Full spectrum phosphor blends for white light generation with LED chips
    43.
    发明授权
    Full spectrum phosphor blends for white light generation with LED chips 有权
    全光谱荧光粉混合白光发光与LED芯片

    公开(公告)号:US07906790B2

    公开(公告)日:2011-03-15

    申请号:US10580973

    申请日:2004-06-23

    Abstract: A light emitting device including a phosphor blend including four or more phosphors emitting within a specific spectral range to optimize the color rendering index (CRI) for a given color coordinated temperature (CCT). The blend will include at least four phosphors selected from the following: a blue phosphor having an emission peak at 400-500 nm, a green phosphor having an emission peak at 500-575 nm, an orange phosphor having an emission peak from 575-615 nm, and a deep red phosphor having an emission peak at 615-680 nm. The preferred blends are used to make light sources with general CRI values (Ra) greater than 95 at CCT's from about 2500 to 8000 K.

    Abstract translation: 一种发光器件,包括包含在特定光谱范围内发射的四种或更多种磷光体的荧光体掺合物,以优化给定颜色协调温度(CCT)的显色指数(CRI)。 共混物将包括选自以下的至少四种荧光体:在400-500nm具有发光峰的蓝色荧光体,在500-575nm具有发光峰的绿色荧光体,具有575-615的发射峰的橙色荧光体 nm,在615-680nm具有发光峰的深红色荧光体。 优选的共混物用于制备在大约2500至8000K的CCT时具有大于95的一般CRI值(Ra)的光源。

    Light emitting packages and methods of making same
    46.
    发明授权
    Light emitting packages and methods of making same 有权
    发光封装及其制造方法

    公开(公告)号:US07842960B2

    公开(公告)日:2010-11-30

    申请号:US11516533

    申请日:2006-09-06

    Abstract: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).

    Abstract translation: 在发光封装(8)中,至少一个发光芯片(12,14,16,18)由板(10)支撑。 透光密封剂(30)设置在所述至少一个发光芯片之上并且在所述板的覆盖区域(32)之上。 光透射的大致保形的壳体(40)设置在密封剂上方并且具有通过与密封剂的外表面(34)的气隙(G)间隔开并且大体上与其密封的外表面间隔开的内表面(44)。 至少一个磷光体(50)被布置在所述保形壳中或嵌入所述保形壳中,以响应于所述至少一个发光芯片的照射来输出转换的光。 设置在大致保形壳(40)中的导热填充材料有效地将复合壳材料的热导率提高到高于0.3W /(m·K)的值。

    Super bright LED power package
    47.
    发明申请
    Super bright LED power package 审中-公开
    超亮LED电源包

    公开(公告)号:US20070236956A1

    公开(公告)日:2007-10-11

    申请号:US11394895

    申请日:2006-03-31

    CPC classification number: G02B6/0008 F21S41/00 F21Y2115/10 G02B3/00 G02B6/04

    Abstract: At least two light emitting diodes emit a non-parallel light beam. A condensing system, operationally coupled with the light emitting diodes, receives the emitted non-parallel light beam and converts the received non-parallel light beam into a parallel light beam. A non-imaging concentrator includes an input surface which collects the parallel light beam, and an output surface, which includes phosphor material and outputs light.

    Abstract translation: 至少两个发光二极管发射非平行光束。 与发光二极管可操作地耦合的冷凝系统接收所发射的非平行光束并将接收到的非平行光束转换为平行光束。 非成像集中器包括收集平行光束的输入表面和包括磷光体材料并输出光的输出表面。

    Light emitting diode component
    49.
    发明授权
    Light emitting diode component 有权
    发光二极管组件

    公开(公告)号:US07224000B2

    公开(公告)日:2007-05-29

    申请号:US10831862

    申请日:2004-04-26

    Abstract: A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.

    Abstract translation: 发光封装(8,8',8“,208,408)包括支撑至少一个发光管芯(12,12”,“10”)的印刷电路板(10,10',10“,210,410) ,14,16,212,412)。 透光罩(60,60',60“,260,460)设置在所述至少一个发光管芯上。 盖具有限定与印刷电路板连接的盖周长(62,62',62“,262,462)的开口端。 与印刷电路板一起,盖的内表面限定包含至少一个发光管芯的内部容积(70,70“,270,470)。 密封剂(76,76“,276,278,476)设置在内部体积中并且至少覆盖发光管芯。

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