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公开(公告)号：US20200039872A1
公开(公告)日：2020-02-06
申请号：US15739321
申请日：2016-06-22
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Robert George Manley , Prantik Mazumder
Abstract: An article includes a carrier including a carrier bonding surface, a sheet including a sheet bonding surface, and a surface modification layer disposed on at least one of the carrier bonding surface and the sheet bonding surface. The surface modification layer includes a plasma polymerized material. The plasma polymerized material planarizes the at least one of the carrier bonding surface and the sheet bonding surface. The carrier bonding surface and the sheet bonding surface are bonded with the surface modification layer so that the carrier is temporarily bonded with the sheet. A method of making an article includes depositing a surface modification layer on at least one of a carrier bonding surface and a sheet bonding surface. The method further includes bonding the carrier bonding surface and the sheet bonding surface with the surface modification layer to temporarily bond the carrier with the sheet.
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公开(公告)号：US20190312067A1
公开(公告)日：2019-10-10
申请号：US15972628
申请日：2018-05-07
Applicant: CORNING INCORPORATED
Inventor： Sean Matthew Garner , Daniel Wayne Levesque, JR. , Robert George Manley , Garrett Andrew Piech , Rajesh Vaddi , Heather Nicole Vanselous
Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.
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公开(公告)号：US20180297324A1
公开(公告)日：2018-10-18
申请号：US15921034
申请日：2018-03-14
Applicant: Corning Incorporated
Inventor： Kaveh Adib , Robert Alan Bellman , Dana Craig Bookbinder , Theresa Chang , Shiwen Liu , Robert George Manley , Prantik Mazumder
Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.
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公开(公告)号：US10017849B2
公开(公告)日：2018-07-10
申请号：US13840752
申请日：2013-03-15
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Ta-Ko Chuang , Robert George Manley , Mark Alejandro Quesada , Paul Arthur Sachenik
CPC classification number: C23C14/34 , C23C14/10 , C23C14/35 , C23C14/541
Abstract: A method of forming a hermetic barrier layer comprises sputtering a thin film from a sputtering target, wherein the sputtering target includes a sputtering material such as a low Tg glass, a precursor of a low Tg glass, or an oxide of copper or tin. During the sputtering, the formation of defects in the barrier layer are constrained to within a narrow range and the sputtering material is maintained at a temperature of less than 200° C.
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公开(公告)号：US09970101B2
公开(公告)日：2018-05-15
申请号：US15332562
申请日：2016-10-24
Applicant: Corning Incorporated
Inventor： Xinyuan Liu , Robert George Manley , Robert Michael Morena , Zhen Song
IPC: H01L29/16 , C01B31/04 , C23C16/26 , C03C17/22 , C04B41/85 , C23C16/02 , C23C16/44 , C01B32/182 , C01B32/186
CPC classification number: C23C16/26 , C01B32/182 , C01B32/186 , C03C17/22 , C03C2217/28 , C03C2218/152 , C04B41/85 , C23C16/0227 , C23C16/44 , Y10T428/24975 , Y10T428/25 , Y10T428/265 , Y10T428/30
Abstract: A catalyst-free CVD method for forming graphene. The method involves placing a substrate within a reaction chamber, heating the substrate to a temperature between 600° C. and 1100° C., and introducing a carbon precursor into the chamber to form a graphene layer on a surface of the substrate. The method does not use plasma or a metal catalyst to form the graphene.
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Patent Agency Ranking
公开(公告)号：US09586858B2
公开(公告)日：2017-03-07
申请号：US14053139
申请日：2013-10-14
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Shandon Dee Hart , Robert George Manley , Prantik Mazumder , Charles Andrew Paulson , Chandan Kumar Saha
CPC classification number: C03C17/34 , C03C17/3417 , C03C17/3435 , C03C17/36 , C03C17/38 , C03C17/42 , C03C21/002 , C03C2217/425 , C03C2217/948 , G06F3/03 , Y10T428/24851 , Y10T428/24926 , Y10T428/2495 , Y10T428/24975 , Y10T428/24983 , Y10T428/24996 , Y10T428/24999
Abstract: One or more aspects of the disclosure pertain to an article including a film disposed on a glass substrate, which may be strengthened, where the interface between the film and the glass substrate is modified, such that the article has an improved average flexural strength, and the film retains key functional properties for its application. Some key functional properties of the film include optical, electrical and/or mechanical properties. In one or more embodiments, interface exhibits the effective adhesion energy is about less than about 4 J/m2. In some embodiments, the interface is modified by the inclusion of a crack mitigating layer between the glass substrate and the film.
Abstract translation: 本公开的一个或多个方面涉及一种包括设置在玻璃基板上的膜的制品，其可以被加强，其中膜和玻璃基板之间的界面被改性，使得制品具有改善的平均弯曲强度，以及 该片保留了其应用的关键功能特性。 膜的一些关键功能特性包括光学，电学和/或机械性质。 在一个或多个实施方案中，界面表现出约小于约4J / m 2的有效粘附能。 在一些实施方案中，通过在玻璃基底和膜之间包含裂纹缓解层来修饰界面。
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47.发明申请公开(公告)号：US20170036419A1
公开(公告)日：2017-02-09
申请号：US15122366
申请日：2015-01-26
Applicant: CORNING INCORPORATED
Inventor： Kaveh Adib , Robert Alan Bellman , Dana Craig Bookbinder , Theresa Chang , Shiwen Liu , Robert George Manley , Pantik Mazumder
CPC classification number: B32B7/06 , B32B7/02 , B32B17/06 , B32B17/064 , B32B37/26 , B32B2315/08 , B32B2457/20 , B32B2457/206 , C03C17/22 , C03C23/006 , C03C27/06 , C03C27/10 , C03C2217/28 , C03C2217/77 , C03C2218/153
Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.
