由磷光体的单个颗粒的粉末作为基材形成的涂覆的荧光体，所述颗粒被涂覆材料涂覆。 该层包括多个单独的层，并且是颗粒形式，该层的单个初级颗粒的尺寸为至少5nm。 平均层厚度为至少20nm。

公开(公告)号：US20090212316A1

公开(公告)日：2009-08-27

申请号：US11991230

申请日：2006-08-24

申请人： Bert Braune ,  Herbert Brunner ,  Thomas Höfer ,  Harald Jäger ,  Raimund Schwarz

发明人： Bert Braune ,  Herbert Brunner ,  Thomas Höfer ,  Harald Jäger ,  Raimund Schwarz

IPC分类号： H01L33/00 ,  H01L31/0203 ,  H01L21/56

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/8592 ,  H01L2924/01055 ,  H01L2924/01065 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A surface-mounted component, comprising an optoelectronic semiconductor chip, a molded body integrally molded onto the semiconductor chip, a mounting area formed at least in places by a surface of the molded body, at least one connection location and side areas of the component which are produced by means of singulation.

摘要翻译： 一种表面安装部件，包括光电子半导体芯片，一体地模制在半导体芯片上的模制体，至少在模制体的表面的至少一部分形成的安装区域，该部件的至少一个连接位置和侧面区域 是通过分割生成的。

公开(公告)号：US20090026474A1

公开(公告)日：2009-01-29

申请号：US12067834

申请日：2006-09-08

申请人： Simon Blumel ,  Bert Braune

发明人： Simon Blumel ,  Bert Braune

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

摘要： A radiation-emitting component comprises an optical element and a housing body that has a fastening device that engages with or wraps around the optical element, wherein the fastening device is bent or is provided with projections in such a way that the optical element is irreversibly fixed on the housing body.

摘要翻译： 辐射发射部件包括光学元件和壳体，其具有与光学元件接合或缠绕的紧固装置，其中紧固装置弯曲或设置有突起，使得光学元件不可逆地固定 在房屋体上。

公开(公告)号：US07429758B2

公开(公告)日：2008-09-30

申请号：US11141721

申请日：2005-05-31

申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

摘要翻译： 一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。 为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。 这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物 由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

公开(公告)号：US07345413B2

公开(公告)日：2008-03-18

申请号：US10774626

申请日：2004-02-09

申请人： Bert Braune ,  Martin Zachau ,  Franz Zwaschka

发明人： Bert Braune ,  Martin Zachau ,  Franz Zwaschka

IPC分类号： C09K11/02 ,  H05B33/14

CPC分类号： C09K11/7734 ,  C09K11/025 ,  H01L33/502 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A coated luminescent material having a luminescent material powder formed by grains, the luminescent grains being coated, and the coating being at most 5 nm, preferably at most 2 nm.

摘要翻译： 具有由晶粒形成的发光材料粉末的被覆发光材料，所述发光粒子被涂布，所述涂层为5nm以下，优选为2nm以下。

公开(公告)号：US20060022215A1

公开(公告)日：2006-02-02

申请号：US11179028

申请日：2005-07-18

申请人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Gunter Waitl

发明人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Gunter Waitl

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.

摘要翻译： 公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有 对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。 凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得 在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面 所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。 还公开了相应的壳体基体。

公开(公告)号：US20050218531A1

公开(公告)日：2005-10-06

申请号：US11141721

申请日：2005-05-31

申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  George Bogner

发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  George Bogner

IPC分类号： H01L23/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/60 ,  H01L23/29

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.