Abstract translation: 一种将具有薄片接合面的薄片与具有载体接合面的载体可控地接合的方法，通过在至少一个薄片接合面和载体接合面上沉积碳质表面改性层，将极性基团与 表面改性层，然后经由表面改性层将薄片接合表面粘合到载体接合表面。 表面改性层可以包括具有第一极性基团浓度的块状碳层和具有第二极性基团浓度的表面层，其中第二极性基团浓度高于第一极性基团浓度。 表面改性层沉积及其处理可以通过等离子体聚合技术进行。
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48.发明申请公开(公告)号：US20140220327A1
公开(公告)日：2014-08-07
申请号：US14248868
申请日：2014-04-09
Applicant: CORNING INCORPORATED
Inventor： Kaveh Adib , Robert Alan Bellman , Shandon Dee Hart , Guangli Hu , Robert George Manley , Prantik Mazumder , Chandan Kumar Saha
IPC: C03C17/34
CPC classification number: C03C17/3452 , B32B17/064 , C03C3/083 , C03C15/00 , C03C17/22 , C03C17/245 , C03C17/3417 , C03C17/3435 , C03C17/36 , C03C17/3607 , C03C17/3621 , C03C21/002 , C03C23/0055 , C03C2217/213 , C03C2217/214 , C03C2217/241 , C03C2217/425 , C03C2217/78 , C03C2217/948 , C03C2218/153 , C03C2218/17 , C03C2218/31 , C03C2218/32 , G06F3/041 , Y10T428/24983
Abstract: One or more aspects of the disclosure pertain to an article including a film disposed on a glass substrate, which may be strengthened, where the interface between the film and the glass substrate is modified, such that the article has an improved average flexural strength, and the film retains key functional properties for its application. Some key functional properties of the film include optical, electrical and/or mechanical properties. In one or more embodiments, the interface exhibits an effective adhesion energy of about less than about 4 J/m2. In some embodiments, the interface is modified by the inclusion of a crack mitigating layer containing an inorganic material between the glass substrate and the film.
Abstract translation: 本公开的一个或多个方面涉及一种包括设置在玻璃基板上的膜的制品，其可以被加强，其中膜和玻璃基板之间的界面被改性，使得制品具有改善的平均弯曲强度，以及 该片保留了其应用的关键功能特性。 膜的一些关键功能特性包括光学，电学和/或机械性质。 在一个或多个实施方案中，界面表现出约小于约4J / m 2的有效粘附能。 在一些实施方案中，通过在玻璃基底和膜之间包含含有无机材料的裂纹缓解层来修饰界面。
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49.发明申请GLASS ARTICLES AND METHODS FOR CONTROLLED BONDING OF GLASS SHEETS WITH CARRIERS 审中-公开玻璃制品与载体的玻璃板的控制粘合的玻璃制品和方法公开(公告)号：US20140170378A1
公开(公告)日：2014-06-19
申请号：US14047506
申请日：2013-10-07
Applicant: Corning Incorporated
Inventor： Robert Alan Bellman , Dana Craig Bookbinder , Robert George Manley , Prantik Mazumder
CPC classification number: B32B7/12 , B32B7/06 , B32B17/06 , C03C17/002 , C03C27/06 , C09J5/06 , Y10T156/10 , Y10T428/24355 , Y10T428/26 , Y10T428/266 , Y10T428/31544 , Y10T428/31612
Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.
Abstract translation: 可以在片材，载体或两者上提供表面改性层和相关的热处理，以控制薄板和载体之间的室温范德华（和/或氢）键合和高温共价键合。 例如，在真空处理，湿法处理和/或超声波清洗处理中，室温粘合被控制为足以将薄片和载体保持在一起。 同时控制高温共价键，以防止在高温加工过程中薄片和载体之间的永久性结合，并且保持足够的粘结以防止在高温加工过程中的分层。
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50.发明申请公开(公告)号：US20140144772A1
公开(公告)日：2014-05-29
申请号：US13840752
申请日：2013-03-15
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Ta-Ko Chuang , Robert George Manley , Mark Alejandro Quesada , Paul Arthur Sachenik
IPC: C23C14/34
CPC classification number: C23C14/34 , C23C14/10 , C23C14/35 , C23C14/541
Abstract: A method of forming a hermetic barrier layer comprises sputtering a thin film from a sputtering target, wherein the sputtering target includes a sputtering material such as a low Tg glass, a precursor of a low Tg glass, or an oxide of copper or tin. During the sputtering, the formation of defects in the barrier layer are constrained to within a narrow range and the sputtering material is maintained at a temperature of less than 200° C.
Abstract translation: 形成气密性阻挡层的方法包括从溅射靶溅射薄膜，其中溅射靶包括诸如低Tg玻璃，低Tg玻璃的前体或铜或锡的氧化物的溅射材料。 在溅射期间，阻挡层中的缺陷的形成被限制在窄范围内，溅射材料保持在小于200℃的温度。
